JPS6475207A - Treatment device for wafer - Google Patents

Treatment device for wafer

Info

Publication number
JPS6475207A
JPS6475207A JP23233187A JP23233187A JPS6475207A JP S6475207 A JPS6475207 A JP S6475207A JP 23233187 A JP23233187 A JP 23233187A JP 23233187 A JP23233187 A JP 23233187A JP S6475207 A JPS6475207 A JP S6475207A
Authority
JP
Japan
Prior art keywords
wafer
cut
state
divided
latticelike
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23233187A
Other languages
Japanese (ja)
Other versions
JP2579498B2 (en
Inventor
Katsunori Yomogida
Yoshiro Furuya
Teruyuki Iwata
Toshimitsu Kosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyushu Fujitsu Electronics Ltd
Fujitsu Ltd
Fujitsu Miyagi Electronics Ltd
Original Assignee
Kyushu Fujitsu Electronics Ltd
Fujitsu Ltd
Fujitsu Miyagi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyushu Fujitsu Electronics Ltd, Fujitsu Ltd, Fujitsu Miyagi Electronics Ltd filed Critical Kyushu Fujitsu Electronics Ltd
Priority to JP23233187A priority Critical patent/JP2579498B2/en
Publication of JPS6475207A publication Critical patent/JPS6475207A/en
Application granted granted Critical
Publication of JP2579498B2 publication Critical patent/JP2579498B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To enable the title device to surely divide a wafer without damaging each semiconductor chip, by a method wherein the wafer is cut and divided into a latticelike state in the direction meeting at right angles with a direction cut and divided previously through a bottom plate further by cutting and divid ing the wafer in the latticelike state through a top plate. CONSTITUTION:A wafer 11 is fixed by placing the same vertically between a top and bottom plates 13a, 13b made of acrylic resin plates which are larger than the wafer and transparent. Then after accurate registration, the wafer is cut and divided into a latticelike state at a width of a chip by making use of an exclusive cutter through the top plate 13a. Although the top plate 13a is cut wholly by leaving an end part of the same uncut, the middle wafer is made a state entirely cut off. The wafer is cut and divided into the latticelike state in the direction meeting at right angles with a direction cut and divided previously through the bottom plate 13b by turning the wafer upside down tender a state where the wafer is fixed further. In case of the bottom plate 13b, the same is also not cut wholly, but an end of the same is left uncut and the middle wafer is made a state entirely cut off. The chips 12 are divided by removing the plate in succession.
JP23233187A 1987-09-18 1987-09-18 Wafer processing equipment Expired - Fee Related JP2579498B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23233187A JP2579498B2 (en) 1987-09-18 1987-09-18 Wafer processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23233187A JP2579498B2 (en) 1987-09-18 1987-09-18 Wafer processing equipment

Publications (2)

Publication Number Publication Date
JPS6475207A true JPS6475207A (en) 1989-03-20
JP2579498B2 JP2579498B2 (en) 1997-02-05

Family

ID=16937524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23233187A Expired - Fee Related JP2579498B2 (en) 1987-09-18 1987-09-18 Wafer processing equipment

Country Status (1)

Country Link
JP (1) JP2579498B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188749A (en) * 1990-11-22 1992-07-07 Fuji Electric Co Ltd Manufacture of semiconductor device
GB2390262A (en) * 2002-06-24 2003-12-31 Motorola Inc Method and apparatus for fault detection in a radio transceiver

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188749A (en) * 1990-11-22 1992-07-07 Fuji Electric Co Ltd Manufacture of semiconductor device
GB2390262A (en) * 2002-06-24 2003-12-31 Motorola Inc Method and apparatus for fault detection in a radio transceiver
GB2390262B (en) * 2002-06-24 2005-11-16 Motorola Inc Method and apparatus for fault detection in a radio transceiver

Also Published As

Publication number Publication date
JP2579498B2 (en) 1997-02-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees