JPS6035547U - lead frame - Google Patents
lead frameInfo
- Publication number
- JPS6035547U JPS6035547U JP12747183U JP12747183U JPS6035547U JP S6035547 U JPS6035547 U JP S6035547U JP 12747183 U JP12747183 U JP 12747183U JP 12747183 U JP12747183 U JP 12747183U JP S6035547 U JPS6035547 U JP S6035547U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- bonding portion
- mold area
- lead
- area excluding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はＤＩＰ形モールドＩＣの断面透視図、第２図は
従来形状のリードフレーム概略図、第３図、第４図は各
々本考案のリードフレーム部分拡大図、第５図は本考案
のリードフレームを使ったモールド形ＩＣの上面透視図
、である。
なお図において、１・・・ＩＣチップ、２・・・リード
フレーム、３・・・共晶ハンダ、４・・・ワイヤリード
、５・・・モールド用絶縁樹脂、Ａ・・・モールド領域
、Ｂ・・・ボンディング部を除いたモールド領域、であ
る。Figure 1 is a cross-sectional perspective view of a DIP molded IC, Figure 2 is a schematic diagram of a conventional lead frame, Figures 3 and 4 are partially enlarged views of the lead frame of the present invention, and Figure 5 is a diagram of the lead frame of the present invention. FIG. 2 is a top perspective view of a molded IC using a lead frame. In the figure, 1... IC chip, 2... Lead frame, 3... Eutectic solder, 4... Wire lead, 5... Insulating resin for mold, A... Mold area, B . . . mold area excluding the bonding portion.
Claims (1)
チップのホンディング部を除いたモールド領域に、複数
個の矩形部あるいは複数個の貫通穴を設けたことを特徴
とするリードフレーム。In lead frames used for molded ICs, IC
A lead frame characterized in that a plurality of rectangular portions or a plurality of through holes are provided in a mold area excluding a chip bonding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12747183U JPS6035547U (en) | 1983-08-18 | 1983-08-18 | lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12747183U JPS6035547U (en) | 1983-08-18 | 1983-08-18 | lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6035547U true JPS6035547U (en) | 1985-03-11 |
Family
ID=30289503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12747183U Pending JPS6035547U (en) | 1983-08-18 | 1983-08-18 | lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6035547U (en) |
-
1983
- 1983-08-18 JP JP12747183U patent/JPS6035547U/en active Pending
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