JPS5360572A - Ultrasonic wire bonding device - Google Patents

Ultrasonic wire bonding device

Info

Publication number
JPS5360572A
JPS5360572A JP13517176A JP13517176A JPS5360572A JP S5360572 A JPS5360572 A JP S5360572A JP 13517176 A JP13517176 A JP 13517176A JP 13517176 A JP13517176 A JP 13517176A JP S5360572 A JPS5360572 A JP S5360572A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
ultrasonic wire
automated
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13517176A
Other languages
Japanese (ja)
Other versions
JPS5712532B2 (en
Inventor
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Fujitsu Ltd
Original Assignee
Shinkawa Ltd
Fujitsu Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Fujitsu Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP13517176A priority Critical patent/JPS5360572A/en
Publication of JPS5360572A publication Critical patent/JPS5360572A/en
Publication of JPS5712532B2 publication Critical patent/JPS5712532B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce manpower and achieve the improvement in quality by fully automated ultrasonic bonding operations in which supplying, locating and fixing and delivering-out of semiconductor parts are automated.
COPYRIGHT: (C)1978,JPO&Japio
JP13517176A 1976-11-12 1976-11-12 Ultrasonic wire bonding device Granted JPS5360572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13517176A JPS5360572A (en) 1976-11-12 1976-11-12 Ultrasonic wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13517176A JPS5360572A (en) 1976-11-12 1976-11-12 Ultrasonic wire bonding device

Publications (2)

Publication Number Publication Date
JPS5360572A true JPS5360572A (en) 1978-05-31
JPS5712532B2 JPS5712532B2 (en) 1982-03-11

Family

ID=15145486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13517176A Granted JPS5360572A (en) 1976-11-12 1976-11-12 Ultrasonic wire bonding device

Country Status (1)

Country Link
JP (1) JPS5360572A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53120958U (en) * 1977-03-03 1978-09-26
JPS53144668A (en) * 1977-05-23 1978-12-16 Fujitsu Ltd Locating mechanism
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53120958U (en) * 1977-03-03 1978-09-26
JPS5732588Y2 (en) * 1977-03-03 1982-07-17
JPS53144668A (en) * 1977-05-23 1978-12-16 Fujitsu Ltd Locating mechanism
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus
JPS6117137B2 (en) * 1980-06-16 1986-05-06 Mitsubishi Electric Corp

Also Published As

Publication number Publication date
JPS5712532B2 (en) 1982-03-11

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