JPS6489546A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6489546A
JPS6489546A JP24752487A JP24752487A JPS6489546A JP S6489546 A JPS6489546 A JP S6489546A JP 24752487 A JP24752487 A JP 24752487A JP 24752487 A JP24752487 A JP 24752487A JP S6489546 A JPS6489546 A JP S6489546A
Authority
JP
Japan
Prior art keywords
aluminum nitride
baked body
frame part
bonded
nitride baked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24752487A
Other languages
Japanese (ja)
Inventor
Yutaka Komorida
Nobuyuki Mizunoya
Masakazu Hatori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP24752487A priority Critical patent/JPS6489546A/en
Publication of JPS6489546A publication Critical patent/JPS6489546A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a semiconductor device with excellent radiating capability and effective light screenability or light transmissivity depending on semiconductor chip applications by making a package part consist of a white aluminum nitride baked body and a black aluminum nitride baked body. CONSTITUTION:A semiconductor chip 1 is mounted on a conductive layer 2 formed on a base part 3 which consists of a white aluminum nitride baked body, the thermal conductivity thereof being 170W/m.K, a frame part 4 which consists of a black, light-screening aluminum nitride baked body is bonded on the peripheral of the top of the base part 3, a lid part 5 which consists of the same aluminum nitride baked body as the frame part 4 is bonded thereupon. The base part 3 and the frame part 4, as well as the frame part 4 and the lid part 5 are bonded together, respectively by a normal method such as brazing or a active metal method after forming a metallized layer thereupon, and then hermetically sealed.
JP24752487A 1987-09-30 1987-09-30 Semiconductor device Pending JPS6489546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24752487A JPS6489546A (en) 1987-09-30 1987-09-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24752487A JPS6489546A (en) 1987-09-30 1987-09-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6489546A true JPS6489546A (en) 1989-04-04

Family

ID=17164774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24752487A Pending JPS6489546A (en) 1987-09-30 1987-09-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6489546A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116854A (en) * 1989-09-29 1991-05-17 Ngk Insulators Ltd Semiconductor memory device
US5087964A (en) * 1989-10-31 1992-02-11 Mitsubishi Denki Kabushiki Kaisha Package for a light-responsive semiconductor chip
KR100498237B1 (en) * 1998-05-11 2005-09-16 삼성전자주식회사 Manufacturing method of semiconductor chip package sealed with metal cover
JP2014150099A (en) * 2013-01-31 2014-08-21 Seiko Epson Corp Package for housing optical element, optical filter device, optical module and electronic apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116854A (en) * 1989-09-29 1991-05-17 Ngk Insulators Ltd Semiconductor memory device
US5087964A (en) * 1989-10-31 1992-02-11 Mitsubishi Denki Kabushiki Kaisha Package for a light-responsive semiconductor chip
KR100498237B1 (en) * 1998-05-11 2005-09-16 삼성전자주식회사 Manufacturing method of semiconductor chip package sealed with metal cover
JP2014150099A (en) * 2013-01-31 2014-08-21 Seiko Epson Corp Package for housing optical element, optical filter device, optical module and electronic apparatus

Similar Documents

Publication Publication Date Title
CA2179052A1 (en) Integrated Silicon Vacuum Micropackage for Infrared Devices
EP0399447A3 (en) Plastic molded type semiconductor device
JPS5471572A (en) Semiconductor device
KR850004174A (en) Semiconductor device
JPS5591145A (en) Production of ceramic package
GB2111746B (en) Semiconductor package
JPS6489546A (en) Semiconductor device
EP0272390A3 (en) Packages for a semiconductor device
EP0338213A3 (en) Semiconductor device with a metal package
WO1996013056A3 (en) Hermetically sealed hybrid ceramic integrated circuit package
JPS5548940A (en) Semiconductor device
JPS55165658A (en) Semiconductor device
CA2017080A1 (en) Semiconductor device package structure
JPS5610938A (en) Press-fit type semiconductor device
JPS54138370A (en) Flip chip mounting body
JPS54102971A (en) Semiconductor device
JPS5810840A (en) Semiconductor device
JPS5745262A (en) Sealing and fitting structure of semiconductor device
JP2927814B2 (en) Resin sealed diode
JPS53144695A (en) Semiconductor laser device
JPS5565448A (en) Ceramic package for semiconductor device
JPS54129880A (en) Manufacture for semiconductor device
JPS54102969A (en) Semiconductor device
JPS57121260A (en) Semiconductor device
JPS56133853A (en) Package for integrating circuit