JPS641269A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS641269A
JPS641269A JP62155478A JP15547887A JPS641269A JP S641269 A JPS641269 A JP S641269A JP 62155478 A JP62155478 A JP 62155478A JP 15547887 A JP15547887 A JP 15547887A JP S641269 A JPS641269 A JP S641269A
Authority
JP
Japan
Prior art keywords
chips
substrate
leads
semiconductor
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62155478A
Other languages
Japanese (ja)
Other versions
JPH011269A (en
JP2603636B2 (en
Inventor
Masayuki Watanabe
Toshio Kanno
Seiichiro Tsukui
Takashi Ono
Yoshiaki Wakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Akita Electronics Systems Co Ltd
Renesas Eastern Japan Semiconductor Inc
Hitachi Consumer Electronics Co Ltd
Japan Display Inc
Original Assignee
Hitachi Device Engineering Co Ltd
Hitachi Ltd
Hitachi Consumer Electronics Co Ltd
Hitachi Tohbu Semiconductor Ltd
Akita Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP62155478A priority Critical patent/JP2603636B2/en
Application filed by Hitachi Device Engineering Co Ltd, Hitachi Ltd, Hitachi Consumer Electronics Co Ltd, Hitachi Tohbu Semiconductor Ltd, Akita Electronics Co Ltd filed Critical Hitachi Device Engineering Co Ltd
Priority to KR1019880007112A priority patent/KR970003915B1/en
Priority to US07/209,739 priority patent/US4982265A/en
Publication of JPH011269A publication Critical patent/JPH011269A/en
Publication of JPS641269A publication Critical patent/JPS641269A/en
Priority to US07/796,873 priority patent/US5138438A/en
Priority to KR1019930010377A priority patent/KR970003913B1/en
Priority to KR1019930010378A priority patent/KR970003914B1/en
Priority to US08/323,709 priority patent/US5587341A/en
Priority to US08/763,469 priority patent/US5708298A/en
Publication of JP2603636B2 publication Critical patent/JP2603636B2/en
Application granted granted Critical
Priority to US08/984,330 priority patent/US5910685A/en
Priority to US09/292,999 priority patent/US6262488B1/en
Priority to US09/863,450 priority patent/US6424030B2/en
Priority to US10/124,281 priority patent/US6521993B2/en
Priority to US10/341,397 priority patent/US6693346B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve the mounting density of a semiconductor chip on a module substrate by connecting the bump electrode of a semiconductor chip to leads, and connecting a plurality of the chips having leads to the wirings of the substrate.
CONSTITUTION: A module substrate 1 composed by a plurality of ceramic layers and wiring layers of laminated ceramics places 8 semiconductor chips 4A, 4B, 4C, 4D on its front and rear faces. It is not sealed with package made of ceramics or resin, and the face formed with semiconductor elements or wirings is molded with resin 7. Thus, the chips 4A, 4B, 4C, 4D connected with leads 5A, 5B, 5C, 5D by TABs to bump electrodes 6 are placed on the substrate 1 to construct a semiconductor device, thereby reducing the area of occupying the chips 4A, 4B, 4C, 4D on the substrate 1. Accordingly, the mounting density of the devices can be increased.
COPYRIGHT: (C)1989,JPO&Japio
JP62155478A 1987-06-24 1987-06-24 Semiconductor device Expired - Lifetime JP2603636B2 (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP62155478A JP2603636B2 (en) 1987-06-24 1987-06-24 Semiconductor device
KR1019880007112A KR970003915B1 (en) 1987-06-24 1988-06-14 Semiconductor device and the use memory module
US07/209,739 US4982265A (en) 1987-06-24 1988-06-22 Semiconductor integrated circuit device and method of manufacturing the same
US07/796,873 US5138438A (en) 1987-06-24 1991-11-25 Lead connections means for stacked tab packaged IC chips
KR1019930010377A KR970003913B1 (en) 1987-06-24 1993-06-09 Surface mounting method of semiconductor integrated device
KR1019930010378A KR970003914B1 (en) 1987-06-24 1993-06-09 Semiconductor memory module
US08/323,709 US5587341A (en) 1987-06-24 1994-10-18 Process for manufacturing a stacked integrated circuit package
US08/763,469 US5708298A (en) 1987-06-24 1996-12-10 Semiconductor memory module having double-sided stacked memory chip layout
US08/984,330 US5910685A (en) 1987-06-24 1997-12-03 Semiconductor memory module having double-sided stacked memory chip layout
US09/292,999 US6262488B1 (en) 1987-06-24 1999-04-16 Semiconductor memory module having double-sided memory chip layout
US09/863,450 US6424030B2 (en) 1987-06-24 2001-05-24 Semiconductor memory module having double-sided stacked memory chip layout
US10/124,281 US6521993B2 (en) 1987-06-24 2002-04-18 Semiconductor memory module having double-sided stacked memory chip layout
US10/341,397 US6693346B2 (en) 1987-06-24 2003-01-14 Semiconductor memory module having double-sided stacked memory chip layout

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62155478A JP2603636B2 (en) 1987-06-24 1987-06-24 Semiconductor device

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP7294116A Division JP2581532B2 (en) 1995-11-13 1995-11-13 Semiconductor device
JP8072777A Division JP2706699B2 (en) 1996-03-27 1996-03-27 Semiconductor module
JP8072776A Division JP2713876B2 (en) 1996-03-27 1996-03-27 Semiconductor device

Publications (3)

Publication Number Publication Date
JPH011269A JPH011269A (en) 1989-01-05
JPS641269A true JPS641269A (en) 1989-01-05
JP2603636B2 JP2603636B2 (en) 1997-04-23

Family

ID=15606928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62155478A Expired - Lifetime JP2603636B2 (en) 1987-06-24 1987-06-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JP2603636B2 (en)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956308A (en) * 1987-01-20 1990-09-11 Itt Corporation Method of making self-aligned field-effect transistor
JPH0320051A (en) * 1989-03-20 1991-01-29 Seiko Epson Corp Semiconductor device mounting structure and mounting method and mounting device
JPH0323996A (en) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd Ic memory card
JPH0323998A (en) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd Ic memory card
JPH0323999A (en) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd Ic memory card
JPH0323997A (en) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd Ic memory card
WO1991014282A1 (en) * 1990-03-15 1991-09-19 Fujitsu Limited Semiconductor device having a plurality of chips
JPH0531257U (en) * 1991-09-30 1993-04-23 船井電機株式会社 Semiconductor mounting structure
US5293953A (en) * 1989-06-30 1994-03-15 Mazda Motor Corporation Rear wheel steering system for a vehicle
US5530292A (en) * 1990-03-15 1996-06-25 Fujitsu Limited Semiconductor device having a plurality of chips
US5701031A (en) * 1990-04-26 1997-12-23 Hitachi, Ltd. Sealed stacked arrangement of semiconductor devices
US6395578B1 (en) 1999-05-20 2002-05-28 Amkor Technology, Inc. Semiconductor package and method for fabricating the same
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
US6555917B1 (en) 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same
US6564454B1 (en) 2000-12-28 2003-05-20 Amkor Technology, Inc. Method of making and stacking a semiconductor package
US6642610B2 (en) 1999-12-20 2003-11-04 Amkor Technology, Inc. Wire bonding method and semiconductor package manufactured using the same
US6656765B1 (en) 2000-02-02 2003-12-02 Amkor Technology, Inc. Fabricating very thin chip size semiconductor packages
KR100418380B1 (en) * 2001-07-16 2004-02-11 주식회사 지아이씨하이테크 Method for heaping Semiconductor Package
US6737750B1 (en) 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US6798049B1 (en) 1999-08-24 2004-09-28 Amkor Technology Inc. Semiconductor package and method for fabricating the same
US6879047B1 (en) 2003-02-19 2005-04-12 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
US6946323B1 (en) 2001-11-02 2005-09-20 Amkor Technology, Inc. Semiconductor package having one or more die stacked on a prepackaged device and method therefor
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US7154171B1 (en) 2002-02-22 2006-12-26 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
JP2007115726A (en) * 2005-10-18 2007-05-10 Mitsubishi Electric Corp Capacitor device
US7485490B2 (en) 2001-03-09 2009-02-03 Amkor Technology, Inc. Method of forming a stacked semiconductor package
US9768124B2 (en) 2007-02-21 2017-09-19 Amkor Technology, Inc. Semiconductor package in package

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6157542U (en) * 1984-09-18 1986-04-17
JPS61248541A (en) * 1985-04-26 1986-11-05 Matsushita Electronics Corp Semiconductor device
JPS6290958A (en) * 1985-10-17 1987-04-25 Matsushita Electric Ind Co Ltd Semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53148752A (en) * 1977-05-31 1978-12-25 Toshiba Corp Flowing-fluid heating appartus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6157542U (en) * 1984-09-18 1986-04-17
JPS61248541A (en) * 1985-04-26 1986-11-05 Matsushita Electronics Corp Semiconductor device
JPS6290958A (en) * 1985-10-17 1987-04-25 Matsushita Electric Ind Co Ltd Semiconductor device

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956308A (en) * 1987-01-20 1990-09-11 Itt Corporation Method of making self-aligned field-effect transistor
JPH0320051A (en) * 1989-03-20 1991-01-29 Seiko Epson Corp Semiconductor device mounting structure and mounting method and mounting device
JPH0323996A (en) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd Ic memory card
JPH0323998A (en) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd Ic memory card
JPH0323999A (en) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd Ic memory card
JPH0323997A (en) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd Ic memory card
US5293953A (en) * 1989-06-30 1994-03-15 Mazda Motor Corporation Rear wheel steering system for a vehicle
WO1991014282A1 (en) * 1990-03-15 1991-09-19 Fujitsu Limited Semiconductor device having a plurality of chips
US5530292A (en) * 1990-03-15 1996-06-25 Fujitsu Limited Semiconductor device having a plurality of chips
US5701031A (en) * 1990-04-26 1997-12-23 Hitachi, Ltd. Sealed stacked arrangement of semiconductor devices
USRE37539E1 (en) 1990-04-26 2002-02-05 Hitachi, Ltd. Sealed stacked arrangement of semiconductor devices
JPH0531257U (en) * 1991-09-30 1993-04-23 船井電機株式会社 Semiconductor mounting structure
US6395578B1 (en) 1999-05-20 2002-05-28 Amkor Technology, Inc. Semiconductor package and method for fabricating the same
US6762078B2 (en) 1999-05-20 2004-07-13 Amkor Technology, Inc. Semiconductor package having semiconductor chip within central aperture of substrate
US6798049B1 (en) 1999-08-24 2004-09-28 Amkor Technology Inc. Semiconductor package and method for fabricating the same
US6642610B2 (en) 1999-12-20 2003-11-04 Amkor Technology, Inc. Wire bonding method and semiconductor package manufactured using the same
US6803254B2 (en) 1999-12-20 2004-10-12 Amkor Technology, Inc. Wire bonding method for a semiconductor package
US6656765B1 (en) 2000-02-02 2003-12-02 Amkor Technology, Inc. Fabricating very thin chip size semiconductor packages
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
US6564454B1 (en) 2000-12-28 2003-05-20 Amkor Technology, Inc. Method of making and stacking a semiconductor package
US7485490B2 (en) 2001-03-09 2009-02-03 Amkor Technology, Inc. Method of forming a stacked semiconductor package
KR100418380B1 (en) * 2001-07-16 2004-02-11 주식회사 지아이씨하이테크 Method for heaping Semiconductor Package
US6555917B1 (en) 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same
US6946323B1 (en) 2001-11-02 2005-09-20 Amkor Technology, Inc. Semiconductor package having one or more die stacked on a prepackaged device and method therefor
US6737750B1 (en) 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US6919631B1 (en) 2001-12-07 2005-07-19 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US7154171B1 (en) 2002-02-22 2006-12-26 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
US6879047B1 (en) 2003-02-19 2005-04-12 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
JP2007115726A (en) * 2005-10-18 2007-05-10 Mitsubishi Electric Corp Capacitor device
US9768124B2 (en) 2007-02-21 2017-09-19 Amkor Technology, Inc. Semiconductor package in package

Also Published As

Publication number Publication date
JP2603636B2 (en) 1997-04-23

Similar Documents

Publication Publication Date Title
JPS641269A (en) Semiconductor device
US4578697A (en) Semiconductor device encapsulating a multi-chip array
EP0377932A3 (en) Package of semiconductor integrated circuits
TW358230B (en) Semiconductor package
ES2016003A6 (en) Hermetic package for integrated circuit chips.
EP0346061A3 (en) Integrated circuit device having an improved package structure
ATE54776T1 (en) SEMICONDUCTOR ELEMENT AND MANUFACTURING PROCESS.
JPS55111151A (en) Integrated circuit device
JPS5655067A (en) Semiconductor integrated circuit device
GB2083285A (en) Over/under dual in-line chip package
EP0276940A3 (en) Semiconductor chip having external terminals connected to corresponding leads by wires
JPS54139415A (en) Semiconductor channel switch
JPS63132459A (en) Semiconductor package with built-in capacitor
JPS57126154A (en) Lsi package
CA2017080A1 (en) Semiconductor device package structure
JPS56148857A (en) Semiconductor device
JPS55113351A (en) Integrated circuit module
JPS55165657A (en) Multi-chip package
KR970013134A (en) Heat Dissipation Structure of Ball Grid Array (BGA) Semiconductor Package Using Solder Ball as Input / Output Terminal
JPS6352457A (en) Semiconductor device
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
JPS6453568A (en) Semiconductor package
EP0162521A3 (en) Package for semiconductor devices
JPH02280359A (en) Semiconductor device
JPS6444027A (en) Semiconductor device

Legal Events

Date Code Title Description
S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080129

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080129

Year of fee payment: 11