JPS52115168A - Beveling method for semiconductor substrates - Google Patents
Beveling method for semiconductor substratesInfo
- Publication number
- JPS52115168A JPS52115168A JP3127276A JP3127276A JPS52115168A JP S52115168 A JPS52115168 A JP S52115168A JP 3127276 A JP3127276 A JP 3127276A JP 3127276 A JP3127276 A JP 3127276A JP S52115168 A JPS52115168 A JP S52115168A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrates
- beveling method
- semiconductor
- beveling
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE: To produce beveled wafers by cutting shallow grooves while rotating a semiconductor and further slicing the semiconductor from the groove parts with a smaller margin to cut than said groove width.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3127276A JPS52115168A (en) | 1976-03-24 | 1976-03-24 | Beveling method for semiconductor substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3127276A JPS52115168A (en) | 1976-03-24 | 1976-03-24 | Beveling method for semiconductor substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52115168A true JPS52115168A (en) | 1977-09-27 |
Family
ID=12326687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3127276A Pending JPS52115168A (en) | 1976-03-24 | 1976-03-24 | Beveling method for semiconductor substrates |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52115168A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012129284A (en) * | 2010-12-14 | 2012-07-05 | Disco Abrasive Syst Ltd | Method for producing wafer |
-
1976
- 1976-03-24 JP JP3127276A patent/JPS52115168A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012129284A (en) * | 2010-12-14 | 2012-07-05 | Disco Abrasive Syst Ltd | Method for producing wafer |
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