JPS57210651A - Lead frame and manufacture thereof - Google Patents

Lead frame and manufacture thereof

Info

Publication number
JPS57210651A
JPS57210651A JP9462281A JP9462281A JPS57210651A JP S57210651 A JPS57210651 A JP S57210651A JP 9462281 A JP9462281 A JP 9462281A JP 9462281 A JP9462281 A JP 9462281A JP S57210651 A JPS57210651 A JP S57210651A
Authority
JP
Japan
Prior art keywords
slipping
lead frame
forming
deformations
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9462281A
Other languages
Japanese (ja)
Other versions
JPS6252951B2 (en
Inventor
Mitsugi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9462281A priority Critical patent/JPS57210651A/en
Publication of JPS57210651A publication Critical patent/JPS57210651A/en
Publication of JPS6252951B2 publication Critical patent/JPS6252951B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To effectively correct the slipping deformation of a lead frame at the punching time by forming a plastically deforming part at the lead of the frame. CONSTITUTION:When a lead frame 11 is punched with a die and a punch from a metal material, projections 14a, 14b are formed at a strip 12 made of superhard alloy to retain the material, thereby forming grooves 15a, 15b at the positions to be formed with slipping deformations of inner leads 13 and forming plastically deforming parts in reverse direction (an arrow c) to a direction of producing the slipping deformations. Since the remaining stress can be removed in this manner, the slipping deformation of the leads can be effectively corrected.
JP9462281A 1981-06-19 1981-06-19 Lead frame and manufacture thereof Granted JPS57210651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9462281A JPS57210651A (en) 1981-06-19 1981-06-19 Lead frame and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9462281A JPS57210651A (en) 1981-06-19 1981-06-19 Lead frame and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS57210651A true JPS57210651A (en) 1982-12-24
JPS6252951B2 JPS6252951B2 (en) 1987-11-07

Family

ID=14115347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9462281A Granted JPS57210651A (en) 1981-06-19 1981-06-19 Lead frame and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57210651A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60144248U (en) * 1984-03-02 1985-09-25 ロ−ム株式会社 lead frame
JPS60189957A (en) * 1984-03-12 1985-09-27 Toshiba Corp Manufacture of semiconductor device
JPS62195164A (en) * 1986-02-21 1987-08-27 Shinko Electric Ind Co Ltd Lead frame
JPS6489551A (en) * 1987-09-30 1989-04-04 Nec Corp Manufacture of lead frame for semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313358A (en) * 1976-07-22 1978-02-06 Toshiba Corp Manufacture of lead frame
JPS53139973A (en) * 1977-05-13 1978-12-06 Toshiba Corp Production of lead frame for semiconductor device
JPS5472963A (en) * 1977-11-24 1979-06-11 Hitachi Ltd Lead frame for semiconductor element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313358A (en) * 1976-07-22 1978-02-06 Toshiba Corp Manufacture of lead frame
JPS53139973A (en) * 1977-05-13 1978-12-06 Toshiba Corp Production of lead frame for semiconductor device
JPS5472963A (en) * 1977-11-24 1979-06-11 Hitachi Ltd Lead frame for semiconductor element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60144248U (en) * 1984-03-02 1985-09-25 ロ−ム株式会社 lead frame
JPS60189957A (en) * 1984-03-12 1985-09-27 Toshiba Corp Manufacture of semiconductor device
JPS62195164A (en) * 1986-02-21 1987-08-27 Shinko Electric Ind Co Ltd Lead frame
JPH0366814B2 (en) * 1986-02-21 1991-10-18 Shinko Elec Ind
JPS6489551A (en) * 1987-09-30 1989-04-04 Nec Corp Manufacture of lead frame for semiconductor device

Also Published As

Publication number Publication date
JPS6252951B2 (en) 1987-11-07

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