JPS5565448A - Ceramic package for semiconductor device - Google Patents

Ceramic package for semiconductor device

Info

Publication number
JPS5565448A
JPS5565448A JP13887978A JP13887978A JPS5565448A JP S5565448 A JPS5565448 A JP S5565448A JP 13887978 A JP13887978 A JP 13887978A JP 13887978 A JP13887978 A JP 13887978A JP S5565448 A JPS5565448 A JP S5565448A
Authority
JP
Japan
Prior art keywords
electrode
ring
lid
ceramic body
depression
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13887978A
Other languages
Japanese (ja)
Other versions
JPS6129541B2 (en
Inventor
Masaru Sakaguchi
Masao Mitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13887978A priority Critical patent/JPS5565448A/en
Publication of JPS5565448A publication Critical patent/JPS5565448A/en
Publication of JPS6129541B2 publication Critical patent/JPS6129541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE: To increase sealing efficiency, by mounting a Kovar ring and a lid made of transparent glass material on a ceramic substrate sealing ceramic body which enclose a semiconductor element by means of silver wax and heat-bonding them by applying electricity.
CONSTITUTION: A depression is provided in the center of ceramic substrate 3, and metallized layer 2 is fitted to its bottom surface. Electrode 1 is fitted on substrate 3 surrounding the depression. Next, ring-shaped sealing ceramic body 6 is placed on electrode 1, and lead frame 9 is fixed to the part of electrode 1 projecting outward from here. Subsequently, semiconductor memory 4 is mounted on layer 2, and this electrode is connected to electrode 1 by means of fine Al wire 5. Kovar ring 11 is fixed on ceramic body 6 by means of silver wax. Lid 7, made of boronsilicate, whose coefficient of thermal expansion is close to this, is placed on top of this. At this time, for bonding, anode-cathode-junction electrodes 13' and 13 are brought into contact respectively with ring 11 and heating board 12 provided on lid 7, and heating and fixing are done by means of DC power supplied from DC power source 14.
COPYRIGHT: (C)1980,JPO&Japio
JP13887978A 1978-11-13 1978-11-13 Ceramic package for semiconductor device Granted JPS5565448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13887978A JPS5565448A (en) 1978-11-13 1978-11-13 Ceramic package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13887978A JPS5565448A (en) 1978-11-13 1978-11-13 Ceramic package for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5565448A true JPS5565448A (en) 1980-05-16
JPS6129541B2 JPS6129541B2 (en) 1986-07-07

Family

ID=15232239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13887978A Granted JPS5565448A (en) 1978-11-13 1978-11-13 Ceramic package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5565448A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429838U (en) * 1987-08-13 1989-02-22
WO2005011005A1 (en) * 2003-07-29 2005-02-03 Hamamatsu Photonics K.K. Backside-illuminated photodetector and method for manufacturing same
WO2005086229A1 (en) * 2004-03-05 2005-09-15 Neomax Materials Co., Ltd. Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
WO2006038395A1 (en) * 2004-09-30 2006-04-13 Hitachi, Ltd. Electronic apparatus using anodic bonded structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5741102A (en) * 1980-07-07 1982-03-08 Sameka Sa Guide apparatus for bar material of automatic lathe

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5741102A (en) * 1980-07-07 1982-03-08 Sameka Sa Guide apparatus for bar material of automatic lathe

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429838U (en) * 1987-08-13 1989-02-22
WO2005011005A1 (en) * 2003-07-29 2005-02-03 Hamamatsu Photonics K.K. Backside-illuminated photodetector and method for manufacturing same
JP2005051080A (en) * 2003-07-29 2005-02-24 Hamamatsu Photonics Kk Backside incident photodetector and its manufacturing method
US7560790B2 (en) 2003-07-29 2009-07-14 Hamamatsu Photonics K.K. Backside-illuminated photodetector
JP4499386B2 (en) * 2003-07-29 2010-07-07 浜松ホトニクス株式会社 Manufacturing method of back-illuminated photodetector
US7964898B2 (en) 2003-07-29 2011-06-21 Hamamatsu Photonics K.K. Back illuminated photodetector
WO2005086229A1 (en) * 2004-03-05 2005-09-15 Neomax Materials Co., Ltd. Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
WO2006038395A1 (en) * 2004-09-30 2006-04-13 Hitachi, Ltd. Electronic apparatus using anodic bonded structure

Also Published As

Publication number Publication date
JPS6129541B2 (en) 1986-07-07

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