JPS5469957A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5469957A
JPS5469957A JP13743177A JP13743177A JPS5469957A JP S5469957 A JPS5469957 A JP S5469957A JP 13743177 A JP13743177 A JP 13743177A JP 13743177 A JP13743177 A JP 13743177A JP S5469957 A JPS5469957 A JP S5469957A
Authority
JP
Japan
Prior art keywords
brazing material
backing
pellets
secured
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13743177A
Other languages
Japanese (ja)
Inventor
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP13743177A priority Critical patent/JPS5469957A/en
Publication of JPS5469957A publication Critical patent/JPS5469957A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Abstract

PURPOSE: To obtain the structure which enables pellets to be straightly secured to their mounting substrates without causing flying off of the pellets during cutting and by making use of the brazing material by cutting a wafer in the state of being held secured to its backing by means of a brazing material.
CONSTITUTION: A semiconductor wafer 10 is secured to its backing 12 by way of a brazing material 11 and the wafer 10 is completely cut with a dicing saw 13, forming grooves 14 partly cutting the brazing material 11. Thereafter, the wafer is heated to melt and cut off the brazing material 11 and separate the same from the backing 12, whereby pellets 15 having the brazing material 11 on the back are obtained. When the pellets 15 are immediately secured to their mounting substrates after peeling from the backing, the securing work may be readily and surely performed because the brazing material is still in a molten state.
COPYRIGHT: (C)1979,JPO&Japio
JP13743177A 1977-11-15 1977-11-15 Production of semiconductor device Pending JPS5469957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13743177A JPS5469957A (en) 1977-11-15 1977-11-15 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13743177A JPS5469957A (en) 1977-11-15 1977-11-15 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5469957A true JPS5469957A (en) 1979-06-05

Family

ID=15198455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13743177A Pending JPS5469957A (en) 1977-11-15 1977-11-15 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5469957A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015003356A (en) * 2013-06-20 2015-01-08 株式会社ディスコ Cutting method
JP2015505736A (en) * 2011-11-18 2015-02-26 ルクスビュー テクノロジー コーポレイション Method for transferring a microdevice
US9463613B2 (en) 2011-11-18 2016-10-11 Apple Inc. Micro device transfer head heater assembly and method of transferring a micro device
US9831383B2 (en) 2011-11-18 2017-11-28 Apple Inc. LED array
US10297712B2 (en) 2011-11-18 2019-05-21 Apple Inc. Micro LED display

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS457822Y1 (en) * 1965-12-14 1970-04-14
JPS51723A (en) * 1974-06-21 1976-01-06 Matsushita Electric Works Ltd Kabepanerunadono toritsukebuojusuru yukashitajisochi

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS457822Y1 (en) * 1965-12-14 1970-04-14
JPS51723A (en) * 1974-06-21 1976-01-06 Matsushita Electric Works Ltd Kabepanerunadono toritsukebuojusuru yukashitajisochi

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015505736A (en) * 2011-11-18 2015-02-26 ルクスビュー テクノロジー コーポレイション Method for transferring a microdevice
US9463613B2 (en) 2011-11-18 2016-10-11 Apple Inc. Micro device transfer head heater assembly and method of transferring a micro device
US9620478B2 (en) 2011-11-18 2017-04-11 Apple Inc. Method of fabricating a micro device transfer head
US9831383B2 (en) 2011-11-18 2017-11-28 Apple Inc. LED array
US10121864B2 (en) 2011-11-18 2018-11-06 Apple Inc. Micro device transfer head heater assembly and method of transferring a micro device
US10297712B2 (en) 2011-11-18 2019-05-21 Apple Inc. Micro LED display
US10607961B2 (en) 2011-11-18 2020-03-31 Apple Inc. Micro device transfer head heater assembly and method of transferring a micro device
US11552046B2 (en) 2011-11-18 2023-01-10 Apple Inc. Micro device transfer head assembly
JP2015003356A (en) * 2013-06-20 2015-01-08 株式会社ディスコ Cutting method

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