JPS60144248U - lead frame - Google Patents

lead frame

Info

Publication number
JPS60144248U
JPS60144248U JP3105684U JP3105684U JPS60144248U JP S60144248 U JPS60144248 U JP S60144248U JP 3105684 U JP3105684 U JP 3105684U JP 3105684 U JP3105684 U JP 3105684U JP S60144248 U JPS60144248 U JP S60144248U
Authority
JP
Japan
Prior art keywords
lead frame
end side
abstract
hoop material
longitudinal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3105684U
Other languages
Japanese (ja)
Inventor
家本　芳太郎
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP3105684U priority Critical patent/JPS60144248U/en
Publication of JPS60144248U publication Critical patent/JPS60144248U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のリードフレームの各成形工程を゛示す要
部拡大平面図、第２図は同リードフレームの要部拡大平
面図であり、第３図は本考案に係るリードフレームの一
実施例を示す要部拡大平面図、第４図は同リードフレー
ムの成形工程前の状態であるフープ材を示す要部拡大平
面図である。 １１・・・・・・クレードル部、１６・・・・・・コイ
ニング部、１７・・・・・・フープ材。、Fig. 1 is an enlarged plan view of the main parts showing each molding process of a conventional lead frame, Fig. 2 is an enlarged plan view of the main parts of the same lead frame, and Fig. 3 is an implementation of the lead frame according to the present invention. FIG. 4 is an enlarged plan view of the main part showing an example, and FIG. 4 is an enlarged plan view of the main part showing the hoop material in a state before the molding process of the lead frame. 11... Cradle part, 16... Coining part, 17... Hoop material. ,

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレーム成形工程前のフープ材の状態に於て、リ
ードフレームのクレードル部に相当する一部位の上端側
或いは下端側に長手方向に互って所定間隔をもって複数
のコイニング部を形成したことを特徴とするリードフレ
ーム。In the state of the hoop material before the lead frame forming process, a plurality of coining parts are formed at a predetermined interval in the longitudinal direction on the upper end side or the lower end side of one part corresponding to the cradle part of the lead frame. lead frame.
JP3105684U 1984-03-02 1984-03-02 lead frame Pending JPS60144248U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3105684U JPS60144248U (en) 1984-03-02 1984-03-02 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3105684U JPS60144248U (en) 1984-03-02 1984-03-02 lead frame

Publications (1)

Publication Number Publication Date
JPS60144248U true JPS60144248U (en) 1985-09-25

Family

ID=30531313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3105684U Pending JPS60144248U (en) 1984-03-02 1984-03-02 lead frame

Country Status (1)

Country Link
JP (1) JPS60144248U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313358A (en) * 1976-07-22 1978-02-06 Toshiba Corp Manufacture of lead frame
JPS5313997A (en) * 1976-07-26 1978-02-08 Seiko Epson Corp Paper tape puncher
JPS53139973A (en) * 1977-05-13 1978-12-06 Toshiba Corp Production of lead frame for semiconductor device
JPS57210651A (en) * 1981-06-19 1982-12-24 Toshiba Corp Lead frame and manufacture thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313358A (en) * 1976-07-22 1978-02-06 Toshiba Corp Manufacture of lead frame
JPS5313997A (en) * 1976-07-26 1978-02-08 Seiko Epson Corp Paper tape puncher
JPS53139973A (en) * 1977-05-13 1978-12-06 Toshiba Corp Production of lead frame for semiconductor device
JPS57210651A (en) * 1981-06-19 1982-12-24 Toshiba Corp Lead frame and manufacture thereof

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