JPS5593245A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5593245A
JPS5593245A JP80379A JP80379A JPS5593245A JP S5593245 A JPS5593245 A JP S5593245A JP 80379 A JP80379 A JP 80379A JP 80379 A JP80379 A JP 80379A JP S5593245 A JPS5593245 A JP S5593245A
Authority
JP
Japan
Prior art keywords
lead
frame
tab
constitution
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP80379A
Other languages
Japanese (ja)
Inventor
Makoto Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP80379A priority Critical patent/JPS5593245A/en
Publication of JPS5593245A publication Critical patent/JPS5593245A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain leads of large width nucessary for automatic wire connection, although lead space is narrow, as far as circumstances allow, on a lead frame for LSI equipped with numerous leads. CONSTITUTION:Tab 1, for pellet connection lead 2 connected to each other on its top part 3 surrounding the tab and formed in a terminal lead except for the connection part, and frame 4 are fabricated by pressing a metal sheet. Next, a cut edge is sized up and sheared from the top part 3 by means of punch and die corresponding to the top width of each lead. Then each lead is formed with every other lead slightoy bent, at the middle part 5 of its length, upward on the plane of the frame. Under this constitution, the incidence of short-circuit is reduced during assembly process handling or resin sealing. In addition, it is easy to provide the press die and to maintain thereof.
JP80379A 1979-01-05 1979-01-05 Lead frame Pending JPS5593245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP80379A JPS5593245A (en) 1979-01-05 1979-01-05 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP80379A JPS5593245A (en) 1979-01-05 1979-01-05 Lead frame

Publications (1)

Publication Number Publication Date
JPS5593245A true JPS5593245A (en) 1980-07-15

Family

ID=11483838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP80379A Pending JPS5593245A (en) 1979-01-05 1979-01-05 Lead frame

Country Status (1)

Country Link
JP (1) JPS5593245A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136248A (en) * 1983-12-24 1985-07-19 Toshiba Corp Manufacture of lead frame
JPS61194862A (en) * 1985-02-25 1986-08-29 Shinko Electric Ind Co Ltd Lead frame and manufacture thereof
JPS62115853A (en) * 1985-11-15 1987-05-27 Mitsui Haitetsuku:Kk Manufacture of lead frame
JP2017168703A (en) * 2016-03-17 2017-09-21 東芝メモリ株式会社 Manufacturing method of semiconductor device and semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136248A (en) * 1983-12-24 1985-07-19 Toshiba Corp Manufacture of lead frame
JPS61194862A (en) * 1985-02-25 1986-08-29 Shinko Electric Ind Co Ltd Lead frame and manufacture thereof
JPS62115853A (en) * 1985-11-15 1987-05-27 Mitsui Haitetsuku:Kk Manufacture of lead frame
JP2017168703A (en) * 2016-03-17 2017-09-21 東芝メモリ株式会社 Manufacturing method of semiconductor device and semiconductor device

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