JPS5386158A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5386158A
JPS5386158A JP98877A JP98877A JPS5386158A JP S5386158 A JPS5386158 A JP S5386158A JP 98877 A JP98877 A JP 98877A JP 98877 A JP98877 A JP 98877A JP S5386158 A JPS5386158 A JP S5386158A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
cutting
melting point
grain size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP98877A
Other languages
Japanese (ja)
Inventor
Toshiyuki Fujii
Kiyohiko Mihara
Shigeru Kitabi
Yoshio Ishibashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP98877A priority Critical patent/JPS5386158A/en
Priority to DE2730130A priority patent/DE2730130C2/en
Priority to US05/813,347 priority patent/US4217689A/en
Publication of JPS5386158A publication Critical patent/JPS5386158A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To cut semiconductor wafer at a high yield by cutting the semiconductor substrate covered with low melting point glass by means of a diamond blade of a specified tip angle and grain size.
COPYRIGHT: (C)1978,JPO&Japio
JP98877A 1976-09-14 1977-01-08 Production of semiconductor device Pending JPS5386158A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP98877A JPS5386158A (en) 1977-01-08 1977-01-08 Production of semiconductor device
DE2730130A DE2730130C2 (en) 1976-09-14 1977-07-04 Method for manufacturing semiconductor components
US05/813,347 US4217689A (en) 1976-09-14 1977-07-06 Process for preparing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP98877A JPS5386158A (en) 1977-01-08 1977-01-08 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5386158A true JPS5386158A (en) 1978-07-29

Family

ID=11488969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP98877A Pending JPS5386158A (en) 1976-09-14 1977-01-08 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5386158A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196550A (en) * 1985-02-26 1986-08-30 Mitsubishi Electric Corp Dicing for semiconductor wafer
JP2014192500A (en) * 2013-03-28 2014-10-06 Shindengen Electric Mfg Co Ltd Method of manufacturing mesa type semiconductor device
WO2019031174A1 (en) * 2017-08-10 2019-02-14 株式会社アライドマテリアル Superabrasive wheel and multi-superabrasive wheel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196550A (en) * 1985-02-26 1986-08-30 Mitsubishi Electric Corp Dicing for semiconductor wafer
JP2014192500A (en) * 2013-03-28 2014-10-06 Shindengen Electric Mfg Co Ltd Method of manufacturing mesa type semiconductor device
WO2019031174A1 (en) * 2017-08-10 2019-02-14 株式会社アライドマテリアル Superabrasive wheel and multi-superabrasive wheel

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