JPH0323998A - Ic memory card - Google Patents

Abstract

PURPOSE:To realize an increase in capacity and to reduce a wiring space by a method wherein the other end parts of the conductor leads of the common electrode of respective laminated memory LSI chips are connected to the conductor wirings of a printed wiring board and the other end parts of the conductor leads connected to uncommon electrodes are connected to conductor wirings different from the others at every lamination level. CONSTITUTION:One end parts 12a, 12'a of conductor leads 12, 12' are connected to the electrodes 10, 10' of memory LSI chips 6, 6' through metal projections 11, 11' and one end parts 15a, 15'a of conductor leads 15, 15' are connected to separate electrodes 13, 13' through metal projections 14, 14'. Since the electrodes 10, 10' are the common electrode of the LSI chips 6, 6', the other end part 12b of the conductor lead 12 is superposed on the other end part 12'b of the conductor lead 12' to be connected to the conductor wiring 16 of the printed wiring board 2. However, since the electrodes 13, 13' are the uncommon electrodes of the LSI chips 6, 6', the conductor leads 15, 15' are led out to different positions and the other end parts 15b, 15'b thereof are connected to the different conductor wirings 17, 18 of the wiring board 2 and not brought to a mutual contact state.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an IC memory card incorporating a large number of memory LSI chips.

Conventional technology IC memory cards are memory LS such as RAM, ROM, etc.
It is used in many fields as a portable information storage device with a built-in I. In recent years, with the expansion of its uses, there has been a demand for IC memory cards with a large storage capacity, that is, a large capacity. In the case of a large-capacity IC memory card, a large number of memory LSIs must be mounted at high density on a printed circuit board/wiring board of a certain area.

By the way, as a high-density mounting method for a memory LSI, conductor leads are bonded to the electrodes of a bare chip of the memory LSI using a so-called film carrier method, and the memory LSI chip is flatly mounted on a printed wiring board. The method of mounting side by side was considered to be effective.
The structure of a conventional IC memory card in which a large number of memory LSIs are mounted on a printed wiring board will be described.

FIG. 9 is a sectional view showing a conventional IC memory card.

Referring to FIG. 9, 31 is a case, and printed wiring board 32
is stored. Conductor wiring 33 is provided on the printed wiring board 32.
is formed. Reference numerals 34 and 34' designate memory LSI chips, which are arranged in a plane on the printed wiring board 32. Memory LSI chip 5. ,-. ．． ; One end 371L of the conductor lead 37 is connected to the electrode 36 of the conductor lead 34 via the metal protrusion 36 using a film carrier method.
are joined. The other end 37b of the conductor lead 37 is
It is joined to the conductor wiring 33 of the printed wiring board 32.

Since Beatisop is used in this way, the area occupied by the memory LSI on the printed wiring board is relatively small.

Problems to be Solved by the Invention However, in the conventional configuration described above, the memory LSI chips are arranged in a plane on the printed wiring board, so as the number of memory LSI chips increases, the area occupied by the memory LSI chips also increases. Therefore, there is a natural limit to the number of memory LSI chips that can be mounted on a printed wiring board having a certain area. '1. In addition, as the number of memory LSI chips increases, the distance of the conductor wiring on the printed wiring board that connects the conductor leads bonded to the electrodes of the memory LSI chips becomes longer, and therefore the wiring space increases, so the cost of the printed wiring board increases. There was a problem in that as the signal transmission speed increased, the signal transmission speed also became slower.

6. The present invention solves the above-mentioned conventional problem, and includes a large number of memories L S on a printed wiring board having a certain area.
We provide an IC memory card that is equipped with an I-chip to increase capacity, reduce the wiring space, reduce the cost of printed wiring boards, and increase the speed of signal transmission. The purpose is to improve reliability by ensuring insulation between stacked memory LSI chips.

Means for Solving the Problems To achieve this object, the IC memory card of the present invention connects one end of a conductor lead to an electrode of a memory LSI chip, and connects the memory LSI chip to a printed wiring board with its electrode arrangement. A plurality of memory LsI chips are stacked in the same direction, and the other end of the conductor lead of the common electrode of each stacked memory LsI chip is overlapped in the stacking direction and bonded to the conductor wiring of the printed wiring board. The other end of the conductor lead connected to the electrode is connected to a corresponding conductor wiring of the printed wiring board for each level of the stacked chips, each having a different value from the others. Each conductor lead is formed and supported on an insulating film, and the other end of the conductor lead is bent and molded into a different shape for each layer of chip stacking from the end of the insulating film. The printed wiring board is provided with positioning holes, and an insulating material is inserted between the stacked chips.

Function: With this configuration, the area occupied by the memory LSI chip is greatly reduced, so it is possible to mount a large number of memory LSI chips on a printed wiring board with a limited area and achieve large capacity. Since the conductor leads of the common electrodes between the stacked chips are directly connected to each other, the wiring space is reduced, reducing the cost of the printed wiring board and increasing the speed of signal transmission.

Furthermore, the positioning holes between the insulating film and the printed wiring board facilitate stacking and assembling (9), and the bending or shaping of the other end of the conductor lead facilitates stacking of adjacent upper and lower memories. By maintaining the appropriate distance between LSI chips and inserting insulating material between the chips, a highly reliable IC memory card can be realized.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 is a partially cutaway perspective view of an IC memory card according to an embodiment of the present invention, FIG. 2 is a partial sectional view of the same, FIG. 3 is a block diagram of the same electric circuit, and FIG. memory
FIG. 2 is a perspective view showing a stacked state of LSI chips. 1st
From the diagram to Figure 4, 1 is a case and printed wiring board 2
is stored. The printed wiring board 2 includes a memory circuit section 3
, a control circuit 4, and an external interface circuit 6. The memory circuit section 3 is composed of a plurality of memory LSI chips 6, and a plurality of sets of two-layered memory LSI chips are mounted on the printed wiring board 2. The control circuit 4 is composed of a decoder IC 7 and the like, and performs chip selection based on an address signal, backup control 9 and roll based on power supply switching, and the like. The external interface circuit section 5 is composed of a connecting connector 8 and the like, and the connecting connector 8 is coupled to a connecting section (not shown) attached to another device or device, and supplies power to the printed wiring board 2. and send and receive signals. 9 is a battery that backs up the memory circuit section 3, and is housed in the case 1 using a button type lithium battery or the like.

The battery 9 supplies bank-up power to the memory circuit section 3 when power is not supplied from the connector 8.

Next, the stacked state of the memory LSI chip 6 will be described. The memory LSI chip 6 is stacked on top of another memory LSI chip 6' in such a direction that the respective electrode arrangements are the same. 1 0. 1 0' is memory L S
A metal protrusion 11 is connected to each electrode of the I-chip 6, 6'.
．． 11' via the conductor lead 1 2 . 1 2' end portions 122L and 12'a are connected. 1 3
．． 1 3' is another electrode of the memory LSI chips 6, 6', and one end portion 162L10\1/'16'a of the conductor lead IEi, 1.6' is connected via a metal protrusion j4, 14', respectively. ing. Since the electrode 10.10' is a common electrode of the memory LSI chips 6, 6', the other end 12b of the conductor lead 12 is overlapped on the other end 12'b of the conductor lead 12' and printed. It is joined to the conductor wiring 16 of the wiring board 2. However, electrode 13.13
' are non-common electrodes of the memory LSI chips 6, 6', so the conductor leads 1616' are drawn out to different positions, and the other ends of the conductor leads 16b, 16'b are connected to different locations on the printed wiring board 2. They are joined to the conductor wirings 17 and 18 so that they do not come into contact with each other.

19 is an insulating material made of resin etc., and the electrode 10.1
0', 13.13' and memory L
Back side of SI chip 6 and one end of conductor lead 1 2'
a, 1 6'! Its role is to prevent L from coming into direct contact with it.

As described above, according to this embodiment, by stacking a plurality of memory LSI chips 6 and mounting them on the printed wiring board 2, the area occupied by the memory LSI chips 6 can be greatly reduced. Since a large number of memory LSI chips 6 can be mounted on a printed wiring board 2 of a certain area, large-capacity I
C memory card can be realized.

Furthermore, the other ends 12b12'b of the conductor leads of the common electrodes 10, 10' of the stacked memory LSI chips 6, 6' are
Since they are overlapped and bonded to the conductor wiring 16 of the printed wiring board 2, the wiring space is small, the cost of the printed wiring board 2 can be reduced, and an IC memory card with high signal transmission speed can be realized.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a partial sectional view of an IC memory card according to the second embodiment, and FIG. 6 is a partial perspective view thereof. 6 and 6, the Bling 1 housed in the case 1 and the wiring board 2 have the same type of memory L S
2 in the direction that the electrode arrangement is the same.
Laminated in layers. Conductor leads 12 . 1 2' end part 12 &, 12'
& is joined. The conductor leads 12, 12' are formed on the insulating films 20, 20' and are supported by adhesive or other methods. 13, 13' (not shown) are memory
Another electrode of the L S I chip 6, 6' is connected to the conductor lead 16 through a metal protrusion 14, 14' (not shown), respectively.
．． 15' (not shown), one end portions 16a and 16'a (not shown) are joined.

Conductor lead 16. 1 5' is an insulating film 20.
It is formed and supported on 20'. and electrodes 10,1
Since 0' is a common electrode of the memory LSI chips 6, 6', the other end 12b of the conductor lead 12 is overlapped with the other end 12'b of the conductor lead 12', and the conductor wiring of the printed wiring board 2 is connected. 16. However, electrode 13”,1
Since 3' is a non-common electrode of the memory LSI chips 6 and 6', the conductor leads 16 and 16' are branched into two on the insulating film 20, and the other end 1521 of the conductor lead 16;
j: It is joined to the conductor wiring 17 of the printed wiring board 2, and the other end 15C of the conductor lead 16 is cut off. The other end 15'b of the conductor lead 16' is cut off and the ends 9 and 16'C
The printed circuit board 13 is connected to the conductor wiring 18 of the node wiring board 2.

In this way, the conductor lead 1 5 of the non-common electrode. 1 5
'The other end is a different conductor wiring 17 of the printed wiring board 2.
18 so that they do not come into contact with each other. 1
9 is an insulating paulownia made of resin or the like. 2'l ,21
' is a positioning hole provided in the insulating films 20, 20', and 22 is a positioning hole provided in the printed wiring board 2. The position of each hole corresponds to pI), for example, by passing a pin, etc., to easily position the conductor leads 12, 12', and prevent misalignment when the other ends 12b, 12'b of 12' are overlapped. .

As described above, according to this embodiment, by stacking two memory LSI chips 6, 6' and mounting them on the printed wiring board 2, the area occupied by the memory LSI chips 6, 6' can be halved. Since a large number of memory LSI chips can be mounted on a printed wiring board 2 having a fixed area, a large-capacity IC memory card can be realized.

1 of the further stacked memory LSI chips 6 and 6'
4 conductor leads 1 2 . connected to the common electrode. 1 2'
Since the other ends 12b and 12'b are overlapped and connected to the conductor wiring 16 of the printed wiring board 2, the wiring space is reduced, the cost of the printed wiring board 2 is reduced, and the signal transmission speed is increased. A fast IC memory card can be realized.

-! Insulating film 20. 20' positioning hole 21
．． 21', by passing a bottle or the like through the positioning hole 22 of the printed wiring board 2, lamination can be easily performed with high precision;
Conductor lead 1 2 . 1 2' other end portions 12b, 12
It is possible to prevent short circuits caused by misalignment of 'b' and realize a highly reliable IC memory card that is easy to assemble.

Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a partial sectional view of the IC memory card according to the third embodiment, and FIG. 8 is a sectional view showing the bent state of the other end of the conductor lead. As shown in Figure 7 p and Figure 8, Print 1 - Wiring board 2K stored in case 1
is the same type of memory LSI CHIsub 6, 6', 6
″′ is stacked in three layers in the direction that the electrode arrangement 1 6 \− and the rows are the same.Memory
One end 121L of a conductor lead 12 is connected to the electrode 10 of the LSI chip 6 via a metal protrusion 11. The conductor leads 12 are formed and supported on an insulating film 20. The above configuration is the same for the other memory LSI chips 6', 6''.

Conductor lead 12.12', 12'' other end 12b,
1 2'b, 12''b are the ends of the insulating film 20N
,20′&,20′/? From L to bending height H in Figure 8
, the bending angle of each person is molded differently. The electrodes 10, 10', 10'' are connected to the memory LSI chips 6, e/. Since it is a common electrode of 6", the other end portions 12b, 12'b, 12"b of the conductor leads are stacked in the order of lamination and joined to the conductor wiring 16 of the printed wiring board 2 by a method such as soldering. There is. Distance s between stacked memory LSI chips 6 and 6/, e/ and 6''
, s' are conductor leads 12b, 12'b, 12''
The appropriate value (0.0
4 key or higher 0. 6 fl). 19 is a memory LSI chip 6 and e/. This is the insulating material inserted between e/ and 6''.

As described above, according to this embodiment, a plurality of memory LSI chips 6, etc. are stacked on the printed wiring board 2, and the other ends 12b, 12' of the conductor leads connected to the common electrode 10, etc. b, 12''b are stacked in the stacked order and are bonded to the conductor wiring 16 of the printed wiring board 2. Therefore, a large number of memory LSI chips 6 etc. can be mounted on the printed wiring board 2 of a fixed area, so It is possible to realize an IC memory card with a high capacity, the wiring space is small, the cost of the printed wiring board 2 can be reduced, and an IC memory card with a high signal transmission speed can be realized.

Furthermore, the other end portions 1 2b and 1 2'b of the conductor leads
, 12'lb are bent and molded into different shapes to form memory LSI chips 6, 6', and 6'.
By keeping the distance between ' and 6' at an appropriate value and inserting insulating material 11 and 11' between them, contact between one end of the conductor lead 12 & and the memory LSI chip 6' can be prevented. etc., it is possible to realize a highly reliable IC memory card.

1 7. Effects of the Invention The present invention connects one end of a conductor lead to an electrode of a memory LSI chip on an IC memory card, and connects the memory LSI chip to a printed wiring board with its electrode arrangement. A plurality of memory LSI chips are stacked in the same direction, and the other end of the conductor lead of the common electrode of each of the five stacked memory LSI chips is overlapped in the stacking direction and bonded to the conductor wiring of the printed wiring board. The other end of the conductor lead connected to the common electrode is connected to a corresponding different conductor wiring of the printed wiring board for each level of stacked chips. Each conductor lead is formed and supported on an insulating film, and the other end of the conductor lead is bent and molded from the end of the insulating film into a shape that corresponds to the number of stacked layers of the chip. Positioning holes are provided in the wiring board, and insulating holes are inserted between the stacked chips. Therefore,
Since the area occupied by the memory LSI chip is significantly reduced, a large number of memories can be mounted on a limited area of the IJ/wiring board.
It is possible to increase the capacity by mounting 18 LSI chips, and since the conductor leads of the common electrode between each stacked chip are directly connected, the wiring space is reduced and the Flynn 1. It is possible to reduce the cost of the wiring board by 1 and increase the speed of signal transmission.

Furthermore, the positioning holes in the insulating film make it easy to assemble the stacks, and the other ends of the thin conductor leads are bent and formed, allowing the stacking of adjacent upper and lower memory L
This has an excellent effect in that a highly reliable IC memory card can be realized by maintaining an appropriate distance between SI chips and inserting an insulating material between the chips.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view of an IC memory card according to an embodiment of the present invention, FIG. 2 is a partial sectional view thereof, and FIG.
The figure is also a block diagram of the electric circuit, and Figure 4 is the memory L.
FIG. 5 is a partial cross-sectional view of an IC memory card according to a second embodiment of the present invention; FIG.
FIG. 7 is a partial sectional view of an IC memory card according to the third embodiment of the present invention, FIG. 8 is a perspective view showing the bent state of the other end of the conductor lead, and FIG. FIG. 2 is a sectional view showing a conventional IC memory card. 2...Printed wiring board, 3...Memory circuit section, 4...Control 1/roll rl5 part, 6...
...External ink face circuit section, 6...Memory LSI chip, 10...Electrode (common), 13...
... Electrode (uncommon), 12.15 ... Conductor lead, 12a, 15a ... One end of the conductor lead,
12b, 1sb...Other end of conductor lead, 16,
1 completed, 18... Conductor wiring, 19... Insulating material, 20... Insulating film, 20Δ...
End of insulating film, 21.22...positioning hole.

Claims (8)

[Claims] (1) An IC memory card characterized by having a plurality of stacked memory LSI chips mounted on a printed wiring board. (2) a printed wiring board, a memory LSI chip mounted on this printed wiring board, and one end of which is connected to the memory LSI chip;
a conductor lead that is connected to an electrode of the chip and whose other end is connected to the printed wiring board side, and a plurality of the memory LSI chips are stacked on the printed wiring board in a direction in which the electrode arrangement is the same. At the same time, the IC memory card is characterized in that the conductor leads of the common electrodes of the stacked memory LSI chips are overlapped in the stacking direction and joined to the conductor wiring of the printed wiring board. (3) The IC memory card according to claim 2, wherein the conductor lead group is formed and supported on an insulating film. (4) The other end of the conductor lead connected to the non-common electrode of the memory LSI chip is branched into layers corresponding to the number of stacked layers, and each branched conductor lead becomes one wire depending on the number of layers to be stacked. According to claim 2, each of the branched conductor leads is electrically non-conductive and connected to different conductor wiring corresponding to each floor of the printed wiring board. IC memory card. (5) The other end of the conductor lead connected to the non-common electrode of the memory LSI chip is drawn out to a different position for each layer of the stack, and a different conductor wire is connected to each layer of the printed wiring board. Claim 2 joined to
IC memory card described in section. (6) The IC memory card according to claim 2, wherein an insulating material is inserted between the stacked memory LSI chips. (7) The IC memory card according to claim 2, wherein the printed wiring board comprises a memory circuit section, a control circuit section, and an external interface circuit section. (8) When the other end of the conductor lead is connected to the end of the insulating film,
4. The IC memory card according to claim 3, wherein each layer of memory LSI chips is bent and molded into a different shape. (9) The IC according to claim 3, wherein the insulating film is provided with a plurality of positioning holes, and positioning holes are provided at at least two positions corresponding to the positioning holes of the film of the printed wiring board.
Memory card.