JPS5572065A - Plastic-molded type semiconductor device - Google Patents

Plastic-molded type semiconductor device

Info

Publication number
JPS5572065A
JPS5572065A JP14747778A JP14747778A JPS5572065A JP S5572065 A JPS5572065 A JP S5572065A JP 14747778 A JP14747778 A JP 14747778A JP 14747778 A JP14747778 A JP 14747778A JP S5572065 A JPS5572065 A JP S5572065A
Authority
JP
Japan
Prior art keywords
mounting part
section
outside
frame
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14747778A
Other languages
Japanese (ja)
Inventor
Toshiaki Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14747778A priority Critical patent/JPS5572065A/en
Publication of JPS5572065A publication Critical patent/JPS5572065A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To reduce the cost with a simpler frame while improving the radiation effect by mounting an outside radiation plate on the element mounting section which is directly exposed to the outside in stead of providing a portion for dissipating heat on the frame. CONSTITUTION:One sheet of copper plate good both in the thermal and electric conductively is punched into a frame 15 while provided with respective lead pieces 18 and an element mounting part 16 bent downward at the bent section 17. Then, a semiconductor 19 is mounted on the top of the mounting part 16 and the electrodes provided thereon are connected to each lead piece 18 using a fine metal wire 20. Then, the product is placed into uppor and lower molds 21 and 22 with the undersurface 16a of the mounting part 16 downward and set by clamping. Subsequently, after a sealing with resin 23, each lead section 18 is separated from the tibar section of the mounting part 16 along the cutting lines 24-26. After the lead pieces 18 are individually separated, a radiation plate 27 is fastened on the undersurface 16a of the mounting part 16 exposed to the outside.
JP14747778A 1978-11-25 1978-11-25 Plastic-molded type semiconductor device Pending JPS5572065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14747778A JPS5572065A (en) 1978-11-25 1978-11-25 Plastic-molded type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14747778A JPS5572065A (en) 1978-11-25 1978-11-25 Plastic-molded type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5572065A true JPS5572065A (en) 1980-05-30

Family

ID=15431265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14747778A Pending JPS5572065A (en) 1978-11-25 1978-11-25 Plastic-molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5572065A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122457U (en) * 1982-02-12 1983-08-20 新電元工業株式会社 semiconductor equipment
JPS58162642U (en) * 1982-04-22 1983-10-29 新電元工業株式会社 semiconductor equipment
JPH02304957A (en) * 1989-05-19 1990-12-18 Nec Corp Package for mounting semiconductor integrated circuit element
JPH08125093A (en) * 1994-10-24 1996-05-17 Rohm Co Ltd Semiconductor device
US7821116B2 (en) 2007-02-05 2010-10-26 Fairchild Semiconductor Corporation Semiconductor die package including leadframe with die attach pad with folded edge

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122457U (en) * 1982-02-12 1983-08-20 新電元工業株式会社 semiconductor equipment
JPS635239Y2 (en) * 1982-02-12 1988-02-12
JPS58162642U (en) * 1982-04-22 1983-10-29 新電元工業株式会社 semiconductor equipment
JPS635240Y2 (en) * 1982-04-22 1988-02-12
JPH02304957A (en) * 1989-05-19 1990-12-18 Nec Corp Package for mounting semiconductor integrated circuit element
JPH08125093A (en) * 1994-10-24 1996-05-17 Rohm Co Ltd Semiconductor device
US7821116B2 (en) 2007-02-05 2010-10-26 Fairchild Semiconductor Corporation Semiconductor die package including leadframe with die attach pad with folded edge

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