JPS5386158A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5386158A JPS5386158A JP98877A JP98877A JPS5386158A JP S5386158 A JPS5386158 A JP S5386158A JP 98877 A JP98877 A JP 98877A JP 98877 A JP98877 A JP 98877A JP S5386158 A JPS5386158 A JP S5386158A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- cutting
- melting point
- grain size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To cut semiconductor wafer at a high yield by cutting the semiconductor substrate covered with low melting point glass by means of a diamond blade of a specified tip angle and grain size.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP98877A JPS5386158A (en) | 1977-01-08 | 1977-01-08 | Production of semiconductor device |
DE2730130A DE2730130C2 (en) | 1976-09-14 | 1977-07-04 | Method for manufacturing semiconductor components |
US05/813,347 US4217689A (en) | 1976-09-14 | 1977-07-06 | Process for preparing semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP98877A JPS5386158A (en) | 1977-01-08 | 1977-01-08 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5386158A true JPS5386158A (en) | 1978-07-29 |
Family
ID=11488969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP98877A Pending JPS5386158A (en) | 1976-09-14 | 1977-01-08 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5386158A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61196550A (en) * | 1985-02-26 | 1986-08-30 | Mitsubishi Electric Corp | Dicing for semiconductor wafer |
JP2014192500A (en) * | 2013-03-28 | 2014-10-06 | Shindengen Electric Mfg Co Ltd | Method of manufacturing mesa type semiconductor device |
WO2019031174A1 (en) * | 2017-08-10 | 2019-02-14 | 株式会社アライドマテリアル | Superabrasive wheel and multi-superabrasive wheel |
-
1977
- 1977-01-08 JP JP98877A patent/JPS5386158A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61196550A (en) * | 1985-02-26 | 1986-08-30 | Mitsubishi Electric Corp | Dicing for semiconductor wafer |
JP2014192500A (en) * | 2013-03-28 | 2014-10-06 | Shindengen Electric Mfg Co Ltd | Method of manufacturing mesa type semiconductor device |
WO2019031174A1 (en) * | 2017-08-10 | 2019-02-14 | 株式会社アライドマテリアル | Superabrasive wheel and multi-superabrasive wheel |
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