JPS57121260A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57121260A
JPS57121260A JP56006380A JP638081A JPS57121260A JP S57121260 A JPS57121260 A JP S57121260A JP 56006380 A JP56006380 A JP 56006380A JP 638081 A JP638081 A JP 638081A JP S57121260 A JPS57121260 A JP S57121260A
Authority
JP
Japan
Prior art keywords
substrate
layer
pellet
radiated
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56006380A
Other languages
Japanese (ja)
Inventor
Kanji Otsuka
Takashi Miwa
Yoshiaki Emoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56006380A priority Critical patent/JPS57121260A/en
Publication of JPS57121260A publication Critical patent/JPS57121260A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

PURPOSE:To improve the heat radiation of a heat sink layer in a semiconductor device by providing the layer having good thermal conductivity in a substrate. CONSTITUTION:A pellet 12 is mounted on a substrate 10 made of a ceramic material, the electrode of the pellet 12 is connected via a wire 14 to the conductor part on the substrate 10, and a cap 16 is placed on the pellet 12 and is hermetically seated. On the other hand, the substrate 10 is formed in a shape that a copper layer 20 is sandwiched in the intermediate. In this manner, the heat produced from the pellet 12 is radiated from the direction of the cap 16, is further radiated directly externally through the layer 10 from the upper half of the substrate 10, and is radiated externally via the lower half of the substrate 10 from the layer 20, thereby improving the heat radiation of the heat sink layer.
JP56006380A 1981-01-21 1981-01-21 Semiconductor device Pending JPS57121260A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56006380A JPS57121260A (en) 1981-01-21 1981-01-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56006380A JPS57121260A (en) 1981-01-21 1981-01-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57121260A true JPS57121260A (en) 1982-07-28

Family

ID=11636768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56006380A Pending JPS57121260A (en) 1981-01-21 1981-01-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57121260A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946050A (en) * 1982-09-09 1984-03-15 Narumi China Corp Ceramic package for semiconductor
JPS61287128A (en) * 1985-06-13 1986-12-17 Matsushita Electric Works Ltd Chip carrier for electron element
JPS62130544A (en) * 1985-11-30 1987-06-12 Ibiden Co Ltd Substrate for placing semiconductor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946050A (en) * 1982-09-09 1984-03-15 Narumi China Corp Ceramic package for semiconductor
JPS6327860B2 (en) * 1982-09-09 1988-06-06 Narumi China Corp
JPS61287128A (en) * 1985-06-13 1986-12-17 Matsushita Electric Works Ltd Chip carrier for electron element
JPH053744B2 (en) * 1985-06-13 1993-01-18 Matsushita Electric Works Ltd
JPS62130544A (en) * 1985-11-30 1987-06-12 Ibiden Co Ltd Substrate for placing semiconductor
JPH058865B2 (en) * 1985-11-30 1993-02-03 Ibiden Co Ltd

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