WO2017098797A1 - Capteur de pression - Google Patents

Capteur de pression Download PDF

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Publication number
WO2017098797A1
WO2017098797A1 PCT/JP2016/079778 JP2016079778W WO2017098797A1 WO 2017098797 A1 WO2017098797 A1 WO 2017098797A1 JP 2016079778 W JP2016079778 W JP 2016079778W WO 2017098797 A1 WO2017098797 A1 WO 2017098797A1
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WO
WIPO (PCT)
Prior art keywords
pressure
pressure sensor
detection surface
gas
opening
Prior art date
Application number
PCT/JP2016/079778
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English (en)
Japanese (ja)
Inventor
篠原　英司
阿部　英樹
聡 和賀
敬介 中山
佐藤　弘樹
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Publication of WO2017098797A1 publication Critical patent/WO2017098797A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings

Definitions

  • the present invention relates to a pressure sensor that detects the pressure of a gas, and more particularly, to a pressure sensor that introduces two different gases into a case and detects the differential pressure.
  • the pressure sensor that detects the pressure of gas is an absolute pressure type that measures absolute pressure with reference to vacuum, measures positive or negative pressure with reference to atmospheric pressure, or measures the differential pressure between two different pressures Classified as differential pressure type.
  • a pressure sensor that introduces gas to the front surface side and the back surface side of a pressure sensor element having a semiconductor diaphragm type detection surface is generally used.
  • the back side of the pressure-sensitive sensor element is bonded to the case via a pedestal or the like, and the pressure on the back side is received by a pressure introduction hole provided in the pedestal. Since this pressure introduction hole must be made thin, water may enter due to moisture or condensation, which may hinder pressure measurement. Moreover, if the water freezes, the sensor element may be destroyed by the expansion. Therefore, in the pressure sensor disclosed in Patent Document 1, water and the like are prevented from entering by covering both surfaces of the pressure-sensitive sensor element with a soft gel or oil protective member.
  • FIG. 17 is a cross-sectional view showing the pressure sensor of Patent Document 1.
  • the case 910 includes a connector case portion 911 in which a terminal pin 910a is insert-molded, and a first pressure port that is joined to the connector case portion 911 to form a first pressure introduction passage 921 and a second pressure introduction passage 922, respectively.
  • the chip 930 is a semiconductor diaphragm type sensing unit that is made of a semiconductor substrate such as a silicon semiconductor, has a diaphragm as a thin portion on one side, and has a recess 932 formed by anisotropic etching or the like on the other side. is there.
  • a base 940 made of glass or the like is bonded to the back surface of the chip 930 and integrated with the chip 930.
  • the chip 930 is housed and fixed to the case 910 by being bonded to the bottom surface of the recess 911 a via the pedestal 940 with an adhesive.
  • the base 940 is formed with a hole 941 as a part of the second pressure introduction passage 922.
  • the passage area of the hole 941 is smaller than the opening area of the recess 932 in the chip 930.
  • the case 910 is provided with a first protective member 970 that covers the surface of the chip 930 and a second protective member 980 for preventing foreign matter from entering the second pressure introduction passage 922. Is filled in the second pressure introduction passage 922.
  • the first protection member 970 is filled in the concave portion 911a of the connector case portion 911, and covers and protects the surface of the chip 930, the connection portion between the wire 960, the wire 960 and the terminal pin 910a, and the base 940.
  • the second protective member 980 is filled in the hole 941 of the pedestal 940 as a part of the second pressure introduction passage, and protrudes from the hole 941 to be out of the second pressure introduction passage 922.
  • the introduction part 913a is filled up.
  • the second protective member 980 is, for example, injected with a fluorosilicone gel added with 30 to 35% of a fluorosilicone oil in a vacuum, or vacuumed and degassed after injection to obtain the state shown in FIG. It is arranged.
  • the present invention solves the above-described problems, and an object of the present invention is to provide a pressure sensor that is easier to manufacture and more resistant to moisture and condensation than the conventional differential pressure type.
  • a pressure sensor includes a pressure-sensitive sensor element having a detection surface and capable of detecting pressure, and a case in which the pressure-sensitive sensor element is disposed so that the gas is in contact with the detection surface.
  • the pressure-sensitive sensor element includes a first element in which a pressure reference chamber is provided and a first gas is in contact with the detection surface; A reference chamber, and a second element disposed so that the second gas is in contact with the detection surface, and enables measurement of a differential pressure between the first gas and the second gas.
  • the case isolates the first storage part from which the first element is stored, the second storage part from which the second element is stored, and the first storage part from the second storage part.
  • a partition wall wherein the first element is disposed in the first storage portion, A first opening into which the first gas is introduced is provided in one storage portion, and the second element is configured such that the detection surface of the first element and the second element are in the second storage portion.
  • the detection surface is arranged so as to face the same direction, and a second opening through which the second gas is introduced is provided in the second storage portion, and the second storage portion is The two openings are provided so as to be opened in a direction different from that of the first opening.
  • two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as pressure sensitive sensor elements for measuring the differential pressure of two gases from different directions, and the detection surfaces thereof are in the same direction. Therefore, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation. Therefore, it is possible to provide a pressure sensor that is easy to manufacture and is resistant to moisture and condensation as compared with the conventional differential pressure type.
  • the second storage portion has at least two or more second openings.
  • the second opening is an opening located at the outer surface of the introduction hole that extends from the outer surface of the case toward the detection surface of the second element.
  • the introduction hole is preferably arranged so as to extend from two different directions when the detection surface is viewed in plan with respect to the detection surface of the second element.
  • one side is arranged on the side where it is easily wetted / condensed and the other side is arranged on the side where it is difficult to get wet / condensed, so that the atmospheric pressure can be measured more reliably on the other side.
  • At least one of the introduction holes may have a cross-sectional area perpendicular to the direction in which the introduction hole extends larger than the other introduction holes.
  • the second opening is disposed on a first direction side and a second direction side facing each other with the second element sandwiched when the detection surface is viewed in plan view, It is preferable that the shape is a long hole whose longitudinal direction is a third direction intersecting the first direction and the second direction.
  • the case includes a mold substrate provided with a fixing portion to which the first element and the second element are fixed, a housing provided with the second opening, and these And a cap that is spaced apart from the detection surface of the second element, and the partition includes the mold substrate, the housing, the cap, and the sealing member. It is preferable to consist of a stop material.
  • the case can be easily manufactured by configuring the case by joining a plurality of members.
  • two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as pressure sensitive sensor elements for measuring the differential pressure of two gases from different directions, and the detection surfaces thereof are in the same direction. Since it arrange
  • FIGS. 4A and 4B are explanatory views showing a first element and a second element.
  • FIG. 4A is a schematic cross-sectional view under atmospheric pressure
  • FIG. 4B is a schematic cross-sectional view under high pressure.
  • It is a top view which shows the mold substrate of 1st Embodiment. In 1st Embodiment, it is a top view which shows the mold board
  • FIG. 1st Embodiment it is a top view of the housing which accommodated the mold board
  • 1st Embodiment it is a top view of the housing which accommodated the mold board
  • FIG. 1 is a perspective view showing a pressure sensor 1 according to a first embodiment of the present invention.
  • FIG. 2 is a bottom view showing the pressure sensor 1.
  • FIG. 3 is a plan view showing the pressure sensor 1.
  • 4A and 4B are explanatory views showing the first element 11.
  • FIG. 4A is a schematic cross-sectional view under atmospheric pressure P0
  • FIG. 4B is a schematic cross-sectional view under high pressure P1.
  • FIG. 5 is a plan view showing the mold substrate 31.
  • FIG. 6 is a plan view showing a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted.
  • FIG. 7 is a perspective view showing the housing 32.
  • FIG. 8 is a plan view of the housing 32 shown in FIG. FIG.
  • FIG. 9 is a plan view of a housing 32 that accommodates a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted.
  • FIG. 10 is a plan view of the housing 32 that houses the mold substrate 31 with the cap 33 attached.
  • 11 is a cross-sectional view taken along line XI-XI in FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 9 to 12, the applied protective material 40 is omitted, and the first element 11 and the second element 12 and the detection surfaces 11a and 12a are shown so as to be understood. Further, in FIG. 11 and FIG. 12, the bonding wire is omitted to make the cross-sectional view easier to see.
  • the pressure sensor 1 according to the first embodiment of the present invention is provided with a first opening 20a of the case 20 in the Z1 direction, as shown in FIGS. As shown in FIG. 2, second openings 20 b and 20 c of the case 20 are provided in the direction opposite to the first opening 20 a.
  • the pressure sensor 1 is attached to an attachment portion (not shown), and at this time, the first gas is in contact with the first opening 20a and the second gas is in contact with the second openings 20b and 20c.
  • the pressure sensor 1 of the present embodiment includes, as the pressure sensor element 10, a first element 11 disposed so that the first gas is in contact with a second element 12 disposed so that the second gas is in contact therewith. And a differential pressure sensor that measures the differential pressure between the first gas and the second gas using these elements.
  • the first element 11 is a box-shaped external pressure sensor manufactured on a semiconductor substrate such as a silicon semiconductor. As shown in FIG. 4A, the first element 11 is provided with a detection surface 11a in which a thin diaphragm is arranged on one side (surface on the Z1 side), and a hollow pressure reference chamber 11b is provided inside the diaphragm. Thus, the deflection of the diaphragm due to the pressure difference between the detection surface 11a side and the pressure reference chamber 11b can be detected as a resistance change.
  • the pressure reference chamber 11b is maintained in a so-called vacuum that is sufficiently reduced in pressure compared to the atmospheric pressure P0. As a result, the first element 11 constitutes an absolute pressure type pressure sensor based on vacuum.
  • the deflection becomes large when the pressure on the detection surface 11a side is a high pressure P1. Further, when the pressure is lower than the atmospheric pressure P0, the deflection becomes small.
  • the second element 12 is a box-shaped external pressure sensor manufactured on a semiconductor substrate such as a silicon semiconductor. As shown in FIG. 4A, the second element 12 is provided with a detection surface 12a on one surface side of a thin diaphragm, and a hollow pressure reference chamber 12b on the inner surface side. The deflection of the diaphragm due to the pressure difference with the chamber 12b can be detected as a resistance change.
  • the pressure reference chamber 12b is maintained in a so-called vacuum that is sufficiently reduced in pressure compared to the atmospheric pressure P0.
  • the 2nd element 12 comprises the pressure sensor of the absolute pressure type on the basis of vacuum. In contrast to the deflection of the diaphragm at the atmospheric pressure P0, as shown in FIG.
  • the deflection becomes large when the pressure on the detection surface 11a side is a high pressure P1. Further, when the pressure is lower than the atmospheric pressure P0, the deflection becomes small.
  • the second element 12 has the same external shape and the same diaphragm thickness as the first element 11, and the same pressure-sensitive performance.
  • the first element 11 and the second element 12 are disposed on a mold substrate 31 shown in FIG.
  • the mold substrate 31 constitutes a part of the case 20 as will be described later.
  • the mold substrate 31 is made of an insulating synthetic resin and is insert-molded integrally with the conductive member 31d.
  • PPS polyphenylene sulfide
  • phenol resin phenol resin
  • the conductive member 31d is processed into a desired pattern shape from a conductive metal plate. A part of the conductive member 31 d is exposed in a recess formed in the mold substrate 31.
  • the concave portion of the mold substrate 31 constitutes a first storage portion 21 that stores the first element 11 and a second storage portion 22 that stores the second element 12.
  • a fixing portion 31 a to which the first element 11 and the second element 12 are fixed is provided in the recess that becomes the first storage portion 21 and the second storage portion 22.
  • through holes 31b and 31c penetrating in the Z1-Z2 direction are provided on the X1 side and the X2 side of the fixing portion 31a of the second storage portion 22 in plan view of the mold substrate 31. Further, the conductive member 31 d integrated with the mold substrate 31 partially protrudes from the side surface of the mold substrate 31.
  • the conductive member 31d integrated with the mold substrate 31 is electrically connected to connection terminals (not shown) formed on the first element 11 and the second element 12 by bonding wires.
  • a circuit board 15 that detects the resistance values of the first element 11 and the second element 12 and outputs an electrical signal is fixed to the mold substrate 31 with a conductive adhesive, and the conductive member exposed from the mold substrate 31. 31d is electrically connected by a bonding wire.
  • the first element 11 and the second element 12 and the circuit board 15 have bonding wires mounted on the same surface, and the bonding wires can be connected together in one bonding process.
  • the protective material 40 which protects the 1st element 11, the 2nd element 12, and a bonding wire is apply
  • FIG. 6 shows a state before the protective material 40 is applied.
  • the mold substrate 31 is accommodated in a housing 32 shown in FIGS.
  • the housing 32 constitutes a part of the case 20 as will be described later.
  • the housing 32 is made of synthetic resin, and has a main body portion 32a for accommodating the mold substrate 31 and a connector portion 32e for connecting an electric cable for outputting an electric signal.
  • synthetic resin for example, PBT (polybutylene terephthalate), nylon resin, or the like is used.
  • a terminal member 32d penetrating between the main body portion 32a and the connector portion 32e is provided to constitute a connector terminal.
  • the terminal member 32d is made of a conductive metal material, and is fixed to the main body portion 32a with an adhesive.
  • the main body 32a has a box shape with an opening on the Z1 side, and is provided with cylindrical portions 32b and 32c protruding from the Z2 side plate surface to the Z1 side.
  • the cylindrical portions 32b and 32c are provided with introduction holes 24b and 24c.
  • the introduction hole 24c is divided into two inside the cylindrical portion 32b, and the cross-sectional area perpendicular to the direction in which the introduction hole 24c extends is small.
  • the area of the cross section orthogonal to the direction in which the introduction hole 24b extends is larger than the area of the cross section of the introduction hole 24c.
  • the mold substrate 31 is arranged as shown in FIG. 9, and the cylindrical portions 32 b and 32 c are inserted into the through holes 31 b and 31 c and accommodated in the main body portion 32 a of the housing 32.
  • the conductive member 31d of the mold substrate 31 is electrically connected to the terminal member 32d.
  • a cap 33 is disposed in the opening on the Z1 side of the second storage portion 22 so as to face the detection surface 12a of the second element 12, and is fixed with an adhesive.
  • a sealing material 34 is applied between members of the mold substrate 31 and the housing 32, and the mold substrate 31, the housing 32, the cap 33, and the sealing material 34 constitute the case 20 including the partition wall 23.
  • the sealing material 34 is made of a curable synthetic resin excellent in environmental resistance, such as an epoxy resin, and has a rigidity that keeps hermeticity and does not deform even when a differential pressure is applied.
  • the second storage portion 22 has a cap 33 bonded thereto, and is partitioned from the first opening 20 a by the mold substrate 31 and the cap 33.
  • the mold substrate 31 is provided with through holes 31b and 31c in two different directions (X1 side and X2 side) when the detection surface 12a is viewed in plan.
  • the second storage portion 22 is configured by a mold substrate 31, a cap 33, a housing 32, and a sealing material 34 except for the introduction holes 24 b and 24 c of the cylindrical portions 32 b and 32 c. It will be in the state surrounded by the partition wall 23. As shown in FIG. 12, the introduction holes 24 b and 24 c communicating with the second storage portion 22 are opened on the Z2 side of the housing 32. The second openings 20 b and 20 c are openings located on the outer surface of the housing 32 of the introduction holes 24 b and 24 c of the second storage part 22.
  • a protective member 44 is applied to protect the circuit board 15 and the wire bonding from being exposed to the first gas.
  • the cap 33 is also covered with the protective member 44.
  • the protective material 40 applied to the first storage portion 21 is shown without being omitted.
  • the protective material 40 is a synthetic resin having elasticity capable of transmitting a gas pressure to the detection surfaces 11a and 12a. Specifically, fluorosilicone gel or fluorine gel can be used.
  • the mold substrate 31 is accommodated in the main body 32a of the housing 32, and then the cap 33 is joined and the protective member 44 is applied. However, the mold substrate 31 after the bonding process and the protective material 40 application process is applied. The joining process of the cap 33 and the applying process of the protective member 44 may be continued, and then the sealing material 34 may be applied to the housing portion of the housing 32 and then the mold substrate 31 may be disposed.
  • the first element 11 is disposed in the first storage portion 21 having the mold substrate 31 as the partition wall 23.
  • the first storage portion 21 is provided with a first opening 20a into which a first gas is introduced.
  • the main body portion 32a of the housing 32 is on the detection surface 11a side ( Z1 side) is opened, and the 1st opening part 20a is comprised.
  • a cylindrical first port portion (not shown) can be attached to the housing 32.
  • the second openings 20b and 20c of the second storage portion 22 are opened at two locations on the outer surface portion of the housing 32 on the Z2 side opposite to the first opening 20a. ing. Moreover, in order to introduce
  • the mold substrate 31 and the housing 32 constituting the case 20 are separated and fixed by the sealing material 34, the molds for molding the synthetic resin are respectively used. Configuration is simplified. Moreover, since it is easy to support the mold substrate 31 in the bonding process, the bonding process of the first element 11 and the second element 12 is stabilized. Therefore, the manufacturing process including the mounting process is facilitated. Instead of preparing the mold substrate 31 separately, it is possible to integrate the conductive member 31d with the housing 32 and fix the first element 11 and the second element 12 to the housing 32.
  • the housing 32 is provided with a concave portion so as to be the first storage portion 21 and the second storage portion 22, so that the first storage portion 21 and the second storage portion 22 are isolated, and the housing 32 is Two openings 20b and 20c may be provided.
  • the first storage portion 21 having the first opening 20a and the second storage portion 22 having the second openings 20b and 20c provided in the direction opposite to the first opening 20a are the case 20. Are separated by a partition wall 23.
  • the first element 11 housed in the first housing part 21 is an absolute pressure type pressure sensor whose resistance value changes according to the pressure of the first gas introduced from the first opening 20a. By applying a predetermined current to the first element 11 from the circuit board 15 connected to the bonding wire via the conductive member 31d, a voltage corresponding to the resistance value is generated between the output terminals and input to the circuit board 15. Is done.
  • the second element 12 housed in the second housing part 22 is an absolute pressure type pressure sensor whose resistance value changes according to the pressure of the second gas introduced from the second openings 20b and 20c. It is.
  • a voltage corresponding to the resistance value is generated between the output terminals and input to the circuit board 15. Is done.
  • the process which outputs the difference of the input voltage from the 1st element 11 and the input voltage from the 2nd element 12 is performed, and the electric signal according to the differential pressure
  • the pressure sensor 1 of the present embodiment has a configuration in which a circuit board 15 is incorporated and an electrical signal corresponding to the differential pressure is output.
  • each resistance value may be measured by an external circuit connected to the connector terminal and converted into an electric signal of a differential pressure.
  • the circuit board 15 may be configured as a circuit configuration that outputs the absolute pressures of the first element 11 and the second element 12 as electrical signals, and may be configured as a system configuration that calculates the differential pressure even in an external circuit connected to the connector terminal. .
  • the pressure sensor 1 of the present embodiment uses an absolute pressure type first element 11 and a second element 12 as the pressure-sensitive sensor element 10.
  • the differential pressure type pressure sensor is provided with a pressure introduction hole for introducing gas to the back side of the diaphragm having the detection surface, whereas the absolute pressure type first element 11 and the second element are provided as shown in FIG.
  • the element 12 has no pressure introducing hole. Since there is no need to provide a pressure introduction hole, the structure is simple, and the portion other than the diaphragm having the detection surface can be a highly rigid structure. Further, in the differential pressure type pressure sensor, it is necessary to make the area of the cross section of the pressure introduction hole smaller than the area of the diaphragm.
  • the gas to be introduced contains a condensable substance such as moisture, it will be liquefied or solidified in the pressure chamber on the pressure introduction hole or the back side of the diaphragm, and the gas will be introduced. There is a worry that will be disturbed. In this respect as well, the absolute pressure type first element 11 and the second element 12 do not need to worry.
  • the differential pressure type pressure sensor is sensitive to mechanical stress through the fixing adhesive, and is likely to cause measurement error due to stress.
  • thermal stress due to the difference in thermal expansion from the adhesive is also added, and the measurement error after temperature correction tends to increase.
  • the absolute pressure type first element 11 and second element 12 in the pressure sensor 1 of the present embodiment have high mechanical strength on the back side to be fixed, and therefore these measurement errors are small.
  • the differential pressure type pressure sensor requires a minimum number of bonding wires to be connected. Since the pressure sensor 1 of this embodiment needs to connect the 1st element 11 and the 2nd element 12 with a separate bonding wire, the number of bonding wires is increasing. However, since the mounting surfaces of the first element 11 and the second element 12 are in the same direction and the same height, the labor in the bonding process hardly increases. Therefore, even if the number of bonding wires increases, it does not affect the ease of manufacturing. Unlike the pressure sensor 1 of the present embodiment, when the mounting surfaces of the two absolute pressure type pressure sensitive sensor elements 10 are different from each other, it is necessary to perform bonding separately. Easiness cannot be obtained. This problem occurs even when the circuit board 15 is mounted in a different direction. Therefore, it is the point which brings the ease of manufacture to make a mounting surface into the same height and the same direction like the pressure sensor 1 of this embodiment. In addition, the occurrence of defects in manufacturing is small.
  • the differential pressure type pressure sensor is usually configured to measure the differential pressure of two gases from different directions.
  • the pressure sensor 1 of this embodiment it arrange
  • the second openings 20b and 20c are provided in the second storage portion 22 for storing the second element 12, and the detection surface 11a and the detection surface 12a. It is provided on the opposite side. Thereby, the introduction directions of the two gases can be made the same as those of a normal differential pressure type pressure sensor, and it becomes easy to apply to a device using the normal differential pressure type pressure sensor.
  • a thin diaphragm is part of an isolation wall that separates two gases.
  • a diaphragm such as a silicon semiconductor breaks, the gas flows out from the higher pressure to the lower pressure, resulting in a problem that the two gases are mixed.
  • the first storage portion 21 and the second storage portion 22 are isolated by the isolation wall of the case 20, and even when the diaphragms of the first element 11 and the second element 12 are broken, Isolation between the first storage unit 21 and the second storage unit 22 is maintained. Therefore, even when the diaphragm is broken, there is no problem that the two gases are mixed.
  • the introduction holes 24 b and 24 c are gas introduction portions extending from the second openings 20 b and 20 c formed in the outer surface portion of the housing 32 toward the detection surface 12 a of the second element 12.
  • the introduction holes 24b and 24c are continuous with through holes 31b and 31c provided in two different directions (X1 side and X2 side) when the detection surface 12a is viewed in plan.
  • the introduction holes 24b and 24c and the second openings 20b and 20c are provided at positions away from the second storage part 22, the water around the pressure sensor 1 is splashed with water and condensed. Sometimes, it becomes difficult for two places to be simultaneously closed.
  • the second openings 20b and 20c are not in a horizontal height position.
  • the second opening passes through the introduction holes 24b and 24c. It becomes easy to remove from 20b, 20c.
  • the pressure sensor 1 of this embodiment it is set as the structure which is easy to drain water from the introduction hole 24b with a large cross-sectional area.
  • the introduction hole 24b is arranged on the side that is likely to be exposed to water and condensation, and the introduction hole 24c that is less likely to enter the water is located on the side that is difficult to receive water and condensation, so that the introduction hole 24c is more It is possible to measure the atmospheric pressure reliably.
  • the pressure-sensitive sensor element 10 has a pressure reference chamber 11b provided therein, a first element 11 disposed so that a first gas is in contact with the detection surface 11a, and a pressure reference chamber 12b provided therein, and a detection surface. And a second element 12 arranged so that the second gas is in contact with 12a. And it is electrically connected so that the differential pressure
  • the case 20 includes a first storage portion 21 that stores the first element 11, a second storage portion 22 that stores the second element 12, and a partition wall 23 that separates the first storage portion 21 and the second storage portion 22. ,have.
  • the first element 11 is disposed in the first storage part 21, and a first opening 20 a through which a first gas is introduced is provided in the first storage part 21.
  • the second element 12 is arranged in the second storage portion 22 so that the detection surface 11a of the first element 11 and the detection surface 12a of the second element 12 face the same direction. Further, second openings 20b and 20c into which the second gas is introduced are provided in the second storage part 22, and the second openings 20b and 20c are the first openings in the second storage part 22. It is provided open in a direction different from the part 20a.
  • two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as the pressure sensitive sensor element 10 for measuring the differential pressure of two gases from different directions, and the respective detection surfaces 11a, Since 12a is arranged so as to face the same direction, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation.
  • the second storage portion 22 has at least two or more second openings 20b and 20c. According to this configuration, even if any one of the second openings 20b and 20c is wetted / condensed, pressure can be applied elsewhere.
  • the second openings 20b and 20c are openings located on the outer surface portions of the introduction holes 24b and 24c, and the introduction holes 24b and 24c define the detection surface 12a with respect to the detection surface 12a of the second element 12. It is preferable that they are arranged so as to extend from two different directions when viewed from above. According to this configuration, one is arranged on the side where it is likely to be wetted / condensed and the other is arranged on the side where it is difficult to be wetted / condensed, whereby the atmospheric pressure can be measured more reliably on the other side.
  • At least one of the introduction holes 24b and 24c has a cross-sectional area perpendicular to the direction in which the introduction holes 24b and 24c extend, compared to the other introduction holes. Can be big. According to this configuration, by increasing the cross-sectional area of at least one of the introduction holes 24b and 24c, it is easy to drain water when it is wet, and it is easy to prevent water exposure and condensation.
  • the case 20 includes a mold substrate 31 provided with a fixing portion 31a to which the first element 11 and the second element 12 are fixed, and second openings 20b and 20c. It has a housing 32 provided, a sealing material 34 disposed between these members, and a cap 33 that is spaced apart from the detection surface 12a of the second element 12.
  • the partition wall 23 is preferably composed of a mold substrate 31, a housing 32, a cap 33, and a sealing material 34.
  • the case 20 can be manufactured easily by configuring the case 20 by joining a plurality of members.
  • FIG. 13 is a bottom view showing the pressure sensor 2 according to the second embodiment of the present invention.
  • FIG. 14 is a plan view showing the pressure sensor 2.
  • FIG. 15 is a plan view of a housing 32 that accommodates a mold substrate 31 on which the first element 11, the second element 12, and the circuit board 15 are mounted in the second embodiment.
  • FIG. 16 is a plan view of the housing 32 with the cap 33 attached in the second embodiment.
  • the difference from the pressure sensor 1 of the first embodiment is the shape of the second openings 20b and 20c, the introduction holes 24b and 24c, and the cylindrical portions 32b and 32c.
  • the reference numerals of the first embodiment are used as they are, and the description of the configuration is omitted.
  • the second openings 20b and 20c have a long hole shape with the Y1-Y2 direction as the longitudinal direction.
  • the cylindrical portions 32b and 32c of the housing 32 are provided in an oval shape in a plan view, and the cylindrical portions 32b and 32c are provided with introduction holes 24b and 24c having an oval cross-sectional shape. Yes.
  • the introduction holes 24 b and 24 c extend from the second openings 20 b and 20 c formed in the outer surface portion of the housing 32 toward the detection surface 12 a of the second element 12. Gas introduction part.
  • the introduction holes 24b and 24c are provided on different first direction sides and second direction sides (X1 side and X2 side) that face each other with the second element 12 in between when the detection surface 12a is viewed in plan.
  • the introduction holes 24b and 24c are in the form of elongated holes whose longitudinal direction is the third direction intersecting the first direction and the second direction.
  • the introduction holes 24b and 24c are each extended toward the detection surface 12a of the second element 12 while being wide in the longitudinal direction, and communicate with the second storage portion 22 in which the second element 12 is disposed. .
  • the pressure-sensitive sensor element 10 includes a first element 11 in which a pressure reference chamber 11b is provided and a first gas is in contact with the detection surface 11a. And a second element 12 disposed so that the second gas is in contact with the detection surface 12a. And it is electrically connected so that the differential pressure
  • the case 20 includes a first storage portion 21 that stores the first element 11, a second storage portion 22 that stores the second element 12, and a partition wall 23 that separates the first storage portion 21 and the second storage portion 22. ,have.
  • the first element 11 is disposed in the first storage part 21, and a first opening 20 a through which a first gas is introduced is provided in the first storage part 21.
  • the second element 12 is arranged in the second storage portion 22 so that the detection surface 11a of the first element 11 and the detection surface 12a of the second element 12 face the same direction. Further, a second opening 20b through which a second gas is introduced is provided in the second storage part 22, and the second storage part 22 is different from the first opening 20a in the second opening 20b. Open in the direction.
  • two absolute pressure type pressure sensitive sensor elements without pressure introduction holes are used as the pressure sensitive sensor element 10 for measuring the differential pressure of two gases from different directions, and the respective detection surfaces 11a, Since 12a is arranged so as to face the same direction, manufacturing is easy. Furthermore, since it is a pressure-sensitive sensor element having no pressure introduction hole, it is resistant to moisture and condensation.
  • the second storage portion 22 has at least two second openings 20b and 20c. According to this configuration, even if one place of the second opening 20b is exposed to water and condensation, pressure can be applied elsewhere.
  • the second openings 20b and 20c are openings located on the outer surfaces of the introduction holes 24b and 24c, and the introduction holes 24b and 24c are provided on the second element 12.
  • the detection surface 12a is disposed so as to extend from two different directions when the detection surface 12a is viewed in plan. According to this configuration, one is arranged on the side where it is likely to be wetted / condensed and the other is arranged on the side where it is difficult to be wetted / condensed, whereby the atmospheric pressure can be measured more reliably on the other side.
  • the second openings 20b and 20c have a first direction side and a second direction side facing each other across the second element 12 when the detection surface 12a is viewed in plan view. It is suitable that it is an elongate hole shape which makes the longitudinal direction the 3rd direction which is arrange
  • the case 20 is provided with a mold substrate 31 provided with a fixing portion 31a to which the first element 11 and the second element 12 are fixed, and a second opening 20b.
  • the partition wall 23 is preferably composed of a mold substrate 31, a housing 32, a cap 33, and a sealing material 34.
  • the case 20 can be manufactured easily by configuring the case 20 by joining a plurality of members.
  • the pressure sensor 1 according to the first embodiment of the present invention and the pressure sensor 2 according to the second embodiment have been specifically described.
  • the present invention is not limited to the above-described embodiment, Various modifications can be made without departing from the scope.
  • the present invention can be modified as follows, and these also belong to the technical scope of the present invention.
  • the mold substrate 31 is used to mount the first element 11 and the second element 12 in advance and then accommodate them in the housing 32.
  • the mold substrate 31 is divided into the mold substrate 31 and the housing 32. It may not be a case.
  • the second openings 20b and 20c are arranged on the opposite side of the first opening 20a so as to be easily compared with the conventional differential pressure type pressure sensor. It is not limited.
  • the second openings 20b and 20c may be arranged on the side surface inclined by 90 degrees with respect to the first opening 20a.
  • the introduction holes 24b and 24c are more preferably arranged so as to extend from two different directions when the detection surface 12a is viewed in plan.
  • the two second openings 20b and 20c are used, but the number of openings is not limited to two and may be three or more.
  • the introduction holes 24b and 24c may be gathered in one opening.
  • the introduction holes 24b and 24c are gathered and opened in a cylindrical port portion, the first opening 20a side is opened to the reference atmosphere side, and the second opening portions 20b and 20c are introduced to the side.
  • the aspect which makes 2nd gas to be measured gas be sufficient.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention vise à fournir un capteur de pression qui a une structure simple et est résistant au mouillage, à la condensation et similaires. À cet effet, l'invention concerne un capteur de pression qui comprend une première partie de logement qui reçoit un premier élément, une seconde partie de logement (22) qui reçoit un second élément (12), et une paroi de séparation (23) qui sépare la première partie de logement et la seconde partie de logement (22), le premier élément étant disposé dans la première partie de logement et une première partie d'ouverture (20a) par laquelle un premier gaz est introduit étant disposée dans la première partie de logement ; le second élément (12) étant disposé dans la seconde partie de logement (22) d'une manière telle qu'une surface de détection du premier élément et une surface de détection (12a) du second élément (12) font face à la même direction ; des secondes parties d'ouverture (20b, 20c) à travers lesquelles un second gaz est introduit dans la seconde partie de logement (22) ; et la seconde partie de logement (22) étant disposée d'une manière telle que les secondes parties d'ouverture (20b, 20c) s'ouvrent dans une direction différente de la première partie d'ouverture (20a).
PCT/JP2016/079778 2015-12-07 2016-10-06 Capteur de pression WO2017098797A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-238171 2015-12-07
JP2015238171A JP2019023566A (ja) 2015-12-07 2015-12-07 圧力センサ

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WO2017098797A1 true WO2017098797A1 (fr) 2017-06-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019068442A1 (fr) * 2017-10-05 2019-04-11 Robert Bosch Gmbh Capteur de pression pour un véhicule

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4389326B2 (ja) * 1999-05-06 2009-12-24 株式会社デンソー 圧力センサ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4389326B2 (ja) * 1999-05-06 2009-12-24 株式会社デンソー 圧力センサ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019068442A1 (fr) * 2017-10-05 2019-04-11 Robert Bosch Gmbh Capteur de pression pour un véhicule
US11447117B2 (en) 2017-10-05 2022-09-20 Robert Bosch Gmbh Pressure sensor for a vehicle

Also Published As

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