JPS5412563A - Fabricating method of semiconductor crystals - Google Patents
Fabricating method of semiconductor crystalsInfo
- Publication number
- JPS5412563A JPS5412563A JP7660377A JP7660377A JPS5412563A JP S5412563 A JPS5412563 A JP S5412563A JP 7660377 A JP7660377 A JP 7660377A JP 7660377 A JP7660377 A JP 7660377A JP S5412563 A JPS5412563 A JP S5412563A
- Authority
- JP
- Japan
- Prior art keywords
- lines
- fabricating method
- semiconductor crystals
- cutting
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To obtain pellets whose top edges are cut off by cutting lines of a broad width by using a diamond blade whose end has a triangular section then cutting deeper lines with a thin blade at the time of separating a semiconductor wafer to respective pellets after forming scribe lines thereon.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7660377A JPS5412563A (en) | 1977-06-29 | 1977-06-29 | Fabricating method of semiconductor crystals |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7660377A JPS5412563A (en) | 1977-06-29 | 1977-06-29 | Fabricating method of semiconductor crystals |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5412563A true JPS5412563A (en) | 1979-01-30 |
Family
ID=13609894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7660377A Pending JPS5412563A (en) | 1977-06-29 | 1977-06-29 | Fabricating method of semiconductor crystals |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5412563A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS578227U (en) * | 1980-06-17 | 1982-01-16 | ||
JPS58182241A (en) * | 1982-04-19 | 1983-10-25 | Clarion Co Ltd | Cutting method for single crystal wafer |
JPS63246208A (en) * | 1987-04-01 | 1988-10-13 | 住友電気工業株式会社 | Dicing method of semiconductor wafer |
JPH0574932A (en) * | 1991-09-17 | 1993-03-26 | Fujitsu Ltd | Dicing method for semiconductor wafer |
US5393706A (en) * | 1993-01-07 | 1995-02-28 | Texas Instruments Incorporated | Integrated partial sawing process |
US5786266A (en) * | 1994-04-12 | 1998-07-28 | Lsi Logic Corporation | Multi cut wafer saw process |
-
1977
- 1977-06-29 JP JP7660377A patent/JPS5412563A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS578227U (en) * | 1980-06-17 | 1982-01-16 | ||
JPS58182241A (en) * | 1982-04-19 | 1983-10-25 | Clarion Co Ltd | Cutting method for single crystal wafer |
JPS63246208A (en) * | 1987-04-01 | 1988-10-13 | 住友電気工業株式会社 | Dicing method of semiconductor wafer |
JPH0574932A (en) * | 1991-09-17 | 1993-03-26 | Fujitsu Ltd | Dicing method for semiconductor wafer |
US5393706A (en) * | 1993-01-07 | 1995-02-28 | Texas Instruments Incorporated | Integrated partial sawing process |
US5786266A (en) * | 1994-04-12 | 1998-07-28 | Lsi Logic Corporation | Multi cut wafer saw process |
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