JPS535957A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS535957A
JPS535957A JP8074576A JP8074576A JPS535957A JP S535957 A JPS535957 A JP S535957A JP 8074576 A JP8074576 A JP 8074576A JP 8074576 A JP8074576 A JP 8074576A JP S535957 A JPS535957 A JP S535957A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
diamond cutter
dicing
taper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8074576A
Other languages
Japanese (ja)
Inventor
Kiyohiko Mihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8074576A priority Critical patent/JPS535957A/en
Publication of JPS535957A publication Critical patent/JPS535957A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: The dicing method is made into two stages by the diamond cutter with a taper and by a thin diamond cutter or a laser scriber, thereby improving the dicing yield.
COPYRIGHT: (C)1978,JPO&Japio
JP8074576A 1976-07-06 1976-07-06 Manufacture of semiconductor device Pending JPS535957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8074576A JPS535957A (en) 1976-07-06 1976-07-06 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8074576A JPS535957A (en) 1976-07-06 1976-07-06 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS535957A true JPS535957A (en) 1978-01-19

Family

ID=13726927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8074576A Pending JPS535957A (en) 1976-07-06 1976-07-06 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS535957A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207386A (en) * 1984-03-31 1985-10-18 Toyota Central Res & Dev Lab Inc Cutting method of semiconductor pressure sensor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207386A (en) * 1984-03-31 1985-10-18 Toyota Central Res & Dev Lab Inc Cutting method of semiconductor pressure sensor wafer

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