WO2017098797A1 - Pressure sensor - Google Patents

Pressure sensor Download PDF

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Publication number
WO2017098797A1
WO2017098797A1 PCT/JP2016/079778 JP2016079778W WO2017098797A1 WO 2017098797 A1 WO2017098797 A1 WO 2017098797A1 JP 2016079778 W JP2016079778 W JP 2016079778W WO 2017098797 A1 WO2017098797 A1 WO 2017098797A1
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WO
WIPO (PCT)
Prior art keywords
pressure
pressure sensor
detection surface
gas
opening
Prior art date
Application number
PCT/JP2016/079778
Other languages
French (fr)
Japanese (ja)
Inventor
篠原　英司
阿部　英樹
聡 和賀
敬介 中山
佐藤　弘樹
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Publication of WO2017098797A1 publication Critical patent/WO2017098797A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings

Definitions

  • the present invention relates to a pressure sensor that detects the pressure of a gas, and more particularly, to a pressure sensor that introduces two different gases into a case and detects the differential pressure.
  • the pressure sensor that detects the pressure of gas is an absolute pressure type that measures absolute pressure with reference to vacuum, measures positive or negative pressure with reference to atmospheric pressure, or measures the differential pressure between two different pressures Classified as differential pressure type.
  • a pressure sensor that introduces gas to the front surface side and the back surface side of a pressure sensor element having a semiconductor diaphragm type detection surface is generally used.
  • the back side of the pressure-sensitive sensor element is bonded to the case via a pedestal or the like, and the pressure on the back side is received by a pressure introduction hole provided in the pedestal. Since this pressure introduction hole must be made thin, water may enter due to moisture or condensation, which may hinder pressure measurement. Moreover, if the water freezes, the sensor element may be destroyed by the expansion. Therefore, in the pressure sensor disclosed in Patent Document 1, water and the like are prevented from entering by covering both surfaces of the pressure-sensitive sensor element with a soft gel or oil protective member.
  • FIG. 17 is a cross-sectional view showing the pressure sensor of Patent Document 1.
  • the case 910 includes a connector case portion 911 in which a terminal pin 910a is insert-molded, and a first pressure port that is joined to the connector case portion 911 to form a first pressure introduction passage 921 and a second pressure introduction passage 922, respectively.
  • the chip 930 is a semiconductor diaphragm type sensing unit that is made of a semiconductor substrate such as a silicon semiconductor, has a diaphragm as a thin portion on one side, and has a recess 932 formed by anisotropic etching or the like on the other side. is there.
  • a base 940 made of glass or the like is bonded to the back surface of the chip 930 and integrated with the chip 930.
  • the chip 930 is housed and fixed to the case 910 by being bonded to the bottom surface of the recess 911 a via the pedestal 940 with an adhesive.
  • the base 940 is formed with a hole 941 as a part of the second pressure introduction passage 922.
  • the passage area of the hole 941 is smaller than the opening area of the recess 932 in the chip 930.
  • the case 910 is provided with a first protective member 970 that covers the surface of the chip 930 and a second protective member 980 for preventing foreign matter from entering the second pressure introduction passage 922. Is filled in the second pressure introduction passage 922.
  • the first protection member 970 is filled in the concave portion 911a of the connector case portion 911, and covers and protects the surface of the chip 930, the connection portion between the wire 960, the wire 960 and the terminal pin 910a, and the base 940.
  • the second protective member 980 is filled in the hole 941 of the pedestal 940 as a part of the second pressure introduction passage, and protrudes from the hole 941 to be out of the second pressure introduction passage 922.
  • the introduction part 913a is filled up.
  • the second protective member 980 is, for example, injected with a fluorosilicone gel added with 30 to 35% of a fluorosilicone oil in a vacuum, or vacuumed and degassed after injection to obtain the state shown in FIG. It is arranged.
  • the present invention solves the above-described problems, and an object of the present invention is to provide a pressure sensor that is easier to manufacture and more resistant to moisture and condensation than the conventional differential pressure type.
  • a pressure sensor includes a pressure-sensitive sensor element having a detection surface and capable of detecting pressure, and a case in which the pressure-sensitive sensor element is disposed so that the gas is in contact with the detection surface.
  • the pressure-sensitive sensor element includes a first element in which a pressure reference chamber is provided and a first gas is in contact with the detection surface; A reference chamber, and a second element disposed so that the second gas is in contact with the detection surface, and enables measurement of a differential pressure between the first gas and the second gas.
  • the case isolates the first storage part from which the first element is stored, the second storage part from which the second element is stored, and the first storage part from the second storage part.
  • a partition wall wherein the first element is disposed in the first storage portion, A first opening into which the first gas is introduced is provided in one storage portion, and the second element is configured such that the detection surface of the first element and the second element are in the second storage portion.
  • the detection surface is arranged so as to face the same direction, and a second opening through which the second gas is introduced is provided in the second storage portion, and the second storage portion is The two openings are provided so as to be opened in a direction different from that of the first opening.
  • two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as pressure sensitive sensor elements for measuring the differential pressure of two gases from different directions, and the detection surfaces thereof are in the same direction. Therefore, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation. Therefore, it is possible to provide a pressure sensor that is easy to manufacture and is resistant to moisture and condensation as compared with the conventional differential pressure type.
  • the second storage portion has at least two or more second openings.
  • the second opening is an opening located at the outer surface of the introduction hole that extends from the outer surface of the case toward the detection surface of the second element.
  • the introduction hole is preferably arranged so as to extend from two different directions when the detection surface is viewed in plan with respect to the detection surface of the second element.
  • one side is arranged on the side where it is easily wetted / condensed and the other side is arranged on the side where it is difficult to get wet / condensed, so that the atmospheric pressure can be measured more reliably on the other side.
  • At least one of the introduction holes may have a cross-sectional area perpendicular to the direction in which the introduction hole extends larger than the other introduction holes.
  • the second opening is disposed on a first direction side and a second direction side facing each other with the second element sandwiched when the detection surface is viewed in plan view, It is preferable that the shape is a long hole whose longitudinal direction is a third direction intersecting the first direction and the second direction.
  • the case includes a mold substrate provided with a fixing portion to which the first element and the second element are fixed, a housing provided with the second opening, and these And a cap that is spaced apart from the detection surface of the second element, and the partition includes the mold substrate, the housing, the cap, and the sealing member. It is preferable to consist of a stop material.
  • the case can be easily manufactured by configuring the case by joining a plurality of members.
  • two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as pressure sensitive sensor elements for measuring the differential pressure of two gases from different directions, and the detection surfaces thereof are in the same direction. Since it arrange
  • FIGS. 4A and 4B are explanatory views showing a first element and a second element.
  • FIG. 4A is a schematic cross-sectional view under atmospheric pressure
  • FIG. 4B is a schematic cross-sectional view under high pressure.
  • It is a top view which shows the mold substrate of 1st Embodiment. In 1st Embodiment, it is a top view which shows the mold board
  • FIG. 1st Embodiment it is a top view of the housing which accommodated the mold board
  • 1st Embodiment it is a top view of the housing which accommodated the mold board
  • FIG. 1 is a perspective view showing a pressure sensor 1 according to a first embodiment of the present invention.
  • FIG. 2 is a bottom view showing the pressure sensor 1.
  • FIG. 3 is a plan view showing the pressure sensor 1.
  • 4A and 4B are explanatory views showing the first element 11.
  • FIG. 4A is a schematic cross-sectional view under atmospheric pressure P0
  • FIG. 4B is a schematic cross-sectional view under high pressure P1.
  • FIG. 5 is a plan view showing the mold substrate 31.
  • FIG. 6 is a plan view showing a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted.
  • FIG. 7 is a perspective view showing the housing 32.
  • FIG. 8 is a plan view of the housing 32 shown in FIG. FIG.
  • FIG. 9 is a plan view of a housing 32 that accommodates a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted.
  • FIG. 10 is a plan view of the housing 32 that houses the mold substrate 31 with the cap 33 attached.
  • 11 is a cross-sectional view taken along line XI-XI in FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 9 to 12, the applied protective material 40 is omitted, and the first element 11 and the second element 12 and the detection surfaces 11a and 12a are shown so as to be understood. Further, in FIG. 11 and FIG. 12, the bonding wire is omitted to make the cross-sectional view easier to see.
  • the pressure sensor 1 according to the first embodiment of the present invention is provided with a first opening 20a of the case 20 in the Z1 direction, as shown in FIGS. As shown in FIG. 2, second openings 20 b and 20 c of the case 20 are provided in the direction opposite to the first opening 20 a.
  • the pressure sensor 1 is attached to an attachment portion (not shown), and at this time, the first gas is in contact with the first opening 20a and the second gas is in contact with the second openings 20b and 20c.
  • the pressure sensor 1 of the present embodiment includes, as the pressure sensor element 10, a first element 11 disposed so that the first gas is in contact with a second element 12 disposed so that the second gas is in contact therewith. And a differential pressure sensor that measures the differential pressure between the first gas and the second gas using these elements.
  • the first element 11 is a box-shaped external pressure sensor manufactured on a semiconductor substrate such as a silicon semiconductor. As shown in FIG. 4A, the first element 11 is provided with a detection surface 11a in which a thin diaphragm is arranged on one side (surface on the Z1 side), and a hollow pressure reference chamber 11b is provided inside the diaphragm. Thus, the deflection of the diaphragm due to the pressure difference between the detection surface 11a side and the pressure reference chamber 11b can be detected as a resistance change.
  • the pressure reference chamber 11b is maintained in a so-called vacuum that is sufficiently reduced in pressure compared to the atmospheric pressure P0. As a result, the first element 11 constitutes an absolute pressure type pressure sensor based on vacuum.
  • the deflection becomes large when the pressure on the detection surface 11a side is a high pressure P1. Further, when the pressure is lower than the atmospheric pressure P0, the deflection becomes small.
  • the second element 12 is a box-shaped external pressure sensor manufactured on a semiconductor substrate such as a silicon semiconductor. As shown in FIG. 4A, the second element 12 is provided with a detection surface 12a on one surface side of a thin diaphragm, and a hollow pressure reference chamber 12b on the inner surface side. The deflection of the diaphragm due to the pressure difference with the chamber 12b can be detected as a resistance change.
  • the pressure reference chamber 12b is maintained in a so-called vacuum that is sufficiently reduced in pressure compared to the atmospheric pressure P0.
  • the 2nd element 12 comprises the pressure sensor of the absolute pressure type on the basis of vacuum. In contrast to the deflection of the diaphragm at the atmospheric pressure P0, as shown in FIG.
  • the deflection becomes large when the pressure on the detection surface 11a side is a high pressure P1. Further, when the pressure is lower than the atmospheric pressure P0, the deflection becomes small.
  • the second element 12 has the same external shape and the same diaphragm thickness as the first element 11, and the same pressure-sensitive performance.
  • the first element 11 and the second element 12 are disposed on a mold substrate 31 shown in FIG.
  • the mold substrate 31 constitutes a part of the case 20 as will be described later.
  • the mold substrate 31 is made of an insulating synthetic resin and is insert-molded integrally with the conductive member 31d.
  • PPS polyphenylene sulfide
  • phenol resin phenol resin
  • the conductive member 31d is processed into a desired pattern shape from a conductive metal plate. A part of the conductive member 31 d is exposed in a recess formed in the mold substrate 31.
  • the concave portion of the mold substrate 31 constitutes a first storage portion 21 that stores the first element 11 and a second storage portion 22 that stores the second element 12.
  • a fixing portion 31 a to which the first element 11 and the second element 12 are fixed is provided in the recess that becomes the first storage portion 21 and the second storage portion 22.
  • through holes 31b and 31c penetrating in the Z1-Z2 direction are provided on the X1 side and the X2 side of the fixing portion 31a of the second storage portion 22 in plan view of the mold substrate 31. Further, the conductive member 31 d integrated with the mold substrate 31 partially protrudes from the side surface of the mold substrate 31.
  • the conductive member 31d integrated with the mold substrate 31 is electrically connected to connection terminals (not shown) formed on the first element 11 and the second element 12 by bonding wires.
  • a circuit board 15 that detects the resistance values of the first element 11 and the second element 12 and outputs an electrical signal is fixed to the mold substrate 31 with a conductive adhesive, and the conductive member exposed from the mold substrate 31. 31d is electrically connected by a bonding wire.
  • the first element 11 and the second element 12 and the circuit board 15 have bonding wires mounted on the same surface, and the bonding wires can be connected together in one bonding process.
  • the protective material 40 which protects the 1st element 11, the 2nd element 12, and a bonding wire is apply
  • FIG. 6 shows a state before the protective material 40 is applied.
  • the mold substrate 31 is accommodated in a housing 32 shown in FIGS.
  • the housing 32 constitutes a part of the case 20 as will be described later.
  • the housing 32 is made of synthetic resin, and has a main body portion 32a for accommodating the mold substrate 31 and a connector portion 32e for connecting an electric cable for outputting an electric signal.
  • synthetic resin for example, PBT (polybutylene terephthalate), nylon resin, or the like is used.
  • a terminal member 32d penetrating between the main body portion 32a and the connector portion 32e is provided to constitute a connector terminal.
  • the terminal member 32d is made of a conductive metal material, and is fixed to the main body portion 32a with an adhesive.
  • the main body 32a has a box shape with an opening on the Z1 side, and is provided with cylindrical portions 32b and 32c protruding from the Z2 side plate surface to the Z1 side.
  • the cylindrical portions 32b and 32c are provided with introduction holes 24b and 24c.
  • the introduction hole 24c is divided into two inside the cylindrical portion 32b, and the cross-sectional area perpendicular to the direction in which the introduction hole 24c extends is small.
  • the area of the cross section orthogonal to the direction in which the introduction hole 24b extends is larger than the area of the cross section of the introduction hole 24c.
  • the mold substrate 31 is arranged as shown in FIG. 9, and the cylindrical portions 32 b and 32 c are inserted into the through holes 31 b and 31 c and accommodated in the main body portion 32 a of the housing 32.
  • the conductive member 31d of the mold substrate 31 is electrically connected to the terminal member 32d.
  • a cap 33 is disposed in the opening on the Z1 side of the second storage portion 22 so as to face the detection surface 12a of the second element 12, and is fixed with an adhesive.
  • a sealing material 34 is applied between members of the mold substrate 31 and the housing 32, and the mold substrate 31, the housing 32, the cap 33, and the sealing material 34 constitute the case 20 including the partition wall 23.
  • the sealing material 34 is made of a curable synthetic resin excellent in environmental resistance, such as an epoxy resin, and has a rigidity that keeps hermeticity and does not deform even when a differential pressure is applied.
  • the second storage portion 22 has a cap 33 bonded thereto, and is partitioned from the first opening 20 a by the mold substrate 31 and the cap 33.
  • the mold substrate 31 is provided with through holes 31b and 31c in two different directions (X1 side and X2 side) when the detection surface 12a is viewed in plan.
  • the second storage portion 22 is configured by a mold substrate 31, a cap 33, a housing 32, and a sealing material 34 except for the introduction holes 24 b and 24 c of the cylindrical portions 32 b and 32 c. It will be in the state surrounded by the partition wall 23. As shown in FIG. 12, the introduction holes 24 b and 24 c communicating with the second storage portion 22 are opened on the Z2 side of the housing 32. The second openings 20 b and 20 c are openings located on the outer surface of the housing 32 of the introduction holes 24 b and 24 c of the second storage part 22.
  • a protective member 44 is applied to protect the circuit board 15 and the wire bonding from being exposed to the first gas.
  • the cap 33 is also covered with the protective member 44.
  • the protective material 40 applied to the first storage portion 21 is shown without being omitted.
  • the protective material 40 is a synthetic resin having elasticity capable of transmitting a gas pressure to the detection surfaces 11a and 12a. Specifically, fluorosilicone gel or fluorine gel can be used.
  • the mold substrate 31 is accommodated in the main body 32a of the housing 32, and then the cap 33 is joined and the protective member 44 is applied. However, the mold substrate 31 after the bonding process and the protective material 40 application process is applied. The joining process of the cap 33 and the applying process of the protective member 44 may be continued, and then the sealing material 34 may be applied to the housing portion of the housing 32 and then the mold substrate 31 may be disposed.
  • the first element 11 is disposed in the first storage portion 21 having the mold substrate 31 as the partition wall 23.
  • the first storage portion 21 is provided with a first opening 20a into which a first gas is introduced.
  • the main body portion 32a of the housing 32 is on the detection surface 11a side ( Z1 side) is opened, and the 1st opening part 20a is comprised.
  • a cylindrical first port portion (not shown) can be attached to the housing 32.
  • the second openings 20b and 20c of the second storage portion 22 are opened at two locations on the outer surface portion of the housing 32 on the Z2 side opposite to the first opening 20a. ing. Moreover, in order to introduce
  • the mold substrate 31 and the housing 32 constituting the case 20 are separated and fixed by the sealing material 34, the molds for molding the synthetic resin are respectively used. Configuration is simplified. Moreover, since it is easy to support the mold substrate 31 in the bonding process, the bonding process of the first element 11 and the second element 12 is stabilized. Therefore, the manufacturing process including the mounting process is facilitated. Instead of preparing the mold substrate 31 separately, it is possible to integrate the conductive member 31d with the housing 32 and fix the first element 11 and the second element 12 to the housing 32.
  • the housing 32 is provided with a concave portion so as to be the first storage portion 21 and the second storage portion 22, so that the first storage portion 21 and the second storage portion 22 are isolated, and the housing 32 is Two openings 20b and 20c may be provided.
  • the first storage portion 21 having the first opening 20a and the second storage portion 22 having the second openings 20b and 20c provided in the direction opposite to the first opening 20a are the case 20. Are separated by a partition wall 23.
  • the first element 11 housed in the first housing part 21 is an absolute pressure type pressure sensor whose resistance value changes according to the pressure of the first gas introduced from the first opening 20a. By applying a predetermined current to the first element 11 from the circuit board 15 connected to the bonding wire via the conductive member 31d, a voltage corresponding to the resistance value is generated between the output terminals and input to the circuit board 15. Is done.
  • the second element 12 housed in the second housing part 22 is an absolute pressure type pressure sensor whose resistance value changes according to the pressure of the second gas introduced from the second openings 20b and 20c. It is.
  • a voltage corresponding to the resistance value is generated between the output terminals and input to the circuit board 15. Is done.
  • the process which outputs the difference of the input voltage from the 1st element 11 and the input voltage from the 2nd element 12 is performed, and the electric signal according to the differential pressure
  • the pressure sensor 1 of the present embodiment has a configuration in which a circuit board 15 is incorporated and an electrical signal corresponding to the differential pressure is output.
  • each resistance value may be measured by an external circuit connected to the connector terminal and converted into an electric signal of a differential pressure.
  • the circuit board 15 may be configured as a circuit configuration that outputs the absolute pressures of the first element 11 and the second element 12 as electrical signals, and may be configured as a system configuration that calculates the differential pressure even in an external circuit connected to the connector terminal. .
  • the pressure sensor 1 of the present embodiment uses an absolute pressure type first element 11 and a second element 12 as the pressure-sensitive sensor element 10.
  • the differential pressure type pressure sensor is provided with a pressure introduction hole for introducing gas to the back side of the diaphragm having the detection surface, whereas the absolute pressure type first element 11 and the second element are provided as shown in FIG.
  • the element 12 has no pressure introducing hole. Since there is no need to provide a pressure introduction hole, the structure is simple, and the portion other than the diaphragm having the detection surface can be a highly rigid structure. Further, in the differential pressure type pressure sensor, it is necessary to make the area of the cross section of the pressure introduction hole smaller than the area of the diaphragm.
  • the gas to be introduced contains a condensable substance such as moisture, it will be liquefied or solidified in the pressure chamber on the pressure introduction hole or the back side of the diaphragm, and the gas will be introduced. There is a worry that will be disturbed. In this respect as well, the absolute pressure type first element 11 and the second element 12 do not need to worry.
  • the differential pressure type pressure sensor is sensitive to mechanical stress through the fixing adhesive, and is likely to cause measurement error due to stress.
  • thermal stress due to the difference in thermal expansion from the adhesive is also added, and the measurement error after temperature correction tends to increase.
  • the absolute pressure type first element 11 and second element 12 in the pressure sensor 1 of the present embodiment have high mechanical strength on the back side to be fixed, and therefore these measurement errors are small.
  • the differential pressure type pressure sensor requires a minimum number of bonding wires to be connected. Since the pressure sensor 1 of this embodiment needs to connect the 1st element 11 and the 2nd element 12 with a separate bonding wire, the number of bonding wires is increasing. However, since the mounting surfaces of the first element 11 and the second element 12 are in the same direction and the same height, the labor in the bonding process hardly increases. Therefore, even if the number of bonding wires increases, it does not affect the ease of manufacturing. Unlike the pressure sensor 1 of the present embodiment, when the mounting surfaces of the two absolute pressure type pressure sensitive sensor elements 10 are different from each other, it is necessary to perform bonding separately. Easiness cannot be obtained. This problem occurs even when the circuit board 15 is mounted in a different direction. Therefore, it is the point which brings the ease of manufacture to make a mounting surface into the same height and the same direction like the pressure sensor 1 of this embodiment. In addition, the occurrence of defects in manufacturing is small.
  • the differential pressure type pressure sensor is usually configured to measure the differential pressure of two gases from different directions.
  • the pressure sensor 1 of this embodiment it arrange
  • the second openings 20b and 20c are provided in the second storage portion 22 for storing the second element 12, and the detection surface 11a and the detection surface 12a. It is provided on the opposite side. Thereby, the introduction directions of the two gases can be made the same as those of a normal differential pressure type pressure sensor, and it becomes easy to apply to a device using the normal differential pressure type pressure sensor.
  • a thin diaphragm is part of an isolation wall that separates two gases.
  • a diaphragm such as a silicon semiconductor breaks, the gas flows out from the higher pressure to the lower pressure, resulting in a problem that the two gases are mixed.
  • the first storage portion 21 and the second storage portion 22 are isolated by the isolation wall of the case 20, and even when the diaphragms of the first element 11 and the second element 12 are broken, Isolation between the first storage unit 21 and the second storage unit 22 is maintained. Therefore, even when the diaphragm is broken, there is no problem that the two gases are mixed.
  • the introduction holes 24 b and 24 c are gas introduction portions extending from the second openings 20 b and 20 c formed in the outer surface portion of the housing 32 toward the detection surface 12 a of the second element 12.
  • the introduction holes 24b and 24c are continuous with through holes 31b and 31c provided in two different directions (X1 side and X2 side) when the detection surface 12a is viewed in plan.
  • the introduction holes 24b and 24c and the second openings 20b and 20c are provided at positions away from the second storage part 22, the water around the pressure sensor 1 is splashed with water and condensed. Sometimes, it becomes difficult for two places to be simultaneously closed.
  • the second openings 20b and 20c are not in a horizontal height position.
  • the second opening passes through the introduction holes 24b and 24c. It becomes easy to remove from 20b, 20c.
  • the pressure sensor 1 of this embodiment it is set as the structure which is easy to drain water from the introduction hole 24b with a large cross-sectional area.
  • the introduction hole 24b is arranged on the side that is likely to be exposed to water and condensation, and the introduction hole 24c that is less likely to enter the water is located on the side that is difficult to receive water and condensation, so that the introduction hole 24c is more It is possible to measure the atmospheric pressure reliably.
  • the pressure-sensitive sensor element 10 has a pressure reference chamber 11b provided therein, a first element 11 disposed so that a first gas is in contact with the detection surface 11a, and a pressure reference chamber 12b provided therein, and a detection surface. And a second element 12 arranged so that the second gas is in contact with 12a. And it is electrically connected so that the differential pressure
  • the case 20 includes a first storage portion 21 that stores the first element 11, a second storage portion 22 that stores the second element 12, and a partition wall 23 that separates the first storage portion 21 and the second storage portion 22. ,have.
  • the first element 11 is disposed in the first storage part 21, and a first opening 20 a through which a first gas is introduced is provided in the first storage part 21.
  • the second element 12 is arranged in the second storage portion 22 so that the detection surface 11a of the first element 11 and the detection surface 12a of the second element 12 face the same direction. Further, second openings 20b and 20c into which the second gas is introduced are provided in the second storage part 22, and the second openings 20b and 20c are the first openings in the second storage part 22. It is provided open in a direction different from the part 20a.
  • two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as the pressure sensitive sensor element 10 for measuring the differential pressure of two gases from different directions, and the respective detection surfaces 11a, Since 12a is arranged so as to face the same direction, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation.
  • the second storage portion 22 has at least two or more second openings 20b and 20c. According to this configuration, even if any one of the second openings 20b and 20c is wetted / condensed, pressure can be applied elsewhere.
  • the second openings 20b and 20c are openings located on the outer surface portions of the introduction holes 24b and 24c, and the introduction holes 24b and 24c define the detection surface 12a with respect to the detection surface 12a of the second element 12. It is preferable that they are arranged so as to extend from two different directions when viewed from above. According to this configuration, one is arranged on the side where it is likely to be wetted / condensed and the other is arranged on the side where it is difficult to be wetted / condensed, whereby the atmospheric pressure can be measured more reliably on the other side.
  • At least one of the introduction holes 24b and 24c has a cross-sectional area perpendicular to the direction in which the introduction holes 24b and 24c extend, compared to the other introduction holes. Can be big. According to this configuration, by increasing the cross-sectional area of at least one of the introduction holes 24b and 24c, it is easy to drain water when it is wet, and it is easy to prevent water exposure and condensation.
  • the case 20 includes a mold substrate 31 provided with a fixing portion 31a to which the first element 11 and the second element 12 are fixed, and second openings 20b and 20c. It has a housing 32 provided, a sealing material 34 disposed between these members, and a cap 33 that is spaced apart from the detection surface 12a of the second element 12.
  • the partition wall 23 is preferably composed of a mold substrate 31, a housing 32, a cap 33, and a sealing material 34.
  • the case 20 can be manufactured easily by configuring the case 20 by joining a plurality of members.
  • FIG. 13 is a bottom view showing the pressure sensor 2 according to the second embodiment of the present invention.
  • FIG. 14 is a plan view showing the pressure sensor 2.
  • FIG. 15 is a plan view of a housing 32 that accommodates a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted in the second embodiment.
  • FIG. 16 is a plan view of the housing 32 with the cap 33 attached in the second embodiment.
  • the difference from the pressure sensor 1 of the first embodiment is the shape of the second openings 20b and 20c, the introduction holes 24b and 24c, and the cylindrical portions 32b and 32c.
  • the reference numerals of the first embodiment are used as they are, and the description of the configuration is omitted.
  • the second openings 20b and 20c have a long hole shape with the Y1-Y2 direction as the longitudinal direction.
  • the cylindrical portions 32b and 32c of the housing 32 are provided in an oval shape in a plan view, and the cylindrical portions 32b and 32c are provided with introduction holes 24b and 24c having an oval cross-sectional shape. Yes.
  • the introduction holes 24 b and 24 c extend from the second openings 20 b and 20 c formed in the outer surface portion of the housing 32 toward the detection surface 12 a of the second element 12. Gas introduction part.
  • the introduction holes 24b and 24c are provided on different first direction sides and second direction sides (X1 side and X2 side) that face each other with the second element 12 in between when the detection surface 12a is viewed in plan.
  • the introduction holes 24b and 24c are in the form of elongated holes whose longitudinal direction is the third direction intersecting the first direction and the second direction.
  • the introduction holes 24b and 24c are each extended toward the detection surface 12a of the second element 12 while being wide in the longitudinal direction, and communicate with the second storage portion 22 in which the second element 12 is disposed. .
  • the pressure-sensitive sensor element 10 includes a first element 11 in which a pressure reference chamber 11b is provided and a first gas is in contact with the detection surface 11a. And a second element 12 disposed so that the second gas is in contact with the detection surface 12a. And it is electrically connected so that the differential pressure
  • the case 20 includes a first storage portion 21 that stores the first element 11, a second storage portion 22 that stores the second element 12, and a partition wall 23 that separates the first storage portion 21 and the second storage portion 22. ,have.
  • the first element 11 is disposed in the first storage part 21, and a first opening 20 a through which a first gas is introduced is provided in the first storage part 21.
  • the second element 12 is arranged in the second storage portion 22 so that the detection surface 11a of the first element 11 and the detection surface 12a of the second element 12 face the same direction. Further, a second opening 20b through which a second gas is introduced is provided in the second storage part 22, and the second storage part 22 is different from the first opening 20a in the second opening 20b. Open in the direction.
  • two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as the pressure sensitive sensor element 10 for measuring the differential pressure of two gases from different directions, and the respective detection surfaces 11a, Since 12a is arranged so as to face the same direction, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation.
  • the second storage portion 22 has at least two second openings 20b and 20c. According to this configuration, even if one place of the second opening 20b is exposed to water and condensation, pressure can be applied elsewhere.
  • the second openings 20b and 20c are openings located on the outer surfaces of the introduction holes 24b and 24c, and the introduction holes 24b and 24c are provided on the second element 12.
  • the detection surface 12a is disposed so as to extend from two different directions when the detection surface 12a is viewed in plan. According to this configuration, one is arranged on the side where it is likely to be wetted / condensed and the other is arranged on the side where it is difficult to be wetted / condensed, whereby the atmospheric pressure can be measured more reliably on the other side.
  • the second openings 20b and 20c have a first direction side and a second direction side facing each other across the second element 12 when the detection surface 12a is viewed in plan view. It is suitable that it is an elongate hole shape which makes the longitudinal direction the 3rd direction which is arrange
  • the case 20 is provided with a mold substrate 31 provided with a fixing portion 31a to which the first element 11 and the second element 12 are fixed, and a second opening 20b.
  • the partition wall 23 is preferably composed of a mold substrate 31, a housing 32, a cap 33, and a sealing material 34.
  • the case 20 can be manufactured easily by configuring the case 20 by joining a plurality of members.
  • the pressure sensor 1 according to the first embodiment of the present invention and the pressure sensor 2 according to the second embodiment have been specifically described.
  • the present invention is not limited to the above-described embodiment, Various modifications can be made without departing from the scope.
  • the present invention can be modified as follows, and these also belong to the technical scope of the present invention.
  • the mold substrate 31 is used to mount the first element 11 and the second element 12 in advance and then accommodate them in the housing 32.
  • the mold substrate 31 is divided into the mold substrate 31 and the housing 32. It may not be a case.
  • the second openings 20b and 20c are arranged on the opposite side of the first opening 20a so as to be easily compared with the conventional differential pressure type pressure sensor. It is not limited.
  • the second openings 20b and 20c may be arranged on the side surface inclined by 90 degrees with respect to the first opening 20a.
  • the introduction holes 24b and 24c are more preferably arranged so as to extend from two different directions when the detection surface 12a is viewed in plan.
  • the two second openings 20b and 20c are used, but the number of openings is not limited to two and may be three or more.
  • the introduction holes 24b and 24c may be gathered in one opening.
  • the introduction holes 24b and 24c are gathered and opened in a cylindrical port portion, the first opening 20a side is opened to the reference atmosphere side, and the second opening portions 20b and 20c are introduced to the side.
  • the aspect which makes 2nd gas to be measured gas be sufficient.

Abstract

[Problem] To provide a pressure sensor that has a simple construction and is resistant to wetting, condensation and the like. [Solution] This pressure sensor includes a first housing portion which houses a first element, a second housing portion 22 which houses a second element 12, and a separating wall 23 which separates the first housing portion and the second housing portion 22, wherein: the first element is disposed in the first housing portion and a first opening portion 20a through which a first gas is introduced is provided in the first housing portion; the second element 12 is disposed in the second housing portion 22 in such a way that a detecting surface of the first element and a detecting surface 12a of the second element 12 face in the same direction; second opening portions 20b, 20c through which a second gas is introduced are provided in the second housing portion 22; and the second housing portion 22 is provided in such a way that the second opening portions 20b, 20c open in a different direction to the first opening portion 20a.

Description

圧力センサPressure sensor
　本発明は、気体の圧力を検出する圧力センサに関し、特に、異なる２つの気体をケースに導入し、その差圧を検出する圧力センサに関する。 The present invention relates to a pressure sensor that detects the pressure of a gas, and more particularly, to a pressure sensor that introduces two different gases into a case and detects the differential pressure.
　気体の圧力を検出する圧力センサは、真空を基準として絶対圧を測定する絶対圧タイプ、大気圧を基準として正圧または負圧を測定したり、異なる２つの圧力の差圧を測定したりする差圧タイプに分類される。 The pressure sensor that detects the pressure of gas is an absolute pressure type that measures absolute pressure with reference to vacuum, measures positive or negative pressure with reference to atmospheric pressure, or measures the differential pressure between two different pressures Classified as differential pressure type.
　差圧タイプでは、半導体ダイヤフラム式の検知面を有する感圧センサ素子の表面側および裏面側に気体を導入する圧力センサが一般的である。この圧力センサにおいては、感圧センサ素子の裏面側が台座等を介してケースに接着され、台座に設けられた圧力導入孔によって裏面側の圧力を受圧していた。この圧力導入孔は細くしなければならないため、被水や結露によって水が浸入することで、圧力の測定に支障が出ることがある。またその水が凍結するとその膨張でセンサ素子が破壊される恐れがある。そのため、特許文献１に開示された圧力センサでは、感圧センサ素子の両面を柔らかいゲルやオイルの保護部材で覆うことで水などの進入を防いでいる。 In the differential pressure type, a pressure sensor that introduces gas to the front surface side and the back surface side of a pressure sensor element having a semiconductor diaphragm type detection surface is generally used. In this pressure sensor, the back side of the pressure-sensitive sensor element is bonded to the case via a pedestal or the like, and the pressure on the back side is received by a pressure introduction hole provided in the pedestal. Since this pressure introduction hole must be made thin, water may enter due to moisture or condensation, which may hinder pressure measurement. Moreover, if the water freezes, the sensor element may be destroyed by the expansion. Therefore, in the pressure sensor disclosed in Patent Document 1, water and the like are prevented from entering by covering both surfaces of the pressure-sensitive sensor element with a soft gel or oil protective member.
　図１７は、特許文献１の圧力センサを示す断面図である。ケース９１０は、ターミナルピン９１０ａがインサート成形されたコネクタケース部９１１、このコネクタケース部９１１に接合されてそれぞれ第１の圧力導入通路９２１、第２の圧力導入通路９２２を構成する第１の圧力ポート部９１２、第２の圧力ポート部９１３よりなる。チップ９３０は、シリコン半導体等の半導体基板よりなり、その一面側に薄肉部としてのダイヤフラムを有し、他面側に異方性エッチング等により形成された凹部９３２を有する半導体ダイヤフラム式のセンシング部である。そして、チップ９３０の裏面には、ガラス等よりなる台座９４０が接合され、チップ９３０と一体化されている。チップ９３０は、この台座９４０を介して、凹部９１１ａの底面に接着剤により接着され、ケース９１０に収納固定されている。台座９４０には、第２の圧力導入通路９２２の一部としての孔部９４１が形成されている。この孔部９４１の通路面積はチップ９３０における凹部９３２の開口面積よりも小さいものとしている。さらに、ケース９１０に、チップ９３０の表面を被覆する第１の保護部材９７０が設けられているとともに、第２の圧力導入通路９２２内への異物の侵入を防止するための第２の保護部材９８０が第２の圧力導入通路９２２内に充填された構成を有している。 FIG. 17 is a cross-sectional view showing the pressure sensor of Patent Document 1. The case 910 includes a connector case portion 911 in which a terminal pin 910a is insert-molded, and a first pressure port that is joined to the connector case portion 911 to form a first pressure introduction passage 921 and a second pressure introduction passage 922, respectively. Part 912 and a second pressure port part 913. The chip 930 is a semiconductor diaphragm type sensing unit that is made of a semiconductor substrate such as a silicon semiconductor, has a diaphragm as a thin portion on one side, and has a recess 932 formed by anisotropic etching or the like on the other side. is there. A base 940 made of glass or the like is bonded to the back surface of the chip 930 and integrated with the chip 930. The chip 930 is housed and fixed to the case 910 by being bonded to the bottom surface of the recess 911 a via the pedestal 940 with an adhesive. The base 940 is formed with a hole 941 as a part of the second pressure introduction passage 922. The passage area of the hole 941 is smaller than the opening area of the recess 932 in the chip 930. Further, the case 910 is provided with a first protective member 970 that covers the surface of the chip 930 and a second protective member 980 for preventing foreign matter from entering the second pressure introduction passage 922. Is filled in the second pressure introduction passage 922.
　第１の保護部材９７０は、コネクタケース部９１１の凹部９１１ａ内に充填され、チップ９３０の表面、ワイヤ９６０、ワイヤ９６０とターミナルピン９１０ａとの接続部、台座９４０を被覆して保護している。第２の保護部材９８０は、第２の圧力導入通路の一部としての台座９４０の孔部９４１内に充填されるとともに、この孔部９４１からはみ出して、第２の圧力導入通路９２２のうち圧力導入部９１３ａ側にまで充填されている。第２の保護部材９８０は、例えば、フロロシリコーンゲルにフロロシリコーン系オイルが３０～３５％添加されたものを、真空中で注入するか、あるいは注入後真空脱泡して、図１７の状態に配設されている。 The first protection member 970 is filled in the concave portion 911a of the connector case portion 911, and covers and protects the surface of the chip 930, the connection portion between the wire 960, the wire 960 and the terminal pin 910a, and the base 940. The second protective member 980 is filled in the hole 941 of the pedestal 940 as a part of the second pressure introduction passage, and protrudes from the hole 941 to be out of the second pressure introduction passage 922. The introduction part 913a is filled up. The second protective member 980 is, for example, injected with a fluorosilicone gel added with 30 to 35% of a fluorosilicone oil in a vacuum, or vacuumed and degassed after injection to obtain the state shown in FIG. It is arranged.
特許第４３２０９６３号公報Japanese Patent No. 4320963
　しかしながら、特許文献１に記載された圧力センサの構造の場合には、被水や結露などに対して耐性がある圧力センサとするために、細い穴の中にゲルないしオイルを充填しなければならないため、製造が煩雑になる。また、チップ９３０を小型化しようとすると、台座９４０の孔部９４１をさらに細くして、通路面積を小さくしなければならず、そのような圧力センサの製造は困難であった。 However, in the case of the structure of the pressure sensor described in Patent Document 1, gel or oil must be filled in a narrow hole in order to make the pressure sensor resistant to moisture or condensation. Therefore, the manufacturing becomes complicated. Further, when trying to reduce the size of the chip 930, the hole 941 of the base 940 must be further narrowed to reduce the passage area, and it is difficult to manufacture such a pressure sensor.
　本発明は、上述した課題を解決するもので、従来の差圧タイプに比べて、製造が容易で、被水や結露などに対して耐性がある圧力センサを提供することを目的とする。 The present invention solves the above-described problems, and an object of the present invention is to provide a pressure sensor that is easier to manufacture and more resistant to moisture and condensation than the conventional differential pressure type.
　本発明の圧力センサは、検知面を有し、圧力を検知可能な感圧センサ素子と、前記検知面に気体が接するように前記感圧センサ素子が配置されるケースと、を備え、気体の圧力を電気信号に変換する圧力センサにおいて、前記感圧センサ素子は、内部に圧力基準室が設けられ、前記検知面に第１の気体が接するように配置される第１素子と、内部に圧力基準室が設けられ、前記検知面に第２の気体が接するように配置される第２素子と、を有し、前記第１の気体と前記第２の気体との差圧を測定可能とするように電気接続され、前記ケースは、前記第１素子を収納する第１収納部と、前記第２素子を収納する第２収納部と、前記第１収納部と前記第２収納部とを隔離する隔壁と、を有し、前記第１素子は前記第１収納部内に配置され、前記第１収納部に前記第１の気体が導入される第１の開口部が設けられており、前記第２素子は、前記第２収納部内に前記第１素子の前記検知面と前記第２素子の前記検知面とが同一の方向を臨むように配置され、前記第２収納部に前記第２の気体が導入される第２の開口部が設けられており、前記第２収納部は、前記第２の開口部が前記第１の開口部と異なる方向に開放して設けられていることを特徴とする。 A pressure sensor according to the present invention includes a pressure-sensitive sensor element having a detection surface and capable of detecting pressure, and a case in which the pressure-sensitive sensor element is disposed so that the gas is in contact with the detection surface. In the pressure sensor for converting pressure into an electric signal, the pressure-sensitive sensor element includes a first element in which a pressure reference chamber is provided and a first gas is in contact with the detection surface; A reference chamber, and a second element disposed so that the second gas is in contact with the detection surface, and enables measurement of a differential pressure between the first gas and the second gas. And the case isolates the first storage part from which the first element is stored, the second storage part from which the second element is stored, and the first storage part from the second storage part. A partition wall, wherein the first element is disposed in the first storage portion, A first opening into which the first gas is introduced is provided in one storage portion, and the second element is configured such that the detection surface of the first element and the second element are in the second storage portion. The detection surface is arranged so as to face the same direction, and a second opening through which the second gas is introduced is provided in the second storage portion, and the second storage portion is The two openings are provided so as to be opened in a direction different from that of the first opening.
　この構成によれば、異なる方向からの２つの気体の差圧を測定する感圧センサ素子として圧力導入孔のない絶対圧タイプの感圧センサ素子を２個用いるとともに、それぞれの検知面が同一方向を臨むように配置されているので、製造が容易である。さらに、圧力導入孔のない感圧センサ素子であるので、被水や結露などに対して耐性がある。したがって、従来の差圧タイプに比べて、製造が容易で、被水や結露などに対して耐性がある圧力センサを提供することができる。 According to this configuration, two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as pressure sensitive sensor elements for measuring the differential pressure of two gases from different directions, and the detection surfaces thereof are in the same direction. Therefore, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation. Therefore, it is possible to provide a pressure sensor that is easy to manufacture and is resistant to moisture and condensation as compared with the conventional differential pressure type.
　また、本発明の圧力センサは、前記第２収納部が前記第２の開口部を少なくとも２箇所以上有することが好適である。 In the pressure sensor of the present invention, it is preferable that the second storage portion has at least two or more second openings.
　この構成によれば、第２の開口部の１箇所が被水・結露しても他のところで圧力がかかるようにできる。 According to this configuration, even if one part of the second opening is wetted / condensed, pressure can be applied elsewhere.
　また、本発明の圧力センサは、前記第２の開口部が、前記ケースの外面部から前記第２素子の前記検知面に向かって延設された導入孔の前記外面部に位置する開口であって、前記導入孔が、前記第２素子の前記検知面に対して、前記検知面を平面視したときに異なる２方向から延設されるように配置されていることが好ましい。 In the pressure sensor of the present invention, the second opening is an opening located at the outer surface of the introduction hole that extends from the outer surface of the case toward the detection surface of the second element. The introduction hole is preferably arranged so as to extend from two different directions when the detection surface is viewed in plan with respect to the detection surface of the second element.
　この構成によれば、一方を被水・結露し易い側に配置するとともに、他方を被水・結露し難い側に配置することで、他方側でより確実に気圧測定ができる。 According to this configuration, one side is arranged on the side where it is easily wetted / condensed and the other side is arranged on the side where it is difficult to get wet / condensed, so that the atmospheric pressure can be measured more reliably on the other side.
　また、本発明の圧力センサにおいて、前記導入孔の少なくとも１つは、前記導入孔が延設する方向に対して直交する断面の面積が、他の前記導入孔より大きいものとすることができる。 Further, in the pressure sensor of the present invention, at least one of the introduction holes may have a cross-sectional area perpendicular to the direction in which the introduction hole extends larger than the other introduction holes.
　この構成によれば、導入孔の少なくとも１つの断面積をより大きくすることによって、被水したときの水抜きを容易にし、被水・結露を防止し易くなる。 According to this configuration, by increasing the cross-sectional area of at least one of the introduction holes, it is easy to drain water when it is wet, and it is easy to prevent water and condensation.
　また、本発明の圧力センサは、前記第２の開口部が、前記検知面を平面視したとき、前記第２素子を挟んで対向する第１方向側と第２方向側とに配置され、前記第１方向および前記第２方向に交差する第３方向を長手方向とする長穴形状であることが好適である。 Further, in the pressure sensor of the present invention, the second opening is disposed on a first direction side and a second direction side facing each other with the second element sandwiched when the detection surface is viewed in plan view, It is preferable that the shape is a long hole whose longitudinal direction is a third direction intersecting the first direction and the second direction.
　この構成によれば、長穴形状にすることで、傾けて配置すると水抜きが容易になり、より確実に被水することを避けることができる。 こ の According to this configuration, by forming the elongated hole shape, it is easy to drain water when it is arranged at an angle, and it is possible to avoid being more reliably wet.
　また、本発明の圧力センサにおいて、前記ケースは、前記第１素子および前記第２素子が固定される固定部が設けられたモールド基板と、前記第２の開口部が設けられたハウジングと、これらの部材間に配置される封止材と、前記第２素子の前記検知面に対向して離間配置されるキャップと、を有し、前記隔壁が前記モールド基板と前記ハウジングと前記キャップと前記封止材とからなることが好適である。 In the pressure sensor of the present invention, the case includes a mold substrate provided with a fixing portion to which the first element and the second element are fixed, a housing provided with the second opening, and these And a cap that is spaced apart from the detection surface of the second element, and the partition includes the mold substrate, the housing, the cap, and the sealing member. It is preferable to consist of a stop material.
　この構成によれば、ケースを複数部材の接合で構成することにより、製造が容易である。 こ の According to this configuration, the case can be easily manufactured by configuring the case by joining a plurality of members.
　本発明によれば、異なる方向からの２つの気体の差圧を測定する感圧センサ素子として圧力導入孔のない絶対圧タイプの感圧センサ素子を２個用いるとともに、それぞれの検知面が同一方向となるように配置されているので、製造が容易である。さらに、圧力導入孔のない感圧センサ素子であるので、被水や結露などに対して耐性がある。したがって、従来の差圧タイプに比べて、製造が容易で、被水や結露などに対して耐性がある圧力センサを提供することができる。 According to the present invention, two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as pressure sensitive sensor elements for measuring the differential pressure of two gases from different directions, and the detection surfaces thereof are in the same direction. Since it arrange | positions so that it may become, manufacture is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation. Therefore, it is possible to provide a pressure sensor that is easy to manufacture and is resistant to moisture and condensation as compared with the conventional differential pressure type.
本発明の第１実施形態の圧力センサを示す斜視図である。It is a perspective view which shows the pressure sensor of 1st Embodiment of this invention. 第１実施形態の圧力センサを示す底面図である。It is a bottom view which shows the pressure sensor of 1st Embodiment. 第１実施形態の圧力センサを示す平面図である。It is a top view which shows the pressure sensor of 1st Embodiment. 第１素子および第２素子を示す説明図であり、図４（ａ）は大気圧下での模式断面図であり、図４（ｂ）は高圧下での模式断面図である。FIGS. 4A and 4B are explanatory views showing a first element and a second element. FIG. 4A is a schematic cross-sectional view under atmospheric pressure, and FIG. 4B is a schematic cross-sectional view under high pressure. 第１実施形態のモールド基板を示す平面図である。It is a top view which shows the mold substrate of 1st Embodiment. 第１実施形態において、第１素子と第２素子と回路基板とが実装されたモールド基板を示す平面図である。In 1st Embodiment, it is a top view which shows the mold board | substrate with which the 1st element, the 2nd element, and the circuit board were mounted. 第１実施形態のハウジングを示す斜視図である。It is a perspective view which shows the housing of 1st Embodiment. 図７に示すハウジングの平面図である。It is a top view of the housing shown in FIG. 第１実施形態において、第１素子と第２素子と回路基板とが実装されたモールド基板を収容したハウジングの平面図である。In 1st Embodiment, it is a top view of the housing which accommodated the mold board | substrate with which the 1st element, the 2nd element, and the circuit board were mounted. 第１実施形態において、キャップを取り付けた状態のモールド基板を収容したハウジングの平面図である。In 1st Embodiment, it is a top view of the housing which accommodated the mold board | substrate of the state which attached the cap. 図１０のＸＩ－ＸＩ線で切断した断面図である。It is sectional drawing cut | disconnected by the XI-XI line of FIG. 図１０のＸＩＩ－ＸＩＩ線で切断した断面図である。It is sectional drawing cut | disconnected by the XII-XII line | wire of FIG. 本発明の第２実施形態の圧力センサを示す底面図である。It is a bottom view which shows the pressure sensor of 2nd Embodiment of this invention. 第２実施形態の圧力センサを示す平面図である。It is a top view which shows the pressure sensor of 2nd Embodiment. 第２実施形態において、第１素子と第２素子と回路基板とが実装されたモールド基板を収容したハウジングの平面図である。In 2nd Embodiment, it is a top view of the housing which accommodated the mold board | substrate with which the 1st element, the 2nd element, and the circuit board were mounted. 第２実施形態において、キャップを取り付けた状態のモールド基板を収容したハウジングの平面図である。In 2nd Embodiment, it is a top view of the housing which accommodated the mold board | substrate of the state which attached the cap. 従来の圧力センサを示す断面図である。It is sectional drawing which shows the conventional pressure sensor.
　以下、本発明の実施の形態について図面を用いて詳細に説明する。なお、分かりやすいように、図面は寸法を適宜変更している。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. For easy understanding, the dimensions of the drawings are appropriately changed.
　［第１実施形態］
　図１は、本発明の第１実施形態の圧力センサ１を示す斜視図である。図２は、圧力センサ１を示す底面図である。図３は、圧力センサ１を示す平面図である。図４は、第１素子１１を示す説明図であり、図４（ａ）は大気圧Ｐ０下での模式断面図であり、図４（ｂ）は高圧Ｐ１下での模式断面図である。図５は、モールド基板３１を示す平面図である。図６は、第１素子１１と第２素子１２と回路基板１５とが実装されたモールド基板３１を示す平面図である。図７は、ハウジング３２を示す斜視図である。図８は、図７に示すハウジング３２の平面図である。図９は、第１素子１１と第２素子１２と回路基板１５とが実装されたモールド基板３１を収容したハウジング３２の平面図である。図１０は、キャップ３３を取り付けた状態のモールド基板３１を収容したハウジング３２の平面図である。図１１は、図１０のＸＩ－ＸＩ線で切断した断面図である。図１２は、図１０のＸＩＩ－ＸＩＩ線で切断した断面図である。なお、図９～図１２では、塗布されている保護材４０を省略して、第１素子１１および第２素子１２ならびに検知面１１ａ、１２ａが分かるように図示している。また、図１１および図１２では、ボンディングワイヤを省略して、断面図を見やすくしている。 [First Embodiment]
FIG. 1 is a perspective view showing a pressure sensor 1 according to a first embodiment of the present invention. FIG. 2 is a bottom view showing the pressure sensor 1. FIG. 3 is a plan view showing the pressure sensor 1. 4A and 4B are explanatory views showing the first element 11. FIG. 4A is a schematic cross-sectional view under atmospheric pressure P0, and FIG. 4B is a schematic cross-sectional view under high pressure P1. FIG. 5 is a plan view showing the mold substrate 31. FIG. 6 is a plan view showing a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted. FIG. 7 is a perspective view showing the housing 32. FIG. 8 is a plan view of the housing 32 shown in FIG. FIG. 9 is a plan view of a housing 32 that accommodates a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted. FIG. 10 is a plan view of the housing 32 that houses the mold substrate 31 with the cap 33 attached. 11 is a cross-sectional view taken along line XI-XI in FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 9 to 12, the applied protective material 40 is omitted, and the first element 11 and the second element 12 and the detection surfaces 11a and 12a are shown so as to be understood. Further, in FIG. 11 and FIG. 12, the bonding wire is omitted to make the cross-sectional view easier to see.
　本発明の第１実施形態の圧力センサ１は、図１および図３に示すように、Ｚ１方向にケース２０の第１の開口部２０ａが設けられている。第１の開口部２０ａの反対方向には、図２に示すように、ケース２０の第２の開口部２０ｂ、２０ｃが設けられている。 The pressure sensor 1 according to the first embodiment of the present invention is provided with a first opening 20a of the case 20 in the Z1 direction, as shown in FIGS. As shown in FIG. 2, second openings 20 b and 20 c of the case 20 are provided in the direction opposite to the first opening 20 a.
　圧力センサ１は図示しない被取り付け部に取り付けられ、このとき、第１の開口部２０ａに第１の気体が接するとともに、第２の開口部２０ｂ、２０ｃに第２の気体が接するように配置される。 The pressure sensor 1 is attached to an attachment portion (not shown), and at this time, the first gas is in contact with the first opening 20a and the second gas is in contact with the second openings 20b and 20c. The
　本実施形態の圧力センサ１は、感圧センサ素子１０として、第１の気体が接するように配置された第１素子１１と、第２の気体が接するように配置された第２素子１２とを有し、これらの素子で第１の気体と第２の気体との差圧を測定する差圧センサである。 The pressure sensor 1 of the present embodiment includes, as the pressure sensor element 10, a first element 11 disposed so that the first gas is in contact with a second element 12 disposed so that the second gas is in contact therewith. And a differential pressure sensor that measures the differential pressure between the first gas and the second gas using these elements.
　第１素子１１は、シリコン半導体等の半導体基板に製作された箱型の外観の圧力センサである。第１素子１１は、図４（ａ）に示すように、一面（Ｚ１側の面）側に薄いダイヤフラムが配置された検知面１１ａが設けられ、ダイヤフラムの内側に空洞の圧力基準室１１ｂが設けられ、検知面１１ａ側と圧力基準室１１ｂ内との圧力差によるダイヤフラムの撓みが抵抗変化として検知可能である。圧力基準室１１ｂは、大気圧Ｐ０に比べて充分に減圧された、いわゆる真空に保持されている。これにより、第１素子１１は真空を基準とした絶対圧タイプの圧力センサを構成する。大気圧Ｐ０でのダイヤフラムの撓みに対して、図４（ｂ）に示すように、検知面１１ａ側の圧力が高圧Ｐ１だと撓みが大きくなる。また、大気圧Ｐ０より圧力が低いと、撓みが小さくなる。 The first element 11 is a box-shaped external pressure sensor manufactured on a semiconductor substrate such as a silicon semiconductor. As shown in FIG. 4A, the first element 11 is provided with a detection surface 11a in which a thin diaphragm is arranged on one side (surface on the Z1 side), and a hollow pressure reference chamber 11b is provided inside the diaphragm. Thus, the deflection of the diaphragm due to the pressure difference between the detection surface 11a side and the pressure reference chamber 11b can be detected as a resistance change. The pressure reference chamber 11b is maintained in a so-called vacuum that is sufficiently reduced in pressure compared to the atmospheric pressure P0. As a result, the first element 11 constitutes an absolute pressure type pressure sensor based on vacuum. In contrast to the deflection of the diaphragm at the atmospheric pressure P0, as shown in FIG. 4B, the deflection becomes large when the pressure on the detection surface 11a side is a high pressure P1. Further, when the pressure is lower than the atmospheric pressure P0, the deflection becomes small.
　第２素子１２は、シリコン半導体等の半導体基板に製作された箱型の外観の圧力センサである。第２素子１２は、図４（ａ）に示すように、薄いダイヤフラムの一面側に検知面１２ａが設けられ、内面側に空洞の圧力基準室１２ｂが設けられて、検知面１２ａ側と圧力基準室１２ｂ内との圧力差によるダイヤフラムの撓みが抵抗変化として検知可能である。圧力基準室１２ｂは、大気圧Ｐ０に比べて充分に減圧された、いわゆる真空に保持されている。これにより、第２素子１２は真空を基準とした絶対圧タイプの圧力センサを構成する。大気圧Ｐ０でのダイヤフラムの撓みに対して、図４（ｂ）に示すように、検知面１１ａ側の圧力が高圧Ｐ１だと撓みが大きくなる。また、大気圧Ｐ０より圧力が低いと、撓みが小さくなる。なお、本実施形態では、第２素子１２が、第１素子１１と同じ外観形状、同じダイヤフラム厚で、同じ感圧性能である。 The second element 12 is a box-shaped external pressure sensor manufactured on a semiconductor substrate such as a silicon semiconductor. As shown in FIG. 4A, the second element 12 is provided with a detection surface 12a on one surface side of a thin diaphragm, and a hollow pressure reference chamber 12b on the inner surface side. The deflection of the diaphragm due to the pressure difference with the chamber 12b can be detected as a resistance change. The pressure reference chamber 12b is maintained in a so-called vacuum that is sufficiently reduced in pressure compared to the atmospheric pressure P0. Thereby, the 2nd element 12 comprises the pressure sensor of the absolute pressure type on the basis of vacuum. In contrast to the deflection of the diaphragm at the atmospheric pressure P0, as shown in FIG. 4B, the deflection becomes large when the pressure on the detection surface 11a side is a high pressure P1. Further, when the pressure is lower than the atmospheric pressure P0, the deflection becomes small. In the present embodiment, the second element 12 has the same external shape and the same diaphragm thickness as the first element 11, and the same pressure-sensitive performance.
　第１素子１１および第２素子１２は、図５に示すモールド基板３１に配設される。モールド基板３１は、後述するように、ケース２０の一部を構成する。 The first element 11 and the second element 12 are disposed on a mold substrate 31 shown in FIG. The mold substrate 31 constitutes a part of the case 20 as will be described later.
　モールド基板３１は絶縁性の合成樹脂からなり、導電部材３１ｄと一体にインサート成形されたものである。合成樹脂には、例えば、ＰＰＳ（ポリフェニレンサルファイド）やフェノール樹脂等が用いられる。導電部材３１ｄは、導電性の金属板から所望のパターン形状に加工されたものである。導電部材３１ｄは、一部分がモールド基板３１に形成された凹部に露出している。モールド基板３１の凹部は、第１素子１１を収納する第１収納部２１と、第２素子１２を収納する第２収納部２２とを構成する。第１収納部２１および第２収納部２２となる凹部には、第１素子１１および第２素子１２が固定される固定部３１ａが設けられている。また、モールド基板３１を平面視して、第２収納部２２の固定部３１ａのＸ１側およびＸ２側には、Ｚ１－Ｚ２方向に貫通する貫通孔３１ｂ、３１ｃが設けられている。さらに、モールド基板３１に一体化された導電部材３１ｄは、部分的にモールド基板３１の側面から突出している。 The mold substrate 31 is made of an insulating synthetic resin and is insert-molded integrally with the conductive member 31d. For example, PPS (polyphenylene sulfide), phenol resin, or the like is used as the synthetic resin. The conductive member 31d is processed into a desired pattern shape from a conductive metal plate. A part of the conductive member 31 d is exposed in a recess formed in the mold substrate 31. The concave portion of the mold substrate 31 constitutes a first storage portion 21 that stores the first element 11 and a second storage portion 22 that stores the second element 12. A fixing portion 31 a to which the first element 11 and the second element 12 are fixed is provided in the recess that becomes the first storage portion 21 and the second storage portion 22. In addition, through holes 31b and 31c penetrating in the Z1-Z2 direction are provided on the X1 side and the X2 side of the fixing portion 31a of the second storage portion 22 in plan view of the mold substrate 31. Further, the conductive member 31 d integrated with the mold substrate 31 partially protrudes from the side surface of the mold substrate 31.
　そして、モールド基板３１の固定部３１ａに接着材が塗布されて、第１素子１１および第２素子１２が、図６に示すように固定される。このとき、第１素子１１の検知面１１ａと第２素子１２の検知面１２ａとに対向する裏面側が固定部３１ａに接着され、かつ、検知面１１ａおよび検知面１２ａが同一の高さで同一の方向を臨むように配置される。 Then, an adhesive is applied to the fixing portion 31a of the mold substrate 31, and the first element 11 and the second element 12 are fixed as shown in FIG. At this time, the back side facing the detection surface 11a of the first element 11 and the detection surface 12a of the second element 12 is bonded to the fixed portion 31a, and the detection surface 11a and the detection surface 12a are the same at the same height. Arranged to face the direction.
　モールド基板３１に一体化された導電部材３１ｄは、第１素子１１および第２素子１２にそれぞれ形成された接続端子（図示しない）とボンディングワイヤによって電気接続される。また、モールド基板３１には、第１素子１１および第２素子１２の抵抗値を検出して電気信号を出力する回路基板１５が、導電性接着材によって固定され、モールド基板３１から露出した導電部材３１ｄとボンディングワイヤによって電気接続される。なお、第１素子１１および第２素子１２と回路基板１５とは、ボンディングワイヤの実装面が同一面に並んでおり、１回のボンディング工程で一括してボンディングワイヤを結線することができる。なお、ボンディング工程後に、第１素子１１および第２素子１２ならびにボンディングワイヤを保護する保護材４０が塗布される。図６は、この保護材４０が塗布される前の状態である。 The conductive member 31d integrated with the mold substrate 31 is electrically connected to connection terminals (not shown) formed on the first element 11 and the second element 12 by bonding wires. A circuit board 15 that detects the resistance values of the first element 11 and the second element 12 and outputs an electrical signal is fixed to the mold substrate 31 with a conductive adhesive, and the conductive member exposed from the mold substrate 31. 31d is electrically connected by a bonding wire. The first element 11 and the second element 12 and the circuit board 15 have bonding wires mounted on the same surface, and the bonding wires can be connected together in one bonding process. In addition, the protective material 40 which protects the 1st element 11, the 2nd element 12, and a bonding wire is apply | coated after a bonding process. FIG. 6 shows a state before the protective material 40 is applied.
　モールド基板３１は、図７および図８に示すハウジング３２に収容される。ハウジング３２は、後述するように、ケース２０の一部を構成する。 The mold substrate 31 is accommodated in a housing 32 shown in FIGS. The housing 32 constitutes a part of the case 20 as will be described later.
　ハウジング３２は、合成樹脂からなり、モールド基板３１を収容する本体部３２ａと、電気信号を出力するための電気ケーブルを接続するコネクタ部３２ｅとを有している。合成樹脂には、例えば、ＰＢＴ（ポリブチレンテレフタレート）やナイロン樹脂等が用いられる。また、本体部３２ａとコネクタ部３２ｅとの間を貫通する端子部材３２ｄが配設されて、コネクタ端子を構成している。端子部材３２ｄは導電性の金属材からなり、本体部３２ａに接着材で固定されている。本体部３２ａは、Ｚ１側が開口した箱状で、Ｚ２側の板面からＺ１側に突出する筒状部３２ｂ、３２ｃが設けられている。この筒状部３２ｂ、３２ｃは、導入孔２４ｂ、２４ｃを備えている。導入孔２４ｃは、筒状部３２ｂの内部で２つに分割されており、導入孔２４ｃが延設する方向に対して直交する断面の面積が小さくなっている。導入孔２４ｂは、導入孔２４ｂが延設する方向に対して直交する断面の面積が、導入孔２４ｃの断面の面積より大きい。 The housing 32 is made of synthetic resin, and has a main body portion 32a for accommodating the mold substrate 31 and a connector portion 32e for connecting an electric cable for outputting an electric signal. As the synthetic resin, for example, PBT (polybutylene terephthalate), nylon resin, or the like is used. Further, a terminal member 32d penetrating between the main body portion 32a and the connector portion 32e is provided to constitute a connector terminal. The terminal member 32d is made of a conductive metal material, and is fixed to the main body portion 32a with an adhesive. The main body 32a has a box shape with an opening on the Z1 side, and is provided with cylindrical portions 32b and 32c protruding from the Z2 side plate surface to the Z1 side. The cylindrical portions 32b and 32c are provided with introduction holes 24b and 24c. The introduction hole 24c is divided into two inside the cylindrical portion 32b, and the cross-sectional area perpendicular to the direction in which the introduction hole 24c extends is small. In the introduction hole 24b, the area of the cross section orthogonal to the direction in which the introduction hole 24b extends is larger than the area of the cross section of the introduction hole 24c.
　モールド基板３１は、図９に示すように配置されて、貫通孔３１ｂ、３１ｃに筒状部３２ｂ、３２ｃが挿入され、ハウジング３２の本体部３２ａに収容される。そして、モールド基板３１の導電部材３１ｄが、端子部材３２ｄに電気接続される。さらに、図１０に示すように、封止材３４によって固定される。また、第２収納部２２のＺ１側の開口には、第２素子１２の検知面１２ａに対向してキャップ３３が離間配置されて、接着材で固定される。 The mold substrate 31 is arranged as shown in FIG. 9, and the cylindrical portions 32 b and 32 c are inserted into the through holes 31 b and 31 c and accommodated in the main body portion 32 a of the housing 32. The conductive member 31d of the mold substrate 31 is electrically connected to the terminal member 32d. Furthermore, as shown in FIG. In addition, a cap 33 is disposed in the opening on the Z1 side of the second storage portion 22 so as to face the detection surface 12a of the second element 12, and is fixed with an adhesive.
　モールド基板３１とハウジング３２との部材間には封止材３４が塗布され、モールド基板３１とハウジング３２とキャップ３３と封止材３４によって隔壁２３を備えたケース２０が構成される。封止材３４は、エポキシ樹脂等の、耐環境性に優れた硬化型の合成樹脂からなり、気密性を保持するとともに、差圧が加わっても変形しない剛性を有する。図１１に示すように、第２収納部２２は、キャップ３３が接合されており、モールド基板３１とキャップ３３とによって第１の開口部２０ａから区画されている。また、図９に示すように、モールド基板３１には、検知面１２ａを平面視したときに異なる２方向（Ｘ１側およびＸ２側）に貫通孔３１ｂ、３１ｃが設けられている。そして、図１１および図１２に示すように、第２収納部２２は筒状部３２ｂ、３２ｃの導入孔２４ｂ、２４ｃ以外がモールド基板３１、キャップ３３、ハウジング３２、および封止材３４によって構成された隔壁２３で囲まれた状態となる。図１２に示すように、第２収納部２２に連通している導入孔２４ｂ、２４ｃは、ハウジング３２のＺ２側に開口している。第２の開口部２０ｂ、２０ｃは、第２収納部２２の導入孔２４ｂ、２４ｃのハウジング３２の外面部に位置する開口である。 A sealing material 34 is applied between members of the mold substrate 31 and the housing 32, and the mold substrate 31, the housing 32, the cap 33, and the sealing material 34 constitute the case 20 including the partition wall 23. The sealing material 34 is made of a curable synthetic resin excellent in environmental resistance, such as an epoxy resin, and has a rigidity that keeps hermeticity and does not deform even when a differential pressure is applied. As shown in FIG. 11, the second storage portion 22 has a cap 33 bonded thereto, and is partitioned from the first opening 20 a by the mold substrate 31 and the cap 33. Moreover, as shown in FIG. 9, the mold substrate 31 is provided with through holes 31b and 31c in two different directions (X1 side and X2 side) when the detection surface 12a is viewed in plan. As shown in FIGS. 11 and 12, the second storage portion 22 is configured by a mold substrate 31, a cap 33, a housing 32, and a sealing material 34 except for the introduction holes 24 b and 24 c of the cylindrical portions 32 b and 32 c. It will be in the state surrounded by the partition wall 23. As shown in FIG. 12, the introduction holes 24 b and 24 c communicating with the second storage portion 22 are opened on the Z2 side of the housing 32. The second openings 20 b and 20 c are openings located on the outer surface of the housing 32 of the introduction holes 24 b and 24 c of the second storage part 22.
　この工程後に、図３に示すように、保護部材４４を塗布し、回路基板１５およびワイヤボンディングが第１の気体に曝されないように保護される。図３ではキャップ３３も保護部材４４で覆われている。なお、図３では第１収納部２１に塗布されている保護材４０を省略せずに示している。保護材４０は、封止材３４とは異なり、気体の圧力を検知面１１ａ、１２ａに伝達可能な弾性を有する合成樹脂である。具体的には、フロロシリコーンゲルあるいはフッ素ゲル等を用いることができる。以上の工程例では、モールド基板３１をハウジング３２の本体部３２ａに収容してからキャップ３３を接合して保護部材４４を塗布するとしたが、ボンディング工程および保護材４０の塗布工程後のモールド基板３１にキャップ３３の接合工程および保護部材４４の塗布工程を続けて、その後にハウジング３２の収容部に封止材３４を塗布してからモールド基板３１を配置する順にしてもよい。 After this step, as shown in FIG. 3, a protective member 44 is applied to protect the circuit board 15 and the wire bonding from being exposed to the first gas. In FIG. 3, the cap 33 is also covered with the protective member 44. In FIG. 3, the protective material 40 applied to the first storage portion 21 is shown without being omitted. Unlike the sealing material 34, the protective material 40 is a synthetic resin having elasticity capable of transmitting a gas pressure to the detection surfaces 11a and 12a. Specifically, fluorosilicone gel or fluorine gel can be used. In the above process example, the mold substrate 31 is accommodated in the main body 32a of the housing 32, and then the cap 33 is joined and the protective member 44 is applied. However, the mold substrate 31 after the bonding process and the protective material 40 application process is applied. The joining process of the cap 33 and the applying process of the protective member 44 may be continued, and then the sealing material 34 may be applied to the housing portion of the housing 32 and then the mold substrate 31 may be disposed.
　第１素子１１は、図１１に示すように、モールド基板３１を隔壁２３とする第１収納部２１に配置されている。この第１収納部２１には、第１の気体が導入される第１の開口部２０ａが設けられており、本実施形態の圧力センサ１では、ハウジング３２の本体部３２ａが検知面１１ａ側（Ｚ１側）に開口して、第１の開口部２０ａを構成している。なお、第１の開口部２０ａに第１の気体を導入するために、ハウジング３２に図示しない筒状の第１のポート部を取り付けることができる。 As shown in FIG. 11, the first element 11 is disposed in the first storage portion 21 having the mold substrate 31 as the partition wall 23. The first storage portion 21 is provided with a first opening 20a into which a first gas is introduced. In the pressure sensor 1 of the present embodiment, the main body portion 32a of the housing 32 is on the detection surface 11a side ( Z1 side) is opened, and the 1st opening part 20a is comprised. In order to introduce the first gas into the first opening 20a, a cylindrical first port portion (not shown) can be attached to the housing 32.
　本実施形態の圧力センサ１では、第２収納部２２の第２の開口部２０ｂ、２０ｃが、第１の開口部２０ａとは反対のＺ２側に、ハウジング３２の外面部の２箇所で開放されている。また、これらの第２の開口部２０ｂ、２０ｃに第２の気体を導入するために、図示しない第２のポート部を筒状に設けるようにしてもよい。 In the pressure sensor 1 of the present embodiment, the second openings 20b and 20c of the second storage portion 22 are opened at two locations on the outer surface portion of the housing 32 on the Z2 side opposite to the first opening 20a. ing. Moreover, in order to introduce | transduce 2nd gas into these 2nd opening parts 20b and 20c, you may make it provide the 2nd port part which is not shown in a cylinder shape.
　上記のように、本実施形態では、ケース２０を構成するモールド基板３１とハウジング３２を別体として、封止材３４によって固定するようにしたので、それぞれ、合成樹脂を成形するための金型の構成が簡単になる。また、ボンディング工程におけるモールド基板３１を支持しやすいから、第１素子１１および第２素子１２のボンディング工程が安定する。したがって、実装工程を含む製造工程が容易になる。なお、モールド基板３１を別体で用意する代わりに、ハウジング３２に導電部材３１ｄを一体化して、第１素子１１および第２素子１２をハウジング３２に固定する構成とすることも可能である。この場合は、ハウジング３２に凹部を設けて、第１収納部２１および第２収納部２２とするようにして、第１収納部２１と第２収納部２２とを隔離するとともに、ハウジング３２に第２の開口部２０ｂ、２０ｃを設けておけばよい。 As described above, in the present embodiment, since the mold substrate 31 and the housing 32 constituting the case 20 are separated and fixed by the sealing material 34, the molds for molding the synthetic resin are respectively used. Configuration is simplified. Moreover, since it is easy to support the mold substrate 31 in the bonding process, the bonding process of the first element 11 and the second element 12 is stabilized. Therefore, the manufacturing process including the mounting process is facilitated. Instead of preparing the mold substrate 31 separately, it is possible to integrate the conductive member 31d with the housing 32 and fix the first element 11 and the second element 12 to the housing 32. In this case, the housing 32 is provided with a concave portion so as to be the first storage portion 21 and the second storage portion 22, so that the first storage portion 21 and the second storage portion 22 are isolated, and the housing 32 is Two openings 20b and 20c may be provided.
　次に、本実施形態の圧力センサ１による差圧の測定原理について説明する。 Next, the principle of differential pressure measurement by the pressure sensor 1 of the present embodiment will be described.
　第１の開口部２０ａを有する第１収納部２１と、第１の開口部２０ａとは反対の方向に設けられた第２の開口部２０ｂ、２０ｃを有する第２収納部２２とが、ケース２０の隔壁２３によって隔離されている。第１収納部２１に収納された第１素子１１は、第１の開口部２０ａから導入される第１の気体の圧力に応じて抵抗値が変化する絶対圧タイプの圧力センサである。ボンディングワイヤと導電部材３１ｄを介して接続された回路基板１５から第１素子１１に所定の電流を通電することによって、出力端子間には抵抗値に対応した電圧が発生して回路基板１５に入力される。同様に、第２収納部２２に収納された第２素子１２は、第２の開口部２０ｂ、２０ｃから導入される第２の気体の圧力に応じて抵抗値が変化する絶対圧タイプの圧力センサである。ボンディングワイヤと導電部材３１ｄを介して接続された回路基板１５から第２素子１２に所定の電流を通電することによって、出力端子間には抵抗値に対応した電圧が発生して回路基板１５に入力される。回路基板１５では、第１素子１１からの入力電圧と第２素子１２からの入力電圧との差分を出力する処理が行われ、２つの気体の差圧に応じた電気信号が出力される。 The first storage portion 21 having the first opening 20a and the second storage portion 22 having the second openings 20b and 20c provided in the direction opposite to the first opening 20a are the case 20. Are separated by a partition wall 23. The first element 11 housed in the first housing part 21 is an absolute pressure type pressure sensor whose resistance value changes according to the pressure of the first gas introduced from the first opening 20a. By applying a predetermined current to the first element 11 from the circuit board 15 connected to the bonding wire via the conductive member 31d, a voltage corresponding to the resistance value is generated between the output terminals and input to the circuit board 15. Is done. Similarly, the second element 12 housed in the second housing part 22 is an absolute pressure type pressure sensor whose resistance value changes according to the pressure of the second gas introduced from the second openings 20b and 20c. It is. By applying a predetermined current to the second element 12 from the circuit board 15 connected to the bonding wire via the conductive member 31d, a voltage corresponding to the resistance value is generated between the output terminals and input to the circuit board 15. Is done. In the circuit board 15, the process which outputs the difference of the input voltage from the 1st element 11 and the input voltage from the 2nd element 12 is performed, and the electric signal according to the differential pressure | voltage of two gas is output.
　本実施形態の圧力センサ１は、回路基板１５を内蔵し、差圧に応じた電気信号が出力される構成である。なお、回路基板１５を内蔵せず、それぞれの抵抗値を、コネクタ端子に接続された外部の回路で測定して差圧の電気信号に変換するように構成してもよい。また、回路基板１５を第１素子１１および第２素子１２のそれぞれの絶対圧を電気信号として出力する回路構成として、コネクタ端子に接続された外部の回路でも差圧を算出するシステム構成としてもよい。 The pressure sensor 1 of the present embodiment has a configuration in which a circuit board 15 is incorporated and an electrical signal corresponding to the differential pressure is output. Instead of incorporating the circuit board 15, each resistance value may be measured by an external circuit connected to the connector terminal and converted into an electric signal of a differential pressure. Further, the circuit board 15 may be configured as a circuit configuration that outputs the absolute pressures of the first element 11 and the second element 12 as electrical signals, and may be configured as a system configuration that calculates the differential pressure even in an external circuit connected to the connector terminal. .
　次に、本実施形態の圧力センサ１の特徴部分について、従来の差圧タイプの圧力センサと比較して説明する。 Next, the characteristic part of the pressure sensor 1 of the present embodiment will be described in comparison with a conventional differential pressure type pressure sensor.
　本実施形態の圧力センサ１は、感圧センサ素子１０として絶対圧タイプの第１素子１１および第２素子１２を用いている。差圧タイプの圧力センサが検知面を有するダイヤフラムの裏面側に気体を導入する圧力導入孔が設けられているのに対し、図４に示すように、絶対圧タイプの第１素子１１および第２素子１２には圧力導入孔がない。圧力導入孔を設ける必要がないため、構造が単純であるとともに、検知面を有するダイヤフラム以外の部分を高剛性の構造体とすることができる。また、差圧タイプの圧力センサでは、ダイヤフラムの面積より圧力導入孔の断面の面積を小さくする必要があるので、圧力導入孔の加工上の制約からダイヤフラムの面積を小さくすることが困難である。また、差圧タイプの圧力センサでは、導入する気体に水分等の凝縮性物質が含まれていると、圧力導入孔やダイヤフラムの裏面の圧力室で液化したり固体化したりして、気体の導入が妨げられる心配がある。この点でも、絶対圧タイプの第１素子１１および第２素子１２はほとんど心配する必要がなくなる。 The pressure sensor 1 of the present embodiment uses an absolute pressure type first element 11 and a second element 12 as the pressure-sensitive sensor element 10. The differential pressure type pressure sensor is provided with a pressure introduction hole for introducing gas to the back side of the diaphragm having the detection surface, whereas the absolute pressure type first element 11 and the second element are provided as shown in FIG. The element 12 has no pressure introducing hole. Since there is no need to provide a pressure introduction hole, the structure is simple, and the portion other than the diaphragm having the detection surface can be a highly rigid structure. Further, in the differential pressure type pressure sensor, it is necessary to make the area of the cross section of the pressure introduction hole smaller than the area of the diaphragm. Therefore, it is difficult to reduce the area of the diaphragm due to restrictions on processing of the pressure introduction hole. Also, in the differential pressure type pressure sensor, if the gas to be introduced contains a condensable substance such as moisture, it will be liquefied or solidified in the pressure chamber on the pressure introduction hole or the back side of the diaphragm, and the gas will be introduced. There is a worry that will be disturbed. In this respect as well, the absolute pressure type first element 11 and the second element 12 do not need to worry.
　また、差圧タイプの圧力センサは固定する接着材を介しての機械的な応力に敏感であり、応力による測定誤差を生じやすい。特に、測定環境の温度が刻々と変動する場合には、接着材との熱膨張の差による熱応力も加わり、温度補正後の測定誤差が大きくなりやすい。これに対して、本実施形態の圧力センサ１における絶対圧タイプの第１素子１１および第２素子１２では、固定される裏面側の機械的強度が高いので、これらの測定誤差が小さい。 Also, the differential pressure type pressure sensor is sensitive to mechanical stress through the fixing adhesive, and is likely to cause measurement error due to stress. In particular, when the temperature of the measurement environment varies from moment to moment, thermal stress due to the difference in thermal expansion from the adhesive is also added, and the measurement error after temperature correction tends to increase. On the other hand, the absolute pressure type first element 11 and second element 12 in the pressure sensor 1 of the present embodiment have high mechanical strength on the back side to be fixed, and therefore these measurement errors are small.
　一方、差圧タイプの圧力センサは接続するボンディングワイヤの本数が最小で済む。本実施形態の圧力センサ１は、第１素子１１および第２素子１２を別々のボンディングワイヤで接続する必要があるため、ボンディングワイヤの本数が多くなっている。しかしながら、第１素子１１および第２素子１２の実装面が同一方向で高さが同一高さであるため、ボンディング工程での手間はほとんど増えない。したがって、ボンディングワイヤの本数が多くなっても実質的な製造の容易さには影響しない。なお、本実施形態の圧力センサ１と異なり、２個の絶対圧タイプの感圧センサ素子１０の実装面を異ならせるように配置する場合には別々にボンディングを行う等の必要があり、製造の容易さは得られなくなる。この問題は、回路基板１５を別方向の実装面とする場合でも生じる。したがって、本実施形態の圧力センサ１のように実装面を同一高さで同一方向にすることが、製造の容易さをもたらすポイントである。また、製造における不良の発生が少ない。 On the other hand, the differential pressure type pressure sensor requires a minimum number of bonding wires to be connected. Since the pressure sensor 1 of this embodiment needs to connect the 1st element 11 and the 2nd element 12 with a separate bonding wire, the number of bonding wires is increasing. However, since the mounting surfaces of the first element 11 and the second element 12 are in the same direction and the same height, the labor in the bonding process hardly increases. Therefore, even if the number of bonding wires increases, it does not affect the ease of manufacturing. Unlike the pressure sensor 1 of the present embodiment, when the mounting surfaces of the two absolute pressure type pressure sensitive sensor elements 10 are different from each other, it is necessary to perform bonding separately. Easiness cannot be obtained. This problem occurs even when the circuit board 15 is mounted in a different direction. Therefore, it is the point which brings the ease of manufacture to make a mounting surface into the same height and the same direction like the pressure sensor 1 of this embodiment. In addition, the occurrence of defects in manufacturing is small.
　また、差圧タイプの圧力センサは、通常、異なる方向からの２つの気体の差圧を測定するように構成されている。本実施形態の圧力センサ１では、第１素子１１の検知面１１ａおよび第２素子１２の検知面１２ａが同一の方向を臨むように配置している。通常の差圧タイプの圧力センサと導入する気体の方向を同じにするために、第２素子１２を収納する第２収納部２２に第２の開口部２０ｂ、２０ｃを検知面１１ａおよび検知面１２ａと反対の側に設けている。これにより、２つの気体の導入方向を通常の差圧タイプの圧力センサと同じにすることができ、通常の差圧タイプの圧力センサを使用している機器に適用することが容易になる。 Also, the differential pressure type pressure sensor is usually configured to measure the differential pressure of two gases from different directions. In the pressure sensor 1 of this embodiment, it arrange | positions so that the detection surface 11a of the 1st element 11 and the detection surface 12a of the 2nd element 12 may face the same direction. In order to make the direction of the introduced gas the same as that of a normal differential pressure sensor, the second openings 20b and 20c are provided in the second storage portion 22 for storing the second element 12, and the detection surface 11a and the detection surface 12a. It is provided on the opposite side. Thereby, the introduction directions of the two gases can be made the same as those of a normal differential pressure type pressure sensor, and it becomes easy to apply to a device using the normal differential pressure type pressure sensor.
　また、差圧タイプの圧力センサは、薄いダイヤフラムが２つの気体を隔離する隔離壁の一部になっている。しかしながら、シリコン半導体等のダイヤフラムが破断した場合には圧力の高いほうから圧力低いほうへ気体が流出し、２つの気体が混合する不具合が発生してしまう。本実施形態の圧力センサ１は、第１収納部２１および第２収納部２２がケース２０の隔離壁によって隔離されており、第１素子１１および第２素子１２のダイヤフラムが破断した場合でも、第１収納部２１と第２収納部２２との隔離は保持される。したがって、ダイヤフラムが破断した場合でも、２つの気体が混合する不具合が発生することはない。 Also, in the differential pressure type pressure sensor, a thin diaphragm is part of an isolation wall that separates two gases. However, when a diaphragm such as a silicon semiconductor breaks, the gas flows out from the higher pressure to the lower pressure, resulting in a problem that the two gases are mixed. In the pressure sensor 1 of the present embodiment, the first storage portion 21 and the second storage portion 22 are isolated by the isolation wall of the case 20, and even when the diaphragms of the first element 11 and the second element 12 are broken, Isolation between the first storage unit 21 and the second storage unit 22 is maintained. Therefore, even when the diaphragm is broken, there is no problem that the two gases are mixed.
　次に、本実施形態の圧力センサ１における導入孔２４ｂ、２４ｃの作用について説明する。導入孔２４ｂ、２４ｃは、ハウジング３２の外面部に形成された第２の開口部２０ｂ、２０ｃから第２素子１２の検知面１２ａに向かって延設された気体導入部である。導入孔２４ｂ、２４ｃは、検知面１２ａを平面視したときに異なる２方向（Ｘ１側およびＸ２側）に設けられた貫通孔３１ｂ、３１ｃに連続している。このように、第２収納部２２の離れた位置に導入孔２４ｂ、２４ｃおよび第２の開口部２０ｂ、２０ｃが設けられているので、圧力センサ１の周囲に水がかかって被水や結露したときにも、２箇所同時に塞がれてしまうことが発生しにくくなる。したがって、第２の開口部２０ｂ、２０ｃの１箇所が被水・結露しても他のところで圧力がかかるようにできる。また、導入孔が１本だけの場合には、被水や結露によっていったん水が浸入すると、導入孔からの水抜きが困難であるが、２本の導入孔２４ｂ、２４ｃを備えている場合は、より水抜きがしやすくなる。 Next, the operation of the introduction holes 24b and 24c in the pressure sensor 1 of the present embodiment will be described. The introduction holes 24 b and 24 c are gas introduction portions extending from the second openings 20 b and 20 c formed in the outer surface portion of the housing 32 toward the detection surface 12 a of the second element 12. The introduction holes 24b and 24c are continuous with through holes 31b and 31c provided in two different directions (X1 side and X2 side) when the detection surface 12a is viewed in plan. As described above, since the introduction holes 24b and 24c and the second openings 20b and 20c are provided at positions away from the second storage part 22, the water around the pressure sensor 1 is splashed with water and condensed. Sometimes, it becomes difficult for two places to be simultaneously closed. Therefore, even if one of the second openings 20b and 20c is wetted / condensed, pressure can be applied elsewhere. In addition, when there is only one introduction hole, it is difficult to drain water from the introduction hole once water has entered due to water exposure or condensation. However, when two introduction holes 24b and 24c are provided, It becomes easier to drain water.
　なお、被取り付け部に取り付けられた状態の圧力センサ１において、第２の開口部２０ｂ、２０ｃが水平な高さ位置でないことが望ましい。第２の開口部２０ｂ、２０ｃのいずれか一方が低い位置にあるときは、圧力センサ１の第２収納部２２に水が浸入しても、導入孔２４ｂ、２４ｃを通って第２の開口部２０ｂ、２０ｃから抜けやすくなる。本実施形態の圧力センサ１では、断面の面積が大きい導入孔２４ｂから水が抜けやすい構成とされている。このため、導入孔２４ｂのほうを被水・結露し易い側に配置するとともに、水の入り込みにくい導入孔２４ｃのほうを被水・結露し難い側に配置することで、導入孔２４ｃ側でより確実に気圧測定ができる。 In the pressure sensor 1 attached to the attached portion, it is desirable that the second openings 20b and 20c are not in a horizontal height position. When either one of the second openings 20b and 20c is in a low position, even if water enters the second storage part 22 of the pressure sensor 1, the second opening passes through the introduction holes 24b and 24c. It becomes easy to remove from 20b, 20c. In the pressure sensor 1 of this embodiment, it is set as the structure which is easy to drain water from the introduction hole 24b with a large cross-sectional area. For this reason, the introduction hole 24b is arranged on the side that is likely to be exposed to water and condensation, and the introduction hole 24c that is less likely to enter the water is located on the side that is difficult to receive water and condensation, so that the introduction hole 24c is more It is possible to measure the atmospheric pressure reliably.
　以下、本実施形態としたことによる効果について説明する。 Hereinafter, the effects of the present embodiment will be described.
　感圧センサ素子１０は、内部に圧力基準室１１ｂが設けられ、検知面１１ａに第１の気体が接するように配置される第１素子１１と、内部に圧力基準室１２ｂが設けられ、検知面１２ａに第２の気体が接するように配置される第２素子１２と、を有している。そして、第１の気体と第２の気体との差圧を測定可能とするように電気接続されている。ケース２０は、第１素子１１を収納する第１収納部２１と、第２素子１２を収納する第２収納部２２と、第１収納部２１と第２収納部２２とを隔離する隔壁２３と、を有している。第１素子１１は第１収納部２１内に配置され、第１収納部２１に第１の気体が導入される第１の開口部２０ａが設けられている。第２素子１２は、第２収納部２２内に第１素子１１の検知面１１ａと第２素子１２の検知面１２ａとが同一の方向を臨むように配置されている。さらに、第２収納部２２に第２の気体が導入される第２の開口部２０ｂ、２０ｃが設けられており、第２収納部２２は、第２の開口部２０ｂ、２０ｃが第１の開口部２０ａと異なる方向に開放して設けられている。 The pressure-sensitive sensor element 10 has a pressure reference chamber 11b provided therein, a first element 11 disposed so that a first gas is in contact with the detection surface 11a, and a pressure reference chamber 12b provided therein, and a detection surface. And a second element 12 arranged so that the second gas is in contact with 12a. And it is electrically connected so that the differential pressure | voltage of 1st gas and 2nd gas can be measured. The case 20 includes a first storage portion 21 that stores the first element 11, a second storage portion 22 that stores the second element 12, and a partition wall 23 that separates the first storage portion 21 and the second storage portion 22. ,have. The first element 11 is disposed in the first storage part 21, and a first opening 20 a through which a first gas is introduced is provided in the first storage part 21. The second element 12 is arranged in the second storage portion 22 so that the detection surface 11a of the first element 11 and the detection surface 12a of the second element 12 face the same direction. Further, second openings 20b and 20c into which the second gas is introduced are provided in the second storage part 22, and the second openings 20b and 20c are the first openings in the second storage part 22. It is provided open in a direction different from the part 20a.
　この構成によれば、異なる方向からの２つの気体の差圧を測定する感圧センサ素子１０として圧力導入孔のない絶対圧タイプの感圧センサ素子を２個用いるとともに、それぞれの検知面１１ａ、１２ａが同一方向を臨むように配置されているので、製造が容易である。さらに、圧力導入孔のない感圧センサ素子であるので、被水や結露などに対して耐性がある。 According to this configuration, two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as the pressure sensitive sensor element 10 for measuring the differential pressure of two gases from different directions, and the respective detection surfaces 11a, Since 12a is arranged so as to face the same direction, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation.
　また、第２収納部２２は第２の開口部２０ｂ、２０ｃを少なくとも２箇所以上有することが好適である。この構成によれば、第２の開口部２０ｂ、２０ｃのうち、いずれか１箇所が被水・結露しても他のところで圧力がかかるようにできる。 Further, it is preferable that the second storage portion 22 has at least two or more second openings 20b and 20c. According to this configuration, even if any one of the second openings 20b and 20c is wetted / condensed, pressure can be applied elsewhere.
　また、第２の開口部２０ｂ、２０ｃは導入孔２４ｂ、２４ｃの外面部に位置する開口であって、導入孔２４ｂ、２４ｃが、第２素子１２の検知面１２ａに対して、検知面１２ａを平面視したときに異なる２方向から延設されるように配置されていることが好ましい。この構成によれば、一方を被水・結露し易い側に配置するとともに、他方を被水・結露し難い側に配置することで、他方側でより確実に気圧測定ができる。 The second openings 20b and 20c are openings located on the outer surface portions of the introduction holes 24b and 24c, and the introduction holes 24b and 24c define the detection surface 12a with respect to the detection surface 12a of the second element 12. It is preferable that they are arranged so as to extend from two different directions when viewed from above. According to this configuration, one is arranged on the side where it is likely to be wetted / condensed and the other is arranged on the side where it is difficult to be wetted / condensed, whereby the atmospheric pressure can be measured more reliably on the other side.
　また、第１実施形態の圧力センサ１において、導入孔２４ｂ、２４ｃのうちの少なくとも１つは、導入孔２４ｂ、２４ｃが延設する方向に対して直交する断面の面積が、他の導入孔より大きいものとすることができる。この構成によれば、導入孔２４ｂ、２４ｃのうちの少なくとも１つの断面積をより大きくすることによって、被水したときの水抜きを容易にし、被水・結露を防止し易くなる。 In the pressure sensor 1 according to the first embodiment, at least one of the introduction holes 24b and 24c has a cross-sectional area perpendicular to the direction in which the introduction holes 24b and 24c extend, compared to the other introduction holes. Can be big. According to this configuration, by increasing the cross-sectional area of at least one of the introduction holes 24b and 24c, it is easy to drain water when it is wet, and it is easy to prevent water exposure and condensation.
　また、第１実施形態の圧力センサ１において、ケース２０は、第１素子１１および第２素子１２が固定される固定部３１ａが設けられたモールド基板３１と、第２の開口部２０ｂ、２０ｃが設けられたハウジング３２と、これらの部材間に配置される封止材３４と、第２素子１２の検知面１２ａに対向して離間配置されるキャップ３３と、を有している。そして、隔壁２３がモールド基板３１とハウジング３２とキャップ３３と封止材３４とからなることが好適である。 In the pressure sensor 1 of the first embodiment, the case 20 includes a mold substrate 31 provided with a fixing portion 31a to which the first element 11 and the second element 12 are fixed, and second openings 20b and 20c. It has a housing 32 provided, a sealing material 34 disposed between these members, and a cap 33 that is spaced apart from the detection surface 12a of the second element 12. The partition wall 23 is preferably composed of a mold substrate 31, a housing 32, a cap 33, and a sealing material 34.
　この構成によれば、ケース２０を複数部材の接合で構成することにより、製造が容易である。 According to this configuration, the case 20 can be manufactured easily by configuring the case 20 by joining a plurality of members.
　［第２実施形態］
　図１３は、本発明の第２実施形態の圧力センサ２を示す底面図である。図１４は、圧力センサ２を示す平面図である。図１５は、第２実施形態において、第１素子１１と第２素子１２と回路基板１５とが実装されたモールド基板３１を収容したハウジング３２の平面図である。図１６は、第２実施形態において、キャップ３３を取り付けた状態のハウジング３２の平面図である。なお、第１実施形態の圧力センサ１との違いは、第２の開口部２０ｂ、２０ｃおよび導入孔２４ｂ、２４ｃならびに筒状部３２ｂ、３２ｃの形状であり、図１３～図１６における構成部材の符号は第１実施形態の符号をそのまま用い、構成についての説明を省略する。 [Second Embodiment]
FIG. 13 is a bottom view showing the pressure sensor 2 according to the second embodiment of the present invention. FIG. 14 is a plan view showing the pressure sensor 2. FIG. 15 is a plan view of a housing 32 that accommodates a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted in the second embodiment. FIG. 16 is a plan view of the housing 32 with the cap 33 attached in the second embodiment. The difference from the pressure sensor 1 of the first embodiment is the shape of the second openings 20b and 20c, the introduction holes 24b and 24c, and the cylindrical portions 32b and 32c. The reference numerals of the first embodiment are used as they are, and the description of the configuration is omitted.
　第２実施形態の圧力センサ２では、第２の開口部２０ｂ、２０ｃがＹ１－Ｙ２方向を長手方向とする長穴形状である。図１５に示すように、ハウジング３２の筒状部３２ｂ、３２ｃが平面視で長円形に設けられており、筒状部３２ｂ、３２ｃに断面形状が長円形の導入孔２４ｂ、２４ｃが設けられている。 In the pressure sensor 2 of the second embodiment, the second openings 20b and 20c have a long hole shape with the Y1-Y2 direction as the longitudinal direction. As shown in FIG. 15, the cylindrical portions 32b and 32c of the housing 32 are provided in an oval shape in a plan view, and the cylindrical portions 32b and 32c are provided with introduction holes 24b and 24c having an oval cross-sectional shape. Yes.
　第１実施形態の圧力センサ１と同様、導入孔２４ｂ、２４ｃは、ハウジング３２の外面部に形成された第２の開口部２０ｂ、２０ｃから第２素子１２の検知面１２ａに向かって延設された気体導入部である。導入孔２４ｂ、２４ｃは、検知面１２ａを平面視したときに、第２素子１２を挟んで対向する異なる第１方向側と第２方向側（Ｘ１側およびＸ２側）に設けられている。第２実施形態の圧力センサ２では、さらに、第１方向および第２方向に交差する第３方向を長手方向とする長穴形状の導入孔２４ｂ、２４ｃになっている。 Similar to the pressure sensor 1 of the first embodiment, the introduction holes 24 b and 24 c extend from the second openings 20 b and 20 c formed in the outer surface portion of the housing 32 toward the detection surface 12 a of the second element 12. Gas introduction part. The introduction holes 24b and 24c are provided on different first direction sides and second direction sides (X1 side and X2 side) that face each other with the second element 12 in between when the detection surface 12a is viewed in plan. In the pressure sensor 2 according to the second embodiment, the introduction holes 24b and 24c are in the form of elongated holes whose longitudinal direction is the third direction intersecting the first direction and the second direction.
　導入孔２４ｂ、２４ｃは、それぞれ、長手方向の幅広のまま、第２素子１２の検知面１２ａに向かって延設され、第２素子１２が配置されている第２収納部２２に連通している。 The introduction holes 24b and 24c are each extended toward the detection surface 12a of the second element 12 while being wide in the longitudinal direction, and communicate with the second storage portion 22 in which the second element 12 is disposed. .
　第２の開口部２０ｂ、２０ｃおよび導入孔２４ｂ、２４ｃを長穴形状にすることで、傾けて配置すると水抜きが容易になり、より確実に第２収納部２２全体が被水することを避けることができる。 By making the second openings 20b, 20c and the introduction holes 24b, 24c into a long hole shape, it is easy to drain water when they are arranged at an angle, and the entire second storage part 22 is more reliably prevented from getting wet. be able to.
　以下、本実施形態としたことによる効果について説明する。 Hereinafter, the effects of the present embodiment will be described.
　第２実施形態の圧力センサ２においても、感圧センサ素子１０は、内部に圧力基準室１１ｂが設けられ、検知面１１ａに第１の気体が接するように配置される第１素子１１と、内部に圧力基準室１２ｂが設けられ、検知面１２ａに第２の気体が接するように配置される第２素子１２と、を有している。そして、第１の気体と第２の気体との差圧を測定可能とするように電気接続されている。ケース２０は、第１素子１１を収納する第１収納部２１と、第２素子１２を収納する第２収納部２２と、第１収納部２１と第２収納部２２とを隔離する隔壁２３と、を有している。第１素子１１は第１収納部２１内に配置され、第１収納部２１に第１の気体が導入される第１の開口部２０ａが設けられている。第２素子１２は、第２収納部２２内に第１素子１１の検知面１１ａと第２素子１２の検知面１２ａとが同一の方向を臨むように配置されている。さらに、第２収納部２２に第２の気体が導入される第２の開口部２０ｂが設けられており、第２収納部２２は、第２の開口部２０ｂが第１の開口部２０ａと異なる方向に開放して設けられている。 Also in the pressure sensor 2 of the second embodiment, the pressure-sensitive sensor element 10 includes a first element 11 in which a pressure reference chamber 11b is provided and a first gas is in contact with the detection surface 11a. And a second element 12 disposed so that the second gas is in contact with the detection surface 12a. And it is electrically connected so that the differential pressure | voltage of 1st gas and 2nd gas can be measured. The case 20 includes a first storage portion 21 that stores the first element 11, a second storage portion 22 that stores the second element 12, and a partition wall 23 that separates the first storage portion 21 and the second storage portion 22. ,have. The first element 11 is disposed in the first storage part 21, and a first opening 20 a through which a first gas is introduced is provided in the first storage part 21. The second element 12 is arranged in the second storage portion 22 so that the detection surface 11a of the first element 11 and the detection surface 12a of the second element 12 face the same direction. Further, a second opening 20b through which a second gas is introduced is provided in the second storage part 22, and the second storage part 22 is different from the first opening 20a in the second opening 20b. Open in the direction.
　この構成によれば、異なる方向からの２つの気体の差圧を測定する感圧センサ素子１０として圧力導入孔のない絶対圧タイプの感圧センサ素子を２個用いるとともに、それぞれの検知面１１ａ、１２ａが同一方向を臨むように配置されているので、製造が容易である。さらに、圧力導入孔のない感圧センサ素子であるので、被水や結露などに対して耐性がある。 According to this configuration, two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as the pressure sensitive sensor element 10 for measuring the differential pressure of two gases from different directions, and the respective detection surfaces 11a, Since 12a is arranged so as to face the same direction, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation.
　また、第２実施形態の圧力センサ２においても、第２収納部２２は第２の開口部２０ｂ、２０ｃを少なくとも２箇所以上有することが好適である。この構成によれば、第２の開口部２０ｂの１箇所が被水・結露しても他のところで圧力がかかるようにできる。 Also in the pressure sensor 2 of the second embodiment, it is preferable that the second storage portion 22 has at least two second openings 20b and 20c. According to this configuration, even if one place of the second opening 20b is exposed to water and condensation, pressure can be applied elsewhere.
　また、第２実施形態の圧力センサ２においても、第２の開口部２０ｂ、２０ｃは導入孔２４ｂ、２４ｃの外面部に位置する開口であって、導入孔２４ｂ、２４ｃが、第２素子１２の検知面１２ａに対して、検知面１２ａを平面視したときに異なる２方向から延設されるように配置されていることが好ましい。この構成によれば、一方を被水・結露し易い側に配置するとともに、他方を被水・結露し難い側に配置することで、他方側でより確実に気圧測定ができる。 Also in the pressure sensor 2 of the second embodiment, the second openings 20b and 20c are openings located on the outer surfaces of the introduction holes 24b and 24c, and the introduction holes 24b and 24c are provided on the second element 12. It is preferable that the detection surface 12a is disposed so as to extend from two different directions when the detection surface 12a is viewed in plan. According to this configuration, one is arranged on the side where it is likely to be wetted / condensed and the other is arranged on the side where it is difficult to be wetted / condensed, whereby the atmospheric pressure can be measured more reliably on the other side.
　また、第２実施形態の圧力センサ２は、第２の開口部２０ｂ、２０ｃが、検知面１２ａを平面視したとき、第２素子１２を挟んで対向する第１方向側と第２方向側とに配置され、第１方向および第２方向に交差する第３方向を長手方向とする長穴形状であることが好適である。この構成によれば、長穴形状にすることで、傾けて配置すると水抜きが容易になり、より確実に第２収納部２２全体が被水することを避けることができる。 Further, in the pressure sensor 2 of the second embodiment, the second openings 20b and 20c have a first direction side and a second direction side facing each other across the second element 12 when the detection surface 12a is viewed in plan view. It is suitable that it is an elongate hole shape which makes the longitudinal direction the 3rd direction which is arrange | positioned and cross | intersects a 1st direction and a 2nd direction. According to this configuration, by forming the long hole shape, it is easy to drain water when it is arranged at an angle, and it is possible to more reliably avoid the entire second storage portion 22 from getting wet.
　また、第２実施形態の圧力センサ２においても、ケース２０は、第１素子１１および第２素子１２が固定される固定部３１ａが設けられたモールド基板３１と、第２の開口部２０ｂが設けられたハウジング３２と、これらの部材間に配置される封止材３４と、第２素子１２の検知面１２ａに対向して離間配置されるキャップ３３と、を有している。そして、隔壁２３がモールド基板３１とハウジング３２とキャップ３３と封止材３４とからなることが好適である。 Also in the pressure sensor 2 of the second embodiment, the case 20 is provided with a mold substrate 31 provided with a fixing portion 31a to which the first element 11 and the second element 12 are fixed, and a second opening 20b. A housing 32, a sealing member 34 disposed between these members, and a cap 33 that is spaced apart from the detection surface 12a of the second element 12. The partition wall 23 is preferably composed of a mold substrate 31, a housing 32, a cap 33, and a sealing material 34.
　この構成によれば、ケース２０を複数部材の接合で構成することにより、製造が容易である。 According to this configuration, the case 20 can be manufactured easily by configuring the case 20 by joining a plurality of members.
　以上のように、本発明の第１実施形態の圧力センサ１および第２実施形態の圧力センサ２を具体的に説明したが、本発明は上記の実施形態に限定されるものではなく、要旨を逸脱しない範囲で種々変更して実施することが可能である。例えば次のように変形して実施することができ、これらも本発明の技術的範囲に属する。 As described above, the pressure sensor 1 according to the first embodiment of the present invention and the pressure sensor 2 according to the second embodiment have been specifically described. However, the present invention is not limited to the above-described embodiment, Various modifications can be made without departing from the scope. For example, the present invention can be modified as follows, and these also belong to the technical scope of the present invention.
　（１）本実施形態において、モールド基板３１を用いて、第１素子１１および第２素子１２をあらかじめ実装してからハウジング３２に収容する構成としたが、モールド基板３１とハウジング３２とに分割されたケースでなくてもよい。 (1) In this embodiment, the mold substrate 31 is used to mount the first element 11 and the second element 12 in advance and then accommodate them in the housing 32. However, the mold substrate 31 is divided into the mold substrate 31 and the housing 32. It may not be a case.
　（２）本実施形態において、従来の差圧タイプの圧力センサと対比しやすいように、第１の開口部２０ａの反対側に第２の開口部２０ｂ、２０ｃを配置しているが、これに限定されない。例えば、第２の開口部２０ｂ、２０ｃが第１の開口部２０ａに対して９０度傾斜した側面側に配置されたものであってもよい。この場合でも、導入孔２４ｂ、２４ｃは、検知面１２ａを平面視したときに異なる２方向から延設されるように配置されていることがより好ましい。 (2) In the present embodiment, the second openings 20b and 20c are arranged on the opposite side of the first opening 20a so as to be easily compared with the conventional differential pressure type pressure sensor. It is not limited. For example, the second openings 20b and 20c may be arranged on the side surface inclined by 90 degrees with respect to the first opening 20a. Even in this case, the introduction holes 24b and 24c are more preferably arranged so as to extend from two different directions when the detection surface 12a is viewed in plan.
　（３）本実施形態において、２箇所の第２の開口部２０ｂ、２０ｃとしたが、２箇所だけに限定されるものではなく、３箇所以上の開口であってもよい。また、導入孔２４ｂ、２４ｃが１箇所の開口に集合するような態様であってもよい。例えば、導入孔２４ｂ、２４ｃが筒状に設けられたポート部に集合されて開口し、第１の開口部２０ａ側が参照となる大気側に開放され、第２の開口部２０ｂ、２０ｃ側に導入される第２の気体を被測定気体とする態様であってもよい。 (3) In the present embodiment, the two second openings 20b and 20c are used, but the number of openings is not limited to two and may be three or more. Alternatively, the introduction holes 24b and 24c may be gathered in one opening. For example, the introduction holes 24b and 24c are gathered and opened in a cylindrical port portion, the first opening 20a side is opened to the reference atmosphere side, and the second opening portions 20b and 20c are introduced to the side. The aspect which makes 2nd gas to be measured gas be sufficient.
　１　　　圧力センサ
　２　　　圧力センサ
　１０　　感圧センサ素子
　１１　　第１素子
　１１ａ　検知面
　１１ｂ　圧力基準室
　１２　　第２素子
　１２ａ　検知面
　１２ｂ　圧力基準室
　１５　　回路基板
　２０　　ケース
　２０ａ　第１の開口部
　２０ｂ　第２の開口部
　２１　　第１収納部
　２２　　第２収納部
　２３　　隔壁
　２４ｂ　導入孔
　２４ｃ　導入孔
　３１　　モールド基板
　３１ａ　固定部
　３１ｂ　貫通孔
　３１ｄ　導電部材
　３２　　ハウジング
　３２ａ　本体部
　３２ｂ　筒状部
　３２ｄ　端子部材
　３２ｅ　コネクタ部
　３３　　キャップ
　３４　　封止材
　４０　　保護材
　４４　　保護部材
　Ｐ０　　大気圧
　Ｐ１　　高圧
  DESCRIPTION OF SYMBOLS 1 Pressure sensor 2 Pressure sensor 10 Pressure sensitive sensor element 11 1st element 11a Detection surface 11b Pressure reference chamber 12 2nd element 12a Detection surface 12b Pressure reference chamber 15 Circuit board 20 Case 20a 1st opening part 20b 2nd opening part 21 1st accommodating part 22 2nd accommodating part 23 Partition 24b Introducing hole 24c Introducing hole 31 Mold substrate 31a Fixing part 31b Through hole 31d Conductive member 32 Housing 32a Body part 32b Cylindrical part 32d Terminal member 32e Connector part 33 Cap 34 Sealing Material 40 Protective material 44 Protective member P0 Atmospheric pressure P1 High pressure

Claims (6)

  1. 　検知面を有し、圧力を検知可能な感圧センサ素子と、
    　前記検知面に気体が接するように前記感圧センサ素子が配置されるケースと、を備え、
    　気体の圧力を電気信号に変換する圧力センサにおいて、
    　前記感圧センサ素子は、内部に圧力基準室が設けられ、前記検知面に第１の気体が接するように配置される第１素子と、内部に圧力基準室が設けられ、前記検知面に第２の気体が接するように配置される第２素子と、を有し、前記第１の気体と前記第２の気体との差圧を測定可能とするように電気接続され、
    　前記ケースは、前記第１素子を収納する第１収納部と、前記第２素子を収納する第２収納部と、前記第１収納部と前記第２収納部とを隔離する隔壁と、を有し、
    　前記第１素子は前記第１収納部内に配置され、前記第１収納部に前記第１の気体が導入される第１の開口部が設けられており、
    　前記第２素子は、前記第２収納部内に前記第１素子の前記検知面と前記第２素子の前記検知面とが同一の方向を臨むように配置され、前記第２収納部に前記第２の気体が導入される第２の開口部が設けられており、
    　前記第２収納部は、前記第２の開口部が前記第１の開口部と異なる方向に開放して設けられていることを特徴とする圧力センサ。     A pressure-sensitive sensor element having a detection surface and capable of detecting pressure;
    A case in which the pressure-sensitive sensor element is arranged so that gas contacts the detection surface;
    In a pressure sensor that converts gas pressure into an electrical signal,
    The pressure-sensitive sensor element includes a pressure reference chamber provided therein, a first element disposed so that a first gas is in contact with the detection surface, and a pressure reference chamber provided therein, and the detection surface includes a first reference chamber. A second element disposed so that two gases are in contact with each other, and electrically connected so as to enable measurement of a differential pressure between the first gas and the second gas,
    The case includes a first storage portion that stores the first element, a second storage portion that stores the second element, and a partition wall that separates the first storage portion and the second storage portion. And
    The first element is disposed in the first storage part, and a first opening through which the first gas is introduced is provided in the first storage part,
    The second element is disposed in the second storage portion so that the detection surface of the first element and the detection surface of the second element face the same direction, and the second storage portion has the second element. A second opening into which the gas is introduced,
    The pressure sensor, wherein the second storage portion is provided such that the second opening is opened in a direction different from the first opening.
  2. 　前記第２収納部は、前記第２の開口部を少なくとも２箇所以上有することを特徴とする請求項１に記載の圧力センサ。 The pressure sensor according to claim 1, wherein the second storage portion has at least two or more of the second openings.
  3. 　前記第２の開口部は、前記ケースの外面部から前記第２素子の前記検知面に向かって延設された導入孔の前記外面部に位置する開口であって、
    　前記導入孔が、前記第２素子の前記検知面に対して、前記検知面を平面視したときに異なる２方向から延設されるように配置されていることを特徴とする請求項１または請求項２に記載の圧力センサ。     The second opening is an opening located in the outer surface portion of the introduction hole extending from the outer surface portion of the case toward the detection surface of the second element,
    The said introduction hole is arrange | positioned so that it may extend from two different directions when the said detection surface is planarly viewed with respect to the said detection surface of the said 2nd element. Item 3. The pressure sensor according to Item 2.
  4. 　前記導入孔の少なくとも１つは、前記導入孔が延設する方向に対して直交する断面の面積が、他の前記導入孔より大きいことを特徴とする請求項３に記載の圧力センサ。 4. The pressure sensor according to claim 3, wherein at least one of the introduction holes has a larger cross-sectional area perpendicular to the direction in which the introduction hole extends than the other introduction holes.
  5. 　前記第２の開口部は、前記検知面を平面視したとき、前記第２素子を挟んで対向する第１方向側と第２方向側とに配置され、前記第１方向および前記第２方向に交差する第３方向を長手方向とする長穴形状であることを特徴とする請求項３または請求項４に記載の圧力センサ。 The second opening is disposed on a first direction side and a second direction side facing each other with the second element interposed therebetween when the detection surface is viewed in plan view, and extends in the first direction and the second direction. 5. The pressure sensor according to claim 3, wherein the pressure sensor has an elongated hole shape in which a third direction intersecting the longitudinal direction is a longitudinal direction.
  6. 　前記ケースは、前記第１素子および前記第２素子が固定される固定部が設けられたモールド基板と、前記第２の開口部が設けられたハウジングと、これらの部材間に配置される封止材と、前記第２素子の前記検知面に対向して離間配置されるキャップと、を有し、
    　前記隔壁が前記モールド基板と前記ハウジングと前記キャップと前記封止材とからなることを特徴とする請求項１ないし請求項５のいずれかに記載の圧力センサ。
          The case includes a mold substrate provided with a fixing portion to which the first element and the second element are fixed, a housing provided with the second opening, and a seal disposed between these members. A material and a cap that is spaced apart from the detection surface of the second element,
    The pressure sensor according to any one of claims 1 to 5, wherein the partition wall includes the mold substrate, the housing, the cap, and the sealing material.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019068442A1 (en) * 2017-10-05 2019-04-11 Robert Bosch Gmbh Pressure sensor for a vehicle

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4389326B2 (en) * 1999-05-06 2009-12-24 株式会社デンソー Pressure sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4389326B2 (en) * 1999-05-06 2009-12-24 株式会社デンソー Pressure sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019068442A1 (en) * 2017-10-05 2019-04-11 Robert Bosch Gmbh Pressure sensor for a vehicle
US11447117B2 (en) 2017-10-05 2022-09-20 Robert Bosch Gmbh Pressure sensor for a vehicle

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