JPS545383A - Ultrasonic wire bonding method - Google Patents
Ultrasonic wire bonding methodInfo
- Publication number
- JPS545383A JPS545383A JP6982777A JP6982777A JPS545383A JP S545383 A JPS545383 A JP S545383A JP 6982777 A JP6982777 A JP 6982777A JP 6982777 A JP6982777 A JP 6982777A JP S545383 A JPS545383 A JP S545383A
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- bonding method
- wire
- ultrasonic wire
- scissors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To secure a good wire connection by holding the wire tip portion between by push-up of the scissors or drop-down of the capillary after cutting off the wire with the scissors, bending the wire orthogonally and performing a bonding by applying the ultrasonic vibration and the load to the capillary.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6982777A JPS545383A (en) | 1977-06-15 | 1977-06-15 | Ultrasonic wire bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6982777A JPS545383A (en) | 1977-06-15 | 1977-06-15 | Ultrasonic wire bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS545383A true JPS545383A (en) | 1979-01-16 |
Family
ID=13413973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6982777A Pending JPS545383A (en) | 1977-06-15 | 1977-06-15 | Ultrasonic wire bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS545383A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57149015A (en) * | 1981-03-10 | 1982-09-14 | Sumitomo Metal Ind Ltd | Plate thickness controlling device for tandem mill |
JPS59147704A (en) * | 1982-11-11 | 1984-08-24 | デイビ−・マツキ−(シエフイ−ルド)リミテツド | Control of vertically arranged rolling machine |
US7918378B1 (en) * | 2010-08-06 | 2011-04-05 | National Semiconductor Corporation | Wire bonding deflector for a wire bonder |
-
1977
- 1977-06-15 JP JP6982777A patent/JPS545383A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57149015A (en) * | 1981-03-10 | 1982-09-14 | Sumitomo Metal Ind Ltd | Plate thickness controlling device for tandem mill |
JPS59147704A (en) * | 1982-11-11 | 1984-08-24 | デイビ−・マツキ−(シエフイ−ルド)リミテツド | Control of vertically arranged rolling machine |
US7918378B1 (en) * | 2010-08-06 | 2011-04-05 | National Semiconductor Corporation | Wire bonding deflector for a wire bonder |
US8267303B2 (en) * | 2010-08-06 | 2012-09-18 | National Semiconductor Corporation | Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds |
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