JPS53129967A - Stem for transistors - Google Patents
Stem for transistorsInfo
- Publication number
- JPS53129967A JPS53129967A JP4447177A JP4447177A JPS53129967A JP S53129967 A JPS53129967 A JP S53129967A JP 4447177 A JP4447177 A JP 4447177A JP 4447177 A JP4447177 A JP 4447177A JP S53129967 A JPS53129967 A JP S53129967A
- Authority
- JP
- Japan
- Prior art keywords
- stem
- transistors
- insualtor
- interposing
- emitter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To achieve the improvement in the efficiency of ultrasonic wire bonding by bending the ends of emitter and base leads protruding from a metal stem inward to L-form, placing these mutually in proximity and interposing an insualtor between the L-form ends and the top of the stem.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4447177A JPS53129967A (en) | 1977-04-20 | 1977-04-20 | Stem for transistors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4447177A JPS53129967A (en) | 1977-04-20 | 1977-04-20 | Stem for transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53129967A true JPS53129967A (en) | 1978-11-13 |
Family
ID=12692419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4447177A Pending JPS53129967A (en) | 1977-04-20 | 1977-04-20 | Stem for transistors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53129967A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63149538U (en) * | 1987-03-23 | 1988-10-03 |
-
1977
- 1977-04-20 JP JP4447177A patent/JPS53129967A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63149538U (en) * | 1987-03-23 | 1988-10-03 |
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