JPS568862A - Manufacture of lead frame for semiconductor device - Google Patents
Manufacture of lead frame for semiconductor deviceInfo
- Publication number
- JPS568862A JPS568862A JP8515479A JP8515479A JPS568862A JP S568862 A JPS568862 A JP S568862A JP 8515479 A JP8515479 A JP 8515479A JP 8515479 A JP8515479 A JP 8515479A JP S568862 A JPS568862 A JP S568862A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- element mounting
- mounting section
- section
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain an enlarged element mounting section by leaving, without punching, the border section of an element mounting section and a lead, by performing a cutting work and by having a raised step between the element mounting section and the lead. CONSTITUTION:The border section (a broken line) between an element mounting section 1' and a lead 2' is left without punching and the other unnecessary sections are cut off by punching. Then, cutting work is given at the broken line, the element mounting section and the lead are separated, a bending or a drawing work is performed to an element mounting section 3 and raised step is formed between the mounting section 1' and the lead 2'. As a result, the punched off section of the lead frame in the method heretofore in use can be efficiently used as a section of an element mounting section can be enlarged and also the position of the lead point can be moved toward the inside still more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8515479A JPS568862A (en) | 1979-07-04 | 1979-07-04 | Manufacture of lead frame for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8515479A JPS568862A (en) | 1979-07-04 | 1979-07-04 | Manufacture of lead frame for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS568862A true JPS568862A (en) | 1981-01-29 |
Family
ID=13850740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8515479A Pending JPS568862A (en) | 1979-07-04 | 1979-07-04 | Manufacture of lead frame for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS568862A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5198883A (en) * | 1988-08-06 | 1993-03-30 | Kabushiki Kaisha Toshiba | Semiconductor device having an improved lead arrangement and method for manufacturing the same |
JP2012028822A (en) * | 2011-11-08 | 2012-02-09 | Hitachi Cable Precision Co Ltd | Lead frame and semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5279774A (en) * | 1975-12-26 | 1977-07-05 | Toshiba Corp | Forming method for lead frame for resin sealing |
-
1979
- 1979-07-04 JP JP8515479A patent/JPS568862A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5279774A (en) * | 1975-12-26 | 1977-07-05 | Toshiba Corp | Forming method for lead frame for resin sealing |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5198883A (en) * | 1988-08-06 | 1993-03-30 | Kabushiki Kaisha Toshiba | Semiconductor device having an improved lead arrangement and method for manufacturing the same |
JP2012028822A (en) * | 2011-11-08 | 2012-02-09 | Hitachi Cable Precision Co Ltd | Lead frame and semiconductor device |
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