JP2007115726A - Capacitor device - Google Patents

Capacitor device Download PDF

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JP2007115726A
JP2007115726A JP2005302500A JP2005302500A JP2007115726A JP 2007115726 A JP2007115726 A JP 2007115726A JP 2005302500 A JP2005302500 A JP 2005302500A JP 2005302500 A JP2005302500 A JP 2005302500A JP 2007115726 A JP2007115726 A JP 2007115726A
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capacitor
input
moisture
capacitor device
capacitor element
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JP4815992B2 (en
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Takashi Kanemoto
貴志 金本
Toshiaki Masaki
敏煥 正木
Hideyasu Ishihara
秀泰 石原
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a capacitor device which can be used in an environment of moisture prevention/high temperature/high humidity without extending peeling of a lead wire and a sealing material to a capacitor element, even if stress is applied to an input line or an output line using the lead wire of the capacitor element at the time of working. <P>SOLUTION: The capacitor device is provided with a capacitor main body 1, and input/ouptut terminals 2 and 3 connected to the capacitor main body. The capacitor main body 1 is provided with the capacitor elements 4, the input/output line 5 connecting the capacitor elements to the input/output terminals 2 and 3 and having bending parts 6 and 8, the sealing material 9 sealing the capacitor elements 4 and the input/output line 5 comprising at least the bending parts 6 and 8 and a cabinet 10 filled with the sealing material. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、高温多湿の環境で使用するコンデンサ装置の防湿に関するものである。   The present invention relates to moisture prevention of a capacitor device used in a hot and humid environment.

従来、コンデンサ装置の防湿に関する発明は、金属化フィルムを巻き回したコンデンサ素子を筐体(ケース)に収納し、筐体の開口部に樹脂積層マイカ板の樹脂(エポキシ樹脂,シリコン樹脂)を配置し、コンデンサ本体を封止するためにウレタン樹脂を筐体に充填して硬化させたものがある(例えば、特許文献1参照)。   Conventionally, the invention relating to moisture-proofing of capacitor devices has a capacitor element wrapped with a metallized film housed in a casing (case), and a resin laminated epoxy resin (silicone resin) is placed in the opening of the casing In order to seal the capacitor body, there is a case in which a casing is filled with urethane resin and cured (for example, see Patent Document 1).

特開2003−289011号公報(第1図)Japanese Patent Laying-Open No. 2003-289011 (FIG. 1)

しかし、特許文献1に記載のコンデンサ装置は、樹脂積層マイカ板により筐体内への湿気の流入を防ぐ発明で、コンデンサ素子に接続されるリード線を用いた入力線路又は出力線路とが直線構造であるために、コンデンサ装置の加工時等においてリード線に応力が掛かると、リード線と封止用の封止材とが剥離し、両者の間に隙間ができ、その隙間から湿気が流入してコンデンサ素子が吸湿しコンデンサ装置の静電容量が変化及びコンデンサ素子の材料定数である誘電正接の増加や絶縁抵抗の低下の性能劣化が生じるという問題があった。   However, the capacitor device described in Patent Document 1 is an invention that prevents the inflow of moisture into the housing by the resin laminated mica plate, and the input line or output line using the lead wire connected to the capacitor element has a linear structure. For this reason, when stress is applied to the lead wire during processing of the capacitor device, the lead wire and the sealing material are peeled off, creating a gap between them, and moisture flows from the gap. There is a problem in that the capacitor element absorbs moisture, the capacitance of the capacitor device changes, and the performance degradation such as an increase in dielectric loss tangent, which is a material constant of the capacitor element, and a decrease in insulation resistance occur.

また、特許文献1は筐体の開口部に配置した樹脂積層マイカ板の樹脂の構造や成分の違いによるコンデンサ素子の静電容量を示しているだけで、コンデンサ素子が吸湿時に、金属化フィルムを巻き回したコンデンサ素子よりも、マイカコンデンサのような湿気に対す耐性が低いコンデンサ素子では、影響が大きい誘電正接の増加や絶縁抵抗の低下については、言及していないという課題もあった。   Further, Patent Document 1 merely shows the capacitance of the capacitor element due to the difference in resin structure and components of the resin laminated mica plate disposed in the opening of the housing. In the capacitor element having a lower resistance to moisture such as a mica capacitor than the wound capacitor element, there is a problem that the increase in the dielectric loss tangent and the decrease in the insulation resistance, which have a great influence, are not mentioned.

この発明は、上記のような課題を解消するためになされたもので、コンデンサ素子のリード線を用いた入力線路又は出力線路とに加工時等に応力が掛かったとしても、リード線と封止用の封止材と剥離がコンデンサ素子まで延伸せずに、防湿高温多湿の環境でも使用が可能なコンデンサ装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and even if stress is applied to the input line or output line using the lead wire of the capacitor element during processing, the lead wire and the seal are sealed. It is an object of the present invention to provide a capacitor device that can be used in a moisture-proof, high-temperature and high-humidity environment without peeling off from the sealing material and the capacitor element.

請求項1の発明に係るコンデンサ装置は、コンデンサ本体と、このコンデンサ本体に接続された入出力端子とを備え、前記コンデンサ本体は、コンデンサ素子と、このコンデンサ素子を前記入出力端子に接続し、屈曲部を有する入出力線路と、前記コンデンサ素子及び、少なくとも前記屈曲部を含む前記入出力線路を封止する封止材と、この封止材を充填する筐体と有することを特徴とするものである。   The capacitor device according to the invention of claim 1 includes a capacitor body and an input / output terminal connected to the capacitor body, the capacitor body connects the capacitor element and the capacitor element to the input / output terminal, An input / output line having a bent portion, the capacitor element, a sealing material for sealing the input / output line including at least the bent portion, and a casing filled with the sealing material. It is.

請求項2の発明に係るコンデンサ装置は、前記屈曲部が、前記筐体の底面に対する垂直面において屈曲した請求項1に記載のものである。   The capacitor device according to a second aspect of the present invention is the capacitor device according to the first aspect, wherein the bent portion is bent in a plane perpendicular to the bottom surface of the casing.

請求項3の発明に係るコンデンサ装置は、前記屈曲部は、前記筐体の底面に対する水平面において屈曲した請求項1に記載のものである。   The capacitor device according to a third aspect of the present invention is the capacitor device according to the first aspect, wherein the bent portion is bent in a horizontal plane with respect to a bottom surface of the casing.

以上のように、請求項1に係る発明によれば、コンデンサ素子の入力線路又は出力線路に応力が掛かった場合でも、入力線路又は出力線路と封止用の封止材との剥離がコンデンサ素子までに及ばないコンデンサ装置を得ることができる。   As described above, according to the first aspect of the present invention, even when stress is applied to the input line or the output line of the capacitor element, the separation between the input line or the output line and the sealing material for sealing is the capacitor element. Capacitor devices that do not reach the limit can be obtained.

請求項2に係る発明によれば、入出力線路に屈曲部が設けられていても筐体の底面に対する垂直面の方向において小型化したコンデンサ装置を得ることができる。   According to the second aspect of the present invention, it is possible to obtain a capacitor device that is miniaturized in the direction perpendicular to the bottom surface of the housing even if the input / output line is provided with a bent portion.

請求項3に係る発明によれば、入出力線路に屈曲部が設けられていても筐体の底面に対する水平面の方向において小型化したコンデンサ装置を得ることができる。   According to the third aspect of the present invention, it is possible to obtain a capacitor device that is miniaturized in the direction of the horizontal plane with respect to the bottom surface of the housing, even if the input / output line is provided with a bent portion.

実施の形態
以下、この発明の実施の形態について図1〜図6を用いて説明する。図1は実施の形態によるコンデンサ装置の外観図、図2は実施の形態によるコンデンサ装置の断面図で、図2(a)はコンデンサ素子が一つの場合、図2(b)はコンデンサ素子が複数の場合(並列接続)、図3はコンデンサ装置への防湿対策前後の防湿(耐湿性能)評価後の材料定数の比較図、図3(a)は防湿対策前のコンデンサ装置、図3(b)は防湿対策後のコンデンサ装置、図4は防湿対策前後の静電容量の比較図、図5は防湿対策前後の誘電正接の比較図、図6は防湿対策前後の絶縁抵抗の比較図であり、図1,図2において、1はコンデンサ本体、2はコンデンサ本体1に接続された入力端子、3はコンデンサ本体に接続された出力端子、4はコンデンサ素子、5はコンデンサ素子1を入力端子2に接続する入力線路、6は入力端子2とコンデンサ素子4との間で入力線路5上に形成された屈曲部、7はコンデンサ素子1を出力端子3に接続する出力線路、8は出力端子3とコンデンサ素子4との間で出力線路7上に形成された屈曲部、9はコンデンサ素子4及び、少なくとも屈曲部6を含む入力線路5及び屈曲部8を含む出力線路7を封止する封止材、10は封止材9を充填する筐体である。図中、同一符号は、同一又は相当部分を示しそれらについての詳細な説明は省略する。
Embodiment Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an external view of a capacitor device according to the embodiment, FIG. 2 is a cross-sectional view of the capacitor device according to the embodiment, FIG. 2A shows a single capacitor element, and FIG. 3 (parallel connection), FIG. 3 is a comparison diagram of material constants after evaluation of moisture resistance (moisture resistance performance) before and after moisture-proof measures for the capacitor device, FIG. 3 (a) is a capacitor device before moisture-proof measures, FIG. 3 (b) 4 is a comparison diagram of capacitance before and after moisture proof measures, FIG. 5 is a comparison diagram of dielectric loss tangent before and after moisture proof measures, and FIG. 6 is a comparison diagram of insulation resistance before and after moisture proof measures. 1 and 2, reference numeral 1 denotes a capacitor body, 2 denotes an input terminal connected to the capacitor body 1, 3 denotes an output terminal connected to the capacitor body, 4 denotes a capacitor element, and 5 denotes a capacitor element 1 as an input terminal 2. Input line to connect, 6 is input A bent portion formed on the input line 5 between the child 2 and the capacitor element 4, 7 is an output line connecting the capacitor element 1 to the output terminal 3, and 8 is an output between the output terminal 3 and the capacitor element 4. The bent portion formed on the line 7, 9 is a sealing material for sealing the capacitor element 4, the input line 5 including at least the bent portion 6, and the output line 7 including the bent portion 8, and 10 is the sealing material 9. It is a housing to be filled. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

コンデンサ装置のコンデンサ本体1は、入出力端子である入力端子2と出力端子とをそなえており、コンデンサ素子4が樹脂で形成された筐体10内に収納され、その筐体10に封止材9を充填し、固定した構造である。コンデンサ素子4に接続された入力線路5と出力線路7とが筐体10の底面に対する垂直面において屈曲した屈曲部6,8を有し、それぞれ入力端子2と出力端子とに接続されている。また、コンデンサ素子を複数並べて接続してもよい。その場合は図2(b)に示すようにコンデンサ素子4(a),4(b),4(c)を並列に配置して屈曲部6(a),6(b),6(c)を有する入力線路5と屈曲部8(a),8(b),8(c)を有する出力線路7とにより入出力端子に接続してもよいし、コンデンサ素子4を直列に並べてもよい。このような構成にすると、静電容量の大きなコンデンサ装置にも適用することができる。なお、入出力端子と入出力線路とを一体化構造にすることにより入出力端子を省略してもよい。   The capacitor body 1 of the capacitor device has an input terminal 2 and an output terminal which are input / output terminals, and the capacitor element 4 is housed in a housing 10 formed of resin, and a sealing material is provided in the housing 10. 9 is filled and fixed. The input line 5 and the output line 7 connected to the capacitor element 4 have bent portions 6 and 8 that are bent in a plane perpendicular to the bottom surface of the housing 10, and are connected to the input terminal 2 and the output terminal, respectively. Further, a plurality of capacitor elements may be connected side by side. In that case, as shown in FIG. 2 (b), capacitor elements 4 (a), 4 (b), 4 (c) are arranged in parallel and bent portions 6 (a), 6 (b), 6 (c) May be connected to the input / output terminal by the input line 5 having the above and the output line 7 having the bent portions 8 (a), 8 (b), 8 (c), or the capacitor elements 4 may be arranged in series. Such a configuration can be applied to a capacitor device having a large capacitance. The input / output terminals may be omitted by integrating the input / output terminals and the input / output lines.

次に防湿(耐湿性能)評価について説明する。評価に使用したコンデンサ装置は、コンデンサ素子4は3kV、0.1μFのマイカコンデンサを用いた。評価用の試料としてコンデンサ装置は図2(a)に示すコンデンサ素子4が1個のものを3個製作して防湿防湿対策後のコンデンサ装置とし、同じコンデンサ素子4を使用して屈曲部が無く直線状(棒状)の入出力線路を有するものを3個製作して防湿防湿対策前のコンデンサ装置とした。なお、入出力線路が直線状で、筐体10の開口部の位置が異なっていても、コンデンサ装置の防湿には影響しない   Next, description will be made on evaluation of moisture resistance (moisture resistance). In the capacitor device used for the evaluation, the capacitor element 4 was a 3 kV, 0.1 μF mica capacitor. As a sample for evaluation, three capacitor devices having one capacitor element 4 shown in FIG. 2A are manufactured as a capacitor device after taking measures against moisture and moisture, and the same capacitor element 4 is used and there is no bent portion. Three capacitors having straight (bar-shaped) input / output lines were manufactured to provide a capacitor device before taking measures against moisture and moisture. Note that even if the input / output lines are straight and the position of the opening of the housing 10 is different, the moisture resistance of the capacitor device is not affected.

評価試験はヒートショック試験(−30℃/+60℃、各1時間100サイクル)の後、高温高湿試験(85℃85%RH、1000時間)を実施した。コンデンサ装置の性能確認として材料定数である静電容量,誘電正接,絶縁抵抗について測定した。測定のタイミングは、試験開始前・試験途中・試験終了後とし、試験途中の測定はヒートショックの場合は50サイクル後、高温高湿試験の場合は、およそ168時間毎に測定を行なった。なお、対策前のコンデンサ装置は672時間まで、対策後のコンデンサ装置は1000時間まで測定を行ない、試験途中の測定では、恒温槽から取り出して2時間以上放置してから測定を行った。試験結果を図3に示す。また、ヒートショック試験回数と高温高湿試験時間に対策前と対策後の全データは、図4,図5,図6に、それぞれ、防湿対策前後の静電容量の比較図,防湿対策前後の誘電正接の比較図,防湿対策前後の絶縁抵抗の比較図に示す。図3より、対策前,対策後ともに、ヒートショック試験後の測定では初期値からほとんど変化していないが、高温高湿試験後の測定では全ての性能において防湿の影響により性能劣化がみられる。しかし、性能劣化の大きさは対策前と比較して対策後のコンデンサは大きく改善されている。すなわち、静電容量は高温高湿試験後に対策前は3%程度上昇していたのが、対策後は1%程度まで減少している。また、誘電正接は高温高湿試験後に対策前は0.002→0.014(7倍)まで増大したのに対し、対策後は0.003→0.006(2倍)と大きく改善されている。さらに、絶縁抵抗は高温高湿試験後に対策前は8000MΩ→17MΩまで低下し絶縁不良となったが、対策後は8000MΩ→2000MΩと低下の割合が大きく改善されている。さらに、図2(b)に示すようにコンデンサ素子を複数並べて接続したコンデンサ装置に、同様の試験を実施し、同程度の高い耐湿性能結果が得られた。   In the evaluation test, a heat shock test (−30 ° C./+60° C., 100 cycles each for 1 hour) was followed by a high temperature and high humidity test (85 ° C., 85% RH, 1000 hours). To confirm the performance of the capacitor device, we measured the material constants of capacitance, dielectric loss tangent, and insulation resistance. The timing of the measurement was before the start of the test, during the test, and after the test was completed. The measurement during the test was performed after 50 cycles in the case of heat shock, and approximately every 168 hours in the case of the high temperature and high humidity test. In addition, the capacitor device before the countermeasure was measured up to 672 hours, and the capacitor device after the countermeasure was measured up to 1000 hours. In the measurement during the test, the measurement was performed after taking out from the thermostat and leaving it for 2 hours or more. The test results are shown in FIG. In addition, the data before and after the countermeasures for the number of heat shock tests and the high-temperature and high-humidity test time are shown in Fig. 4, Fig. 5 and Fig. 6, respectively. A comparison diagram of dielectric loss tangent and a comparison diagram of insulation resistance before and after moisture-proof measures are shown. From FIG. 3, the measurement after the heat shock test is almost unchanged from the initial value both before and after the measure, but in the measurement after the high-temperature and high-humidity test, the performance is deteriorated due to the influence of moisture prevention. However, the magnitude of the performance deterioration is greatly improved in the capacitor after the countermeasure as compared with that before the countermeasure. That is, the capacitance increased about 3% before the countermeasure after the high-temperature and high-humidity test, but decreased to about 1% after the countermeasure. In addition, the dielectric loss tangent increased from 0.002 to 0.014 (7 times) before the countermeasure after the high temperature and high humidity test, but greatly improved from 0.003 to 0.006 (2 times) after the countermeasure. Yes. In addition, the insulation resistance decreased from 8000 MΩ to 17 MΩ before the countermeasure after the high temperature and high humidity test, resulting in an insulation failure. Further, as shown in FIG. 2 (b), a similar test was performed on a capacitor device in which a plurality of capacitor elements were connected side by side, and a similar high moisture resistance performance result was obtained.

評価試験の結果、マイカ等の湿度に対して性能劣化の著しいコンデンサ素子を使用したコンデンサ装置において、入出力線路に屈曲部を設けることにより、高温多湿な環境で長期間使用される場合において、静電容量,誘電正接,絶縁抵抗等の性能劣化の速度を従来品よりも抑えることができる。すなわち、コンデンサ素子4の入出力線路を筐体10底面に対する垂直面において屈曲させた屈曲部を設けたことにより、コンデンサ装置の加工時等において入出力線路に応力が掛かると、入出線路の直線部分で封止材との剥離が生じても、屈曲部以降に応力が掛かり難いので、湿気の進入をこの屈曲部までで食い止めることができる。また、入出力線路を平板状にすることで、入出力線路と封止材との密着性が増し、入出力線路に外部応力がかかる場合にも、耐湿性能を保持することができる。   As a result of the evaluation test, in a capacitor device using a capacitor element whose performance is significantly deteriorated with respect to humidity such as mica, by providing a bent portion in the input / output line, when it is used for a long time in a high temperature and humidity environment, The speed of performance deterioration such as capacitance, dielectric loss tangent, insulation resistance, etc. can be suppressed compared to conventional products. That is, when the input / output line of the capacitor element 4 is bent in a plane perpendicular to the bottom surface of the housing 10 and a stress is applied to the input / output line at the time of processing the capacitor device, the linear portion of the input / output line Even if peeling occurs from the sealing material, it is difficult for stress to be applied after the bent portion, so that moisture can be prevented from entering up to the bent portion. Further, by making the input / output line flat, the adhesion between the input / output line and the sealing material is increased, and moisture resistance can be maintained even when external stress is applied to the input / output line.

他の実施の形態
この発明の他の実施の形態について図7を用いて説明する。図7は他の実施の形態によるコンデンサ装置の透視図であり、図中、同一符号は、同一又は相当部分を示しそれらについての詳細な説明は省略する。図7に示すコンデンサ装置は、コンデンサ素子4に接続された入力線路5と出力線路7とが筐体10の底面に対する水平面において屈曲した屈曲部6,8を有し、それぞれ入力端子2と出力端子とに接続されている。実装上、コンデンサの厚みを厚くできない場合に適用することができる。コンデンサ素子4の入力線路を水平面内おいて曲げることでも垂直面において曲げる場合と同様な効果が得られ、コンデンサ装置を小型化することができる。
Other Embodiments Another embodiment of the present invention will be described with reference to FIG. FIG. 7 is a perspective view of a capacitor device according to another embodiment, in which the same reference numerals denote the same or corresponding parts, and a detailed description thereof will be omitted. The capacitor device shown in FIG. 7 has bent portions 6 and 8 in which an input line 5 and an output line 7 connected to the capacitor element 4 are bent in a horizontal plane with respect to the bottom surface of the housing 10, respectively. And connected to. This can be applied when the thickness of the capacitor cannot be increased for mounting. Even when the input line of the capacitor element 4 is bent in a horizontal plane, the same effect as in the case of bending in the vertical plane can be obtained, and the capacitor device can be downsized.

この発明の実施の形態によるコンデンサ装置の外観図である。1 is an external view of a capacitor device according to an embodiment of the present invention. この発明の実施の形態によるコンデンサ装置の断面図である。It is sectional drawing of the capacitor | condenser apparatus by embodiment of this invention. この発明のコンデンサ装置への防湿対策前後の防湿(耐湿性能)評価後の材料定数の比較図である。FIG. 3 is a comparison diagram of material constants after evaluation of moisture resistance (moisture resistance) before and after moisture resistance measures for the capacitor device of the present invention. この発明の防湿対策前後の静電容量の比較図である。It is a comparison figure of the electrostatic capacitance before and after the moisture proof measures of this invention. この発明の防湿対策前後の誘電正接の比較図である。It is a comparison figure of the dielectric loss tangent before and behind the moisture proof measures of this invention. この発明の防湿対策前後の絶縁抵抗の比較図である。It is a comparison figure of the insulation resistance before and behind the moisture proof measures of this invention. この発明の他の実施の形態によるコンデンサ装置の透視図である。It is a perspective view of the capacitor | condenser apparatus by other embodiment of this invention.

符号の説明Explanation of symbols

1…コンデンサ本体、2…入力端子、3…出力端子、4…コンデンサ素子、5…入力線路、6…屈曲部、7…出力線路、8…屈曲部、9…封止材、10…筐体

DESCRIPTION OF SYMBOLS 1 ... Capacitor main body, 2 ... Input terminal, 3 ... Output terminal, 4 ... Capacitor element, 5 ... Input line, 6 ... Bending part, 7 ... Output line, 8 ... Bending part, 9 ... Sealing material, 10 ... Housing

Claims (3)

コンデンサ本体と、このコンデンサ本体に接続された入出力端子とを備え、前記コンデンサ本体は、コンデンサ素子と、このコンデンサ素子を前記入出力端子に接続し、屈曲部を有する入出力線路と、前記コンデンサ素子及び、少なくとも前記屈曲部を含む前記入出力線路を封止する封止材と、この封止材を充填する筐体と有するコンデンサ装置。 A capacitor body; and an input / output terminal connected to the capacitor body. The capacitor body includes a capacitor element, an input / output line having the bent portion connected to the capacitor element, and the capacitor. The capacitor | condenser apparatus which has a sealing material which seals the said input / output track | line including an element and the said bending part at least, and the housing | casing filled with this sealing material. 前記屈曲部は、前記筐体の底面に対する垂直面において屈曲した請求項1に記載のコンデンサ装置。 The capacitor device according to claim 1, wherein the bent portion is bent in a plane perpendicular to a bottom surface of the housing. 前記屈曲部は、前記筐体の底面に対する水平面において屈曲した請求項1に記載のコンデンサ装置。


The capacitor device according to claim 1, wherein the bent portion is bent in a horizontal plane with respect to a bottom surface of the housing.


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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015015344A (en) * 2013-07-04 2015-01-22 岡谷電機産業株式会社 Case-armored capacitor
JP2020150230A (en) * 2019-03-15 2020-09-17 Tdk株式会社 Electronic component

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JPS641269A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Semiconductor device
JPH01169018U (en) * 1988-05-18 1989-11-29
JPH09326466A (en) * 1996-04-02 1997-12-16 Hitachi Ltd Soldering method for stacked semiconductor device, fabrication thereof and stacked semiconductor module
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Publication number Priority date Publication date Assignee Title
JP2015015344A (en) * 2013-07-04 2015-01-22 岡谷電機産業株式会社 Case-armored capacitor
JP2020150230A (en) * 2019-03-15 2020-09-17 Tdk株式会社 Electronic component
JP7338181B2 (en) 2019-03-15 2023-09-05 Tdk株式会社 electronic components

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