JPS5412563A - Fabricating method of semiconductor crystals - Google Patents

Fabricating method of semiconductor crystals

Info

Publication number
JPS5412563A
JPS5412563A JP7660377A JP7660377A JPS5412563A JP S5412563 A JPS5412563 A JP S5412563A JP 7660377 A JP7660377 A JP 7660377A JP 7660377 A JP7660377 A JP 7660377A JP S5412563 A JPS5412563 A JP S5412563A
Authority
JP
Japan
Prior art keywords
lines
fabricating method
semiconductor crystals
cutting
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7660377A
Other languages
Japanese (ja)
Inventor
Shusuke Kotake
Takeo Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7660377A priority Critical patent/JPS5412563A/en
Publication of JPS5412563A publication Critical patent/JPS5412563A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To obtain pellets whose top edges are cut off by cutting lines of a broad width by using a diamond blade whose end has a triangular section then cutting deeper lines with a thin blade at the time of separating a semiconductor wafer to respective pellets after forming scribe lines thereon.
COPYRIGHT: (C)1979,JPO&Japio
JP7660377A 1977-06-29 1977-06-29 Fabricating method of semiconductor crystals Pending JPS5412563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7660377A JPS5412563A (en) 1977-06-29 1977-06-29 Fabricating method of semiconductor crystals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7660377A JPS5412563A (en) 1977-06-29 1977-06-29 Fabricating method of semiconductor crystals

Publications (1)

Publication Number Publication Date
JPS5412563A true JPS5412563A (en) 1979-01-30

Family

ID=13609894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7660377A Pending JPS5412563A (en) 1977-06-29 1977-06-29 Fabricating method of semiconductor crystals

Country Status (1)

Country Link
JP (1) JPS5412563A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578227U (en) * 1980-06-17 1982-01-16
JPS58182241A (en) * 1982-04-19 1983-10-25 Clarion Co Ltd Cutting method for single crystal wafer
JPS63246208A (en) * 1987-04-01 1988-10-13 住友電気工業株式会社 Dicing method of semiconductor wafer
JPH0574932A (en) * 1991-09-17 1993-03-26 Fujitsu Ltd Dicing method for semiconductor wafer
US5393706A (en) * 1993-01-07 1995-02-28 Texas Instruments Incorporated Integrated partial sawing process
US5786266A (en) * 1994-04-12 1998-07-28 Lsi Logic Corporation Multi cut wafer saw process

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578227U (en) * 1980-06-17 1982-01-16
JPS58182241A (en) * 1982-04-19 1983-10-25 Clarion Co Ltd Cutting method for single crystal wafer
JPS63246208A (en) * 1987-04-01 1988-10-13 住友電気工業株式会社 Dicing method of semiconductor wafer
JPH0574932A (en) * 1991-09-17 1993-03-26 Fujitsu Ltd Dicing method for semiconductor wafer
US5393706A (en) * 1993-01-07 1995-02-28 Texas Instruments Incorporated Integrated partial sawing process
US5786266A (en) * 1994-04-12 1998-07-28 Lsi Logic Corporation Multi cut wafer saw process

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