JPS6489546A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6489546A JPS6489546A JP24752487A JP24752487A JPS6489546A JP S6489546 A JPS6489546 A JP S6489546A JP 24752487 A JP24752487 A JP 24752487A JP 24752487 A JP24752487 A JP 24752487A JP S6489546 A JPS6489546 A JP S6489546A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum nitride
- baked body
- frame part
- bonded
- nitride baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain a semiconductor device with excellent radiating capability and effective light screenability or light transmissivity depending on semiconductor chip applications by making a package part consist of a white aluminum nitride baked body and a black aluminum nitride baked body. CONSTITUTION:A semiconductor chip 1 is mounted on a conductive layer 2 formed on a base part 3 which consists of a white aluminum nitride baked body, the thermal conductivity thereof being 170W/m.K, a frame part 4 which consists of a black, light-screening aluminum nitride baked body is bonded on the peripheral of the top of the base part 3, a lid part 5 which consists of the same aluminum nitride baked body as the frame part 4 is bonded thereupon. The base part 3 and the frame part 4, as well as the frame part 4 and the lid part 5 are bonded together, respectively by a normal method such as brazing or a active metal method after forming a metallized layer thereupon, and then hermetically sealed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24752487A JPS6489546A (en) | 1987-09-30 | 1987-09-30 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24752487A JPS6489546A (en) | 1987-09-30 | 1987-09-30 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6489546A true JPS6489546A (en) | 1989-04-04 |
Family
ID=17164774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24752487A Pending JPS6489546A (en) | 1987-09-30 | 1987-09-30 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6489546A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03116854A (en) * | 1989-09-29 | 1991-05-17 | Ngk Insulators Ltd | Semiconductor memory device |
US5087964A (en) * | 1989-10-31 | 1992-02-11 | Mitsubishi Denki Kabushiki Kaisha | Package for a light-responsive semiconductor chip |
KR100498237B1 (en) * | 1998-05-11 | 2005-09-16 | 삼성전자주식회사 | Manufacturing method of semiconductor chip package sealed with metal cover |
JP2014150099A (en) * | 2013-01-31 | 2014-08-21 | Seiko Epson Corp | Package for housing optical element, optical filter device, optical module and electronic apparatus |
-
1987
- 1987-09-30 JP JP24752487A patent/JPS6489546A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03116854A (en) * | 1989-09-29 | 1991-05-17 | Ngk Insulators Ltd | Semiconductor memory device |
US5087964A (en) * | 1989-10-31 | 1992-02-11 | Mitsubishi Denki Kabushiki Kaisha | Package for a light-responsive semiconductor chip |
KR100498237B1 (en) * | 1998-05-11 | 2005-09-16 | 삼성전자주식회사 | Manufacturing method of semiconductor chip package sealed with metal cover |
JP2014150099A (en) * | 2013-01-31 | 2014-08-21 | Seiko Epson Corp | Package for housing optical element, optical filter device, optical module and electronic apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2179052A1 (en) | Integrated Silicon Vacuum Micropackage for Infrared Devices | |
EP0399447A3 (en) | Plastic molded type semiconductor device | |
JPS5471572A (en) | Semiconductor device | |
KR850004174A (en) | Semiconductor device | |
JPS5591145A (en) | Production of ceramic package | |
GB2111746B (en) | Semiconductor package | |
JPS6489546A (en) | Semiconductor device | |
EP0272390A3 (en) | Packages for a semiconductor device | |
EP0338213A3 (en) | Semiconductor device with a metal package | |
WO1996013056A3 (en) | Hermetically sealed hybrid ceramic integrated circuit package | |
JPS5548940A (en) | Semiconductor device | |
JPS55165658A (en) | Semiconductor device | |
CA2017080A1 (en) | Semiconductor device package structure | |
JPS5610938A (en) | Press-fit type semiconductor device | |
JPS54138370A (en) | Flip chip mounting body | |
JPS54102971A (en) | Semiconductor device | |
JPS5810840A (en) | Semiconductor device | |
JPS5745262A (en) | Sealing and fitting structure of semiconductor device | |
JP2927814B2 (en) | Resin sealed diode | |
JPS53144695A (en) | Semiconductor laser device | |
JPS5565448A (en) | Ceramic package for semiconductor device | |
JPS54129880A (en) | Manufacture for semiconductor device | |
JPS54102969A (en) | Semiconductor device | |
JPS57121260A (en) | Semiconductor device | |
JPS56133853A (en) | Package for integrating circuit |