JPS535957A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS535957A JPS535957A JP8074576A JP8074576A JPS535957A JP S535957 A JPS535957 A JP S535957A JP 8074576 A JP8074576 A JP 8074576A JP 8074576 A JP8074576 A JP 8074576A JP S535957 A JPS535957 A JP S535957A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- diamond cutter
- dicing
- taper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: The dicing method is made into two stages by the diamond cutter with a taper and by a thin diamond cutter or a laser scriber, thereby improving the dicing yield.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8074576A JPS535957A (en) | 1976-07-06 | 1976-07-06 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8074576A JPS535957A (en) | 1976-07-06 | 1976-07-06 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS535957A true JPS535957A (en) | 1978-01-19 |
Family
ID=13726927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8074576A Pending JPS535957A (en) | 1976-07-06 | 1976-07-06 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS535957A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60207386A (en) * | 1984-03-31 | 1985-10-18 | Toyota Central Res & Dev Lab Inc | Cutting method of semiconductor pressure sensor wafer |
-
1976
- 1976-07-06 JP JP8074576A patent/JPS535957A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60207386A (en) * | 1984-03-31 | 1985-10-18 | Toyota Central Res & Dev Lab Inc | Cutting method of semiconductor pressure sensor wafer |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS52101786A (en) | Throw away chip | |
JPS5333050A (en) | Production of semiconductor element | |
JPS5362489A (en) | Production of semiconductor laser | |
JPS535957A (en) | Manufacture of semiconductor device | |
JPS5270781A (en) | Manufacture of semiconductor laser crystal piece | |
JPS542060A (en) | Semiconductor wafer | |
JPS53123657A (en) | Production of semiconductor unit | |
JPS52127179A (en) | Manufacturing method of semiconductor device | |
JPS51118187A (en) | Method of cutting brittle materials | |
JPS53142877A (en) | Manufacture for compound semiconductor device | |
JPS51140199A (en) | Crystal working process | |
JPS5386158A (en) | Production of semiconductor device | |
JPS52147070A (en) | Laser scriber | |
JPS52127750A (en) | Production of semiconductor unit | |
JPS5346222A (en) | Solid state pick up unit | |
JPS5290281A (en) | Semiconductor laser device | |
JPS5346270A (en) | Production of semiconductor device | |
JPS5276872A (en) | Cutting method of semiconductor wafer | |
JPS51146194A (en) | Diode device fabrication method | |
JPS5432067A (en) | Semiconductor device and its manufacture | |
JPS5349949A (en) | Pellet bonding method | |
JPS535973A (en) | Preparation of semiconductor device | |
JPS5362462A (en) | Production of semiconductor divice | |
JPS51112279A (en) | Semiconductor device | |
JPS5368070A (en) | Etching method |