JPS55128845A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55128845A
JPS55128845A JP3547779A JP3547779A JPS55128845A JP S55128845 A JPS55128845 A JP S55128845A JP 3547779 A JP3547779 A JP 3547779A JP 3547779 A JP3547779 A JP 3547779A JP S55128845 A JPS55128845 A JP S55128845A
Authority
JP
Japan
Prior art keywords
chip
alpha ray
coated
active region
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3547779A
Other languages
Japanese (ja)
Inventor
Takehisa Nitta
Katsumi Ogiue
Kanji Otsuka
Shinji Onishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3547779A priority Critical patent/JPS55128845A/en
Publication of JPS55128845A publication Critical patent/JPS55128845A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent an erroneous operation of a semiconductor device due to alpha ray irradiation by adhering an alpha ray shield plate made of high purity material such as Si, quartz or the like on the surface of an active region of a semiconductor chip.
CONSTITUTION: An adhesive 13 made of Au foil or Au metallized layer or the like is coated on the bottom surface of a recess formed at the center on the surface of a ceramic insulating base 10, and a Si chip 14 having an active region such as a memory feasible to erroneously operate due to alpha ray irradiation is secured onto the botton surface. A number of electrodes formed on the chip 14 are then connected to corresponding lead wires 12 using bonding wires 15, and an alpha ray shield plate 17 made of high purity silicon is coated on the surface of the active region of the chip 14 using an adhesive layer 16 of phosphor silicate glass or lead glass. Thereafter, an insulating cap 18 having space underneath the cap is coated on the base 10, and secured at the ends through adhesive layers 19 on the base 10. Thus, it can shield alpha rays irradiated from the ceramic material to eliminate erroneous operation of the chip 14.
COPYRIGHT: (C)1980,JPO&Japio
JP3547779A 1979-03-28 1979-03-28 Semiconductor device Pending JPS55128845A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3547779A JPS55128845A (en) 1979-03-28 1979-03-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3547779A JPS55128845A (en) 1979-03-28 1979-03-28 Semiconductor device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP60161859A Division JPS6150348A (en) 1985-07-24 1985-07-24 Manufacture of semiconductor device
JP60161860A Division JPS6150349A (en) 1985-07-24 1985-07-24 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS55128845A true JPS55128845A (en) 1980-10-06

Family

ID=12442838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3547779A Pending JPS55128845A (en) 1979-03-28 1979-03-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55128845A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145345A (en) * 1981-03-04 1982-09-08 Nec Corp Semiconductor device
JPS57190336A (en) * 1981-05-20 1982-11-22 Nec Corp Semiconductor integrated circuit
JPS5848950A (en) * 1981-09-18 1983-03-23 Nec Corp Semiconductor device and its manufacture
JPS5891663A (en) * 1981-11-27 1983-05-31 Nec Corp Semiconductor device and manufacture thereof
JPS58112350A (en) * 1981-12-26 1983-07-04 Fujitsu Ltd Semiconductor device and manufacture thereof
JPS59121956A (en) * 1982-12-28 1984-07-14 Tomoegawa Paper Co Ltd Heat-resisting adhesive sheet

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552251A (en) * 1978-10-11 1980-04-16 Nec Corp Semiconductor integrated circuit device
JPS5552246A (en) * 1978-10-13 1980-04-16 Mitsubishi Electric Corp Semiconductor device
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552251A (en) * 1978-10-11 1980-04-16 Nec Corp Semiconductor integrated circuit device
JPS5552246A (en) * 1978-10-13 1980-04-16 Mitsubishi Electric Corp Semiconductor device
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145345A (en) * 1981-03-04 1982-09-08 Nec Corp Semiconductor device
JPS57190336A (en) * 1981-05-20 1982-11-22 Nec Corp Semiconductor integrated circuit
JPS634713B2 (en) * 1981-05-20 1988-01-30 Nippon Electric Co
JPS5848950A (en) * 1981-09-18 1983-03-23 Nec Corp Semiconductor device and its manufacture
JPS5891663A (en) * 1981-11-27 1983-05-31 Nec Corp Semiconductor device and manufacture thereof
JPS6214100B2 (en) * 1981-11-27 1987-03-31 Nippon Electric Co
JPS58112350A (en) * 1981-12-26 1983-07-04 Fujitsu Ltd Semiconductor device and manufacture thereof
JPS622460B2 (en) * 1981-12-26 1987-01-20 Fujitsu Ltd
JPS59121956A (en) * 1982-12-28 1984-07-14 Tomoegawa Paper Co Ltd Heat-resisting adhesive sheet

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