JPS52143577A - Method for slicing rod-like members - Google Patents

Method for slicing rod-like members

Info

Publication number
JPS52143577A
JPS52143577A JP6003476A JP6003476A JPS52143577A JP S52143577 A JPS52143577 A JP S52143577A JP 6003476 A JP6003476 A JP 6003476A JP 6003476 A JP6003476 A JP 6003476A JP S52143577 A JPS52143577 A JP S52143577A
Authority
JP
Japan
Prior art keywords
members
slicing rod
slicing
rod
ingot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6003476A
Other languages
Japanese (ja)
Inventor
Joichiro Kageyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6003476A priority Critical patent/JPS52143577A/en
Publication of JPS52143577A publication Critical patent/JPS52143577A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PURPOSE:To facilitate the operation of cutting off an ingot by performing the cut-off operation at the center of the ingot.
JP6003476A 1976-05-26 1976-05-26 Method for slicing rod-like members Pending JPS52143577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6003476A JPS52143577A (en) 1976-05-26 1976-05-26 Method for slicing rod-like members

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6003476A JPS52143577A (en) 1976-05-26 1976-05-26 Method for slicing rod-like members

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP9067983A Division JPS58212138A (en) 1983-05-25 1983-05-25 Slicing apparatus

Publications (1)

Publication Number Publication Date
JPS52143577A true JPS52143577A (en) 1977-11-30

Family

ID=13130374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6003476A Pending JPS52143577A (en) 1976-05-26 1976-05-26 Method for slicing rod-like members

Country Status (1)

Country Link
JP (1) JPS52143577A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55131463A (en) * 1979-03-27 1980-10-13 Toshiba Corp Method and apparatus for cutting semiconductor block
JPS5715908A (en) * 1980-07-03 1982-01-27 Fujikoshi Kikai Kogyo Kk Cutting method and its device
JPS5759706A (en) * 1980-09-29 1982-04-10 Tokyo Shibaura Electric Co Method of cutting hard and brittle member

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55131463A (en) * 1979-03-27 1980-10-13 Toshiba Corp Method and apparatus for cutting semiconductor block
JPS5715908A (en) * 1980-07-03 1982-01-27 Fujikoshi Kikai Kogyo Kk Cutting method and its device
JPH0156883B2 (en) * 1980-07-03 1989-12-01 Fujikoshi Kikai Kogyo Kk
JPS5759706A (en) * 1980-09-29 1982-04-10 Tokyo Shibaura Electric Co Method of cutting hard and brittle member
JPH0134758B2 (en) * 1980-09-29 1989-07-20 Tokyo Shibaura Electric Co

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