JPS52115168A - Beveling method for semiconductor substrates - Google Patents

Beveling method for semiconductor substrates

Info

Publication number
JPS52115168A
JPS52115168A JP3127276A JP3127276A JPS52115168A JP S52115168 A JPS52115168 A JP S52115168A JP 3127276 A JP3127276 A JP 3127276A JP 3127276 A JP3127276 A JP 3127276A JP S52115168 A JPS52115168 A JP S52115168A
Authority
JP
Japan
Prior art keywords
semiconductor substrates
beveling method
semiconductor
beveling
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3127276A
Other languages
Japanese (ja)
Inventor
Akio Mimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3127276A priority Critical patent/JPS52115168A/en
Publication of JPS52115168A publication Critical patent/JPS52115168A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To produce beveled wafers by cutting shallow grooves while rotating a semiconductor and further slicing the semiconductor from the groove parts with a smaller margin to cut than said groove width.
COPYRIGHT: (C)1977,JPO&Japio
JP3127276A 1976-03-24 1976-03-24 Beveling method for semiconductor substrates Pending JPS52115168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3127276A JPS52115168A (en) 1976-03-24 1976-03-24 Beveling method for semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3127276A JPS52115168A (en) 1976-03-24 1976-03-24 Beveling method for semiconductor substrates

Publications (1)

Publication Number Publication Date
JPS52115168A true JPS52115168A (en) 1977-09-27

Family

ID=12326687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3127276A Pending JPS52115168A (en) 1976-03-24 1976-03-24 Beveling method for semiconductor substrates

Country Status (1)

Country Link
JP (1) JPS52115168A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129284A (en) * 2010-12-14 2012-07-05 Disco Abrasive Syst Ltd Method for producing wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129284A (en) * 2010-12-14 2012-07-05 Disco Abrasive Syst Ltd Method for producing wafer

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