JP5278448B2 - Pressure sensor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce costs, improve long-term reliability and improve the accuracy and reliability of measurement signals in a pressure sensor device. <P>SOLUTION: A pressure sensor chip 41 having therein a diaphragm 45, a piezoresistance element, an amplifier circuit and various adjusting circuits is bonded to a seat member 42 so that the diaphragm 45 faces a through hole 46 of the seat member 42. The seat member 42 and a metal plate member 243 are bonded so that their through holes 46, 248 are connected. A metal pipe member 243 is adhered to a resin case 244 and the signal terminal 258 of the resin case 244 and the pressure sensor chip 41 are electrically connected by wire bonding 59 to make a pressure sensor cell 102. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a pressure sensor device that measures pressure using semiconductor silicon, and more particularly to a pressure sensor device that measures high pressure of 1 MPa or more.

  In general, in a pressure sensor device that measures pressure by being attached to an oil sealing block of an automobile transmission or a hydraulic actuator block, a semiconductor pressure sensor chip using a piezoresistance effect is used as a sensor element. This semiconductor pressure sensor has a configuration in which a plurality of semiconductor strain gauges are bridge-connected on a diaphragm made of a material having a piezoresistance effect such as single crystal silicon. When the diaphragm is deformed by the pressure change, the gauge resistance of the semiconductor strain gauge is changed according to the deformation amount, and the change amount is taken out from the bridge circuit as a voltage signal.

  Conventionally, pressure sensor devices having configurations shown in FIGS. 16 to 19 are known. The pressure sensor device shown in FIG. 16 includes a joint 1 having a screw portion, a flange member 3 for screwing the joint 1 into an installation portion, and a pressure sensor that outputs a voltage signal corresponding to the amount of change in pressure as described above. 2, a circuit board 4 on which a circuit chip for processing an output signal of the pressure sensor 2 is mounted, wire bonding 5 for connecting the pressure sensor 2 and the circuit board 4, and terminals for taking out signals from the circuit board 4 to the outside 6 and 7. The terminal block 8 and the terminal 6 supporting the terminal 7 are fixed to the flange member 3 by a joining member 11. Moreover, the gasket 9 and the O-ring 10 are assembled by the joining member 11 (see, for example, Patent Document 1).

  The pressure sensor device shown in FIG. 17 has a transducer 12, a hexagonal port 13, a cover 14, an annular sealing gasket 15, a collar clip 16, a flexible circuit 17, and a signal for taking out an external signal. The base member 18 is used. The transducer 12 converts a first conductive film that is deformed when subjected to pressure, a second conductive film that faces the conductive film via a spacer, and a capacitance that changes due to the deformation of the first conductive film to a voltage signal. (See, for example, Patent Document 2).

  In the pressure sensor device shown in FIG. 18, the pressure sensor chip 25 is connected to the connection leads 19, 20, 21, 22 in the sensor case 24 in which the connection leads 19, 20, 21, 22 are insulated and fixed by the hermetic glass 23. In addition, the pressure sensor chip 25 is sealed in the silicon oil by the metal diaphragm 26. And it is protected from the upper part by the metal hard cover 27 (for example, refer patent document 3).

  The pressure sensor device shown in FIG. 19 stores the pressure sensor device shown in FIG. 18 in a metal housing 28 using an O-ring 29, and the connection leads 19, 20, 21, and 22 are electrically connected to the metal housing 28. The connector housing 33 having the terminal plates 30, 31, 32 to be connected to each other is caulked by incorporating an O-ring 34 and a spacer ring 35. The metal housing 28 includes a pressure receiving body 36, a screw portion 37, a tightening portion 38, and a step portion 39 (see, for example, Patent Document 3).

  In addition, as a semiconductor pressure sensor, an amplifier circuit for an output signal from a piezoresistor is configured by integrating a resistor circuit network including an operational amplifier and a thin film resistor in a semiconductor element having a diaphragm portion in which a piezoresistor is formed. Are known. In the sensor device using the semiconductor pressure sensor, the semiconductor pressure sensor is housed in a sealed container. The space where the surface of the semiconductor pressure sensor faces in the container is kept at a constant pressure. And it is the structure which measures the pressure added to the back surface of a semiconductor pressure sensor via the pressure inlet of a container on the basis of the pressure in the container (for example, refer patent document 4).

Japanese Patent Laid-Open No. 2002-168718 (FIG. 1) Japanese Patent Laid-Open No. 2002-202215 (FIG. 1) JP 2000-55762 A (FIGS. 8 and 10) Japanese Patent Laid-Open No. 1-150832

  However, the pressure sensor device shown in FIG. 16 or FIG. 17 has a problem that the member cost and assembly cost increase because of the large number of parts. In the apparatus shown in FIG. 16, the signal transmission path is the pressure sensor 2, the wire bonding 5, the circuit board 4, the circuit chip, the terminal 6 and the terminal 7. On the other hand, in the apparatus shown in FIG. Each device is composed of many components and connection points between components, such as the circuit 17, the circuit chip, and the base member 18, so that the probability of failure increases and long-term reliability is lacking. There is a problem. Further, since the pressure sensor 2 is directly joined to the joint 1 in the apparatus shown in FIG. 16, the stress when screwing the joint 1 is transmitted to the pressure sensor 2 and the accuracy and reliability of the measurement signal is lowered. There is.

  Further, in the pressure sensor device shown in FIG. 18, silicon oil may be polarized due to the influence of external noise applied to the terminal and the outside, and charges may accumulate on the surface of the pressure sensor chip 25. Therefore, there is a problem that the signal of the pressure sensor chip 25 fluctuates and the reliability of the measurement signal is lowered. Further, there is a problem in that long-term reliability is lacking because the metal diaphragm 26 is repeatedly fatigued due to an increase in internal pressure due to expansion of silicon oil in a high temperature environment or compression of silicon oil when a high pressure is applied.

  In the pressure sensor device shown in FIG. 19, since the area of the portion that receives the pressure is large, the applied load becomes large. In order to support this load, it is necessary to increase the rigidity of the metal housing 28. Therefore, there is a problem that the cost is increased and the apparatus is increased in size.

  Further, in the pressure sensor device disclosed in Patent Document 4, since the external signal terminal for taking out the output signal to the outside is glass-sealed at the bottom of the container, it is assumed that the container is made of metal. However, the metal container has a disadvantage that it is expensive. In addition, in a case where the pressure sensor device is attached to an oil sealing block, an actuator block, or the like and the pressure is measured, the pressure inlet and the external signal terminal are the same as in the pressure sensor device disclosed in Patent Document 4. If it is provided on the side, the pressure sensor device cannot be attached to the oil-sealed block or the like by being obstructed by the external signal terminal. Therefore, it is necessary to project the external signal terminal on the side opposite to the side where the pressure introduction port is provided, but in the case of a metal container as described above, the external signal terminal is located on the opposite side of the pressure introduction port. There is a problem that it is difficult to provide.

  The present invention eliminates the problems caused by the above-described prior art, and is a low-cost, long-term reliability, pressure sensor device with high accuracy and reliability of measurement signals, and an external signal terminal. It aims at providing the pressure sensor apparatus arrange | positioned on the opposite side of a pressure inlet.

In order to solve the above-described problems and achieve the object, the pressure sensor device according to the invention of claim 1 has a means for converting the distortion of the pressure receiving portion into an electric signal by receiving pressure in the pressure receiving portion. A chip, a pedestal member having a through hole penetrating the first surface and the second surface and having a metal thin film on the first surface, and a through hole penetrating the first surface and the second surface; A pressure introducing means comprising a metal plate member, and a resin case having a signal terminal for taking out the electric signal from the pressure sensor chip, and the pressure receiving portion faces the through hole of the pedestal member. The sensor chip is joined to the second surface of the pedestal member, and the second surface of the pressure introducing means is connected to the second surface of the pedestal member in a state where the through hole of the pressure introducing means is connected to the through hole of the pedestal member. 1 through metal material The resin case is bonded to the pressure introducing means, and the pressure introducing means is a support portion with which another member integrated with the pressure introducing means is in contact with the outside of the end surface of the resin case. The signal terminal protrudes outward from the end face of the resin case, the pressure sensor chip and the signal terminal are electrically connected by wire bonding, and the planar shape of the resin case is rectangular. The pressure sensor cell has the support portion on two opposite sides of the rectangular shape, and the signal terminal is provided so as to protrude from a side adjacent to the two opposite sides of the rectangular shape having the support portion. It is characterized by comprising.
In order to solve the above-described problems and achieve the target, the pressure sensor device according to the invention of claim 2 is a semiconductor having means for converting the distortion of the pressure receiving portion into an electric signal by receiving pressure on the pressure receiving portion. A pressure sensor chip; a pedestal member having a through hole penetrating the first surface and the second surface; and a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface. A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip, and the pressure sensor chip faces the through hole of the pedestal member, and the pressure sensor chip is a second of the pedestal member. The second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive, with the through hole of the pressure introducing means connected to the through hole of the pedestal member. The resin case is in front Bonded to the pressure introducing means, the pressure introducing means has a support part on the outside of the end face of the resin case, with which another member integrated with the pressure introducing means comes into contact, and the signal terminal The pressure sensor chip and the signal terminal are electrically connected by wire bonding, the planar shape of the resin case is a rectangular shape, and the rectangular two opposing surfaces of the resin case protrude from the end surface of the resin case. The support terminal is provided at a side, and the signal terminal is formed of a pressure sensor cell provided so as to protrude from the side adjacent to the two opposing rectangular sides having the support part .

The pressure sensor device according to a third aspect of the present invention is the pressure sensor device according to the first or second aspect, wherein the resin case includes a first surface and a through-hole penetrating the second surface. The pressure sensor chip is bonded to the second surface of the pressure introducing means, and the pressure sensor chip is accommodated in the through hole of the resin case with a distance from the resin case.
According to a fourth aspect of the present invention, the pressure sensor device according to the first to third aspects is characterized in that the resin case is disposed on the second surface of the pressure introducing means.
According to a fifth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of the pressure receiving portion into an electric signal by receiving pressure on the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface and having a metal thin film on the first surface, and a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface; A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip, and the pressure sensor chip faces the through hole of the pedestal member, and the pressure sensor chip is a second surface of the pedestal member. And the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material in a state where the through hole of the pressure introducing means is connected to the through hole of the pedestal member. , The resin case has the pressure guide The pressure introducing means has a support portion on the outside of the end surface of the resin case, and a support portion with which another member integrated with the pressure introducing means is brought into contact. A pressure sensor cell that protrudes outward from the end face of the resin case and is electrically connected to the pressure sensor chip and the signal terminal by wire bonding, a housing portion that houses the pressure sensor cell, and the pressure sensor cell are disposed. A connector member in which one end is electrically connected to a signal terminal of the pressure sensor cell, and the other end projects to the outside, and a screw portion having a through hole; and the connector. A joint member having a fixing part for fixing the member and storing a pressure sensor cell disposed on the connector member, and the pressure sensor The cell is disposed on the connector member such that the opening of the first surface of the pressure introducing means is opened, the joint member abuts on the first surface of the support portion, and the first surface of the housing portion The side end abuts against the second surface of the support portion, the signal terminal of the pressure sensor cell and the signal terminal formed integrally with the connector member are electrically connected, and the through hole of the screw portion is It is connected to the through hole of the pressure introducing means, and the space between the first surface of the pressure introducing means and the joint member is sealed by a sealing means .

According to a sixth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; the first surface; A base member having a through hole penetrating the surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a signal terminal for taking out the electric signal from the pressure sensor chip The pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, and the through hole of the pressure introducing means In a state connected to the through hole of the pedestal member, the second surface of the pressure introducing means is adhered to the first surface of the pedestal member with an adhesive, and the resin case is adhered to the pressure introducing means, Pressure introduction means In addition, on the outside of the end surface of the resin case, there is a support portion with which another member integrated with the pressure introducing means comes into contact, and the signal terminal protrudes outside of the end surface of the resin case, A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding; a housing portion that houses the pressure sensor cell; and a placement portion that places the pressure sensor cell. A connector member that is electrically connected to a signal terminal of the pressure sensor cell, the other end of which protrudes to the outside, and a screw member having a through hole; and a fixing portion that fixes the connector member. A joint member including a pressure sensor cell disposed on the connector member, wherein the pressure sensor cell is a first surface of the pressure introducing means. The connector member is disposed so that the opening is opened, the joint member abuts on the first surface of the support portion, and the end portion on the first surface side of the housing portion is the second surface of the support portion. The pressure sensor cell signal terminal and the signal member integrally formed with the connector member are electrically connected to each other, the through hole of the screw portion is connected to the through hole of the pressure introducing means, and the pressure introduction The first surface of the means and the joint member are sealed with sealing means .

According to a seventh aspect of the present invention, in the pressure sensor device according to the fifth or sixth aspect, the connector member and the resin case are bonded together with an adhesive.
The pressure sensor device according to an eighth aspect of the present invention is the pressure sensor device according to any one of the fifth to seventh aspects, wherein the planar shape of the resin case is rectangular, and the two opposing rectangular shapes are arranged. The support part is provided at a side, and the signal terminal is provided so as to protrude from a side adjacent to the two opposing sides of the rectangular shape having the support part .
The pressure sensor device according to a ninth aspect of the present invention is the pressure sensor device according to any one of the fifth to eighth aspects, wherein the resin case has a through-hole penetrating the first surface and the second surface. And the first surface is bonded to the second surface of the pressure introducing means, and the pressure sensor chip is accommodated in the through hole of the resin case with a distance from the resin case. .
The pressure sensor device according to claim 10 is the pressure sensor device according to any one of claims 5 to 9, wherein the resin case is disposed on the second surface of the pressure introducing means. It is characterized by.
The pressure sensor device according to an eleventh aspect of the present invention is the pressure sensor device according to any one of the fifth to tenth aspects, wherein the sealing means is an O-ring, and the joint member is provided at the bottom of the storage portion. A concave portion having a through hole of the screw portion at a bottom portion is provided, and the O-ring is disposed in a concave portion at the bottom portion of the storage portion .

According to a twelfth aspect of the present invention, there is provided a semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electric signal by receiving pressure in the pressure receiving portion according to the invention, and a penetrating through the first surface and the second surface. A pedestal member having a hole and a metal thin film on the first surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a pressure sensor chip A resin case having a signal terminal for extracting the electrical signal, and the pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material, and the resin case Is adhered to the pressure introducing means The pressure introducing means has a support portion on the outside of the end face of the resin case, against which another member integrated with the pressure introducing means is in contact, and the signal terminal is an end face of the resin case A pressure sensor cell that protrudes outward, and the pressure sensor chip and the signal terminal are electrically connected by wire bonding, a housing having a through hole, and housing the pressure sensor cell, and the housing A fixing jig having a screw member to be fixed, and the pressure sensor cell is accommodated in the casing such that an opening of the first surface of the pressure introducing means is opened, and the casing is configured to support the supporting portion. The end surface on the first surface side of the fixing jig is in contact with the second surface of the support portion, and the signal terminal of the pressure sensor cell protrudes from the housing to the outside, The through hole of the housing introduces the pressure Leading to the through hole of the stage, characterized in that it is sealed by the sealing means between the first surface and the housing of the pressure introducing means.

According to a thirteenth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a signal terminal for taking out the electric signal from the pressure sensor chip The pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, and the through hole of the pressure introducing means In a state connected to the through hole of the pedestal member, the second surface of the pressure introducing means is adhered to the first surface of the pedestal member with an adhesive, and the resin case is adhered to the pressure introducing means, Pressure introduction hand Has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact, and the signal terminal protrudes outside of the end surface of the resin case. A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding, a housing having a through hole, and housing the pressure sensor cell, and a screw member for fixing the housing. And the pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened, and the housing is the first surface of the support portion. The end surface on the first surface side of the fixing jig abuts on the second surface of the support portion, and the signal terminal of the pressure sensor cell protrudes from the housing to the outside of the housing. A hole is connected to the through hole of the pressure introducing means. Ri, characterized in that it is sealed by the sealing means between the first surface of the pressure introducing means and said housing.

According to a fourteenth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; the first surface; A base member having a through hole penetrating the surface and having a metal thin film on the first surface, and a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface; A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip, and the pressure sensor chip faces the through hole of the pedestal member, and the pressure sensor chip is a second surface of the pedestal member. And the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material in a state where the through hole of the pressure introducing means is connected to the through hole of the pedestal member. The resin case is Adhered to the introduction means, the pressure introduction means has a support part on the outside of the end surface of the resin case, with which another member integrated with the pressure introduction means comes into contact, and the signal terminal is A pressure sensor cell that protrudes outward from the end surface of the resin case, and the pressure sensor chip and the signal terminal are electrically connected by wire bonding; a housing that has a through hole and accommodates the pressure sensor cell; The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened, the housing abuts on the first surface of the support portion, The caulking portion that stands up from the housing abuts on the second surface of the support portion, the signal terminal of the pressure sensor cell protrudes outward from the housing, and the through hole of the housing is a through hole of the pressure introducing means. Leading to the pressure Characterized in that it is sealed by the sealing means between the first surface of the introducing means and said housing.

According to a fifteenth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a signal terminal for taking out the electric signal from the pressure sensor chip The pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, and the through hole of the pressure introducing means In a state connected to the through hole of the pedestal member, the second surface of the pressure introducing means is adhered to the first surface of the pedestal member with an adhesive, and the resin case is adhered to the pressure introducing means, Pressure introduction hand Has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact, and the signal terminal protrudes outside of the end surface of the resin case. A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding, and a housing having a through hole and accommodating the pressure sensor cell, wherein the pressure sensor cell The pressure introduction means is accommodated in the housing so that the opening of the first surface is opened, the housing abuts on the first surface of the support portion, and the caulking portion standing up from the housing is the support The signal terminal of the pressure sensor cell protrudes from the housing to the outside, the through hole of the housing is connected to the through hole of the pressure introducing means, and the first of the pressure introducing means Between the surface and the housing Characterized in that it is sealed by the sealing means.

The pressure sensor device according to a sixteenth aspect of the present invention is the pressure sensor device according to any one of the twelfth to fifteenth aspects, wherein the planar shape of the resin case is a rectangular shape, and the support is provided on two opposite sides of the rectangular shape. The signal terminal is provided so as to protrude from a side adjacent to the two opposing sides of the rectangular shape having the support portion.
The pressure sensor device according to claim 17 is the pressure sensor device according to any one of claims 12 to 16, wherein the resin case includes a through-hole penetrating the first surface and the second surface, The first surface is bonded to the second surface of the pressure introducing means, and the pressure sensor chip is accommodated in a through hole of the resin case with a distance from the resin case.
The pressure sensor device according to an invention of claim 18 is the pressure sensor device according to any one of claims 12 to 17, characterized in that the resin case is disposed on a second surface of the pressure introducing means. To do.
The pressure sensor device according to the invention of claim 19 is the pressure sensor device according to any one of claims 12 to 18, wherein the sealing means comprises an O-ring.
A pressure sensor device according to a twentieth aspect of the present invention is the pressure sensor device according to any one of the first to twentieth aspects, wherein the pedestal member is made of glass, and the pressure sensor chip is bonded to the pedestal member by electrostatic bonding. It is characterized by being.
A pressure sensor device according to a twenty-first aspect of the present invention is the pressure sensor device according to any one of the first to nineteenth aspects, wherein the base member and the pressure sensor chip are made of silicon, and the pressure sensor chip is the base member. It is characterized by being bonded to each other by a low melting point glass.
According to a twenty-second aspect of the present invention, in the pressure sensor device according to any one of the first to twenty-first aspects, the pressure introducing means is made of 42 alloy, and nickel plating or nickel plating and gold plating are formed on the surface thereof. It is characterized by being given.

According to a twenty-third aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface and having a metal thin film on the first surface, and a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface; A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip, and the pressure sensor chip faces the through hole of the pedestal member, and the pressure sensor chip is a second surface of the pedestal member. And the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material in a state where the through hole of the pressure introducing means is connected to the through hole of the pedestal member. , A first of the pressure introducing means The entire surface is exposed,
The resin case is bonded to the second surface of the pressure introducing means, the signal terminal protrudes outside the end surface of the resin case, and the pressure sensor chip and the signal terminal are electrically connected by wire bonding. The resin case includes a first recess in which the pressure introducing means is accommodated in a first surface, and a second surface having a smaller opening area than the first recess and connected to the first recess. It is characterized by comprising a pressure sensor cell that is provided with two recesses, the pressure sensor chip is accommodated in the second recess with a distance from the resin case .

According to a twenty-fourth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electrical signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a signal terminal for taking out the electric signal from the pressure sensor chip The pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, and the through hole of the pressure introducing means The second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive while being connected to the through hole of the pedestal member, and the entire first surface of the pressure introducing means is exposed. The resin case Bonded to the second surface of the pressure introducing means, the signal terminal protrudes outside the end surface of the resin case, the pressure sensor chip and the signal terminal are electrically connected by wire bonding, and the resin The case includes a first recess in which the pressure introducing means is accommodated on a first surface, and a second recess having a smaller opening area than the first recess and connected to the first recess on the second surface. And a pressure sensor cell in which the pressure sensor chip is accommodated in the second recess with a distance from the resin case .

The pressure sensor device according to the invention of claim 25 is characterized in that, in the invention of claim 23 or 24, the second surface and the side surface of the pressure introducing means are bonded to the resin case .
According to a twenty-sixth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface and having a metal thin film on the first surface, and a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface; A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip, and the pressure sensor chip faces the through hole of the pedestal member, and the pressure sensor chip is a second surface of the pedestal member. And the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material in a state where the through hole of the pressure introducing means is connected to the through hole of the pedestal member. And the first of the pressure introducing means The entire surface is exposed, the resin case is adhered to the second surface of the pressure introducing means, the signal terminal protrudes outside the end surface of the resin case, and the pressure sensor chip and the signal terminal are connected to each other. A pressure sensor cell electrically connected by wire bonding; and an arrangement portion for disposing the pressure sensor cell, one end of which is electrically connected to a signal terminal of the pressure sensor cell and the other end of which projects to the outside. A joint member comprising an integrally formed connector member, a screw portion having a through-hole, and a storage portion for storing a pressure sensor cell disposed on the connector member, the fixing member having a fixing portion for fixing the connector member; And the first surface and the second surface of the resin case are sandwiched between the joint member and the connector member, and the pressure sensor cell is the pressure introducing means. The connector member is disposed so that the opening of the first surface is opened, the signal terminal of the pressure sensor cell and the signal terminal integrally formed with the connector member are electrically connected, and the through hole of the screw portion Is connected to the through hole of the pressure introducing means, and the space between the first surface of the pressure introducing means and the joint member is sealed by a sealing means .

According to a twenty-sixth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a signal terminal for taking out the electric signal from the pressure sensor chip The pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, and the through hole of the pressure introducing means In a state connected to the through hole of the pedestal member, the second surface of the pressure introducing means is adhered to the first surface of the pedestal member with an adhesive, and the resin case is adhered to the pressure introducing means, Pressure introduction hand Has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact, and the signal terminal protrudes outside of the end surface of the resin case. A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected to each other by wire bonding, and an arrangement portion in which the pressure sensor cell is disposed, and one end of which is electrically connected to the signal terminal of the pressure sensor cell. A pressure sensor cell that is disposed on the connector member and has a connector member integrally formed with a signal terminal whose other end protrudes to the outside, a screw portion having a through hole, and a fixing portion for fixing the connector member; A joint member including a storage portion, wherein the first surface and the second surface of the resin case are sandwiched between the joint member and the connector member, and the pressure The sensor cell is disposed on the connector member such that the opening of the first surface of the pressure introducing means is opened, and the signal terminal of the pressure sensor cell and the signal terminal integrally formed with the connector member are electrically connected. The through hole of the screw part is connected to the through hole of the pressure introducing means, and the first surface of the pressure introducing means and the joint member are sealed by a sealing means .

According to a twenty-seventh aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electrical signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a signal terminal for taking out the electric signal from the pressure sensor chip The pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, and the through hole of the pressure introducing means In a state connected to the through hole of the pedestal member, the second surface of the pressure introducing means is adhered to the first surface of the pedestal member with an adhesive, and the resin case is adhered to the pressure introducing means, Pressure introduction hand Has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact, and the signal terminal protrudes outside of the end surface of the resin case. A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected to each other by wire bonding, and an arrangement portion in which the pressure sensor cell is disposed, and one end of which is electrically connected to the signal terminal of the pressure sensor cell. A pressure sensor cell that is disposed on the connector member and has a connector member integrally formed with a signal terminal whose other end protrudes to the outside, a screw portion having a through hole, and a fixing portion for fixing the connector member; A joint member including a storage portion, wherein the first surface and the second surface of the resin case are sandwiched between the joint member and the connector member, and the pressure The sensor cell is disposed on the connector member such that the opening of the first surface of the pressure introducing means is opened, and the signal terminal of the pressure sensor cell and the signal terminal integrally formed with the connector member are electrically connected. The through hole of the screw part is connected to the through hole of the pressure introducing means, and the first surface of the pressure introducing means and the joint member are sealed by a sealing means .

According to a 28th aspect of the present invention, in the pressure sensor device according to the 26th or 27th aspect of the present invention, the sealing means comprises an O-ring, and the joint member is provided at the bottom of the storage portion, and A recess having a through hole at the bottom is provided, and the O-ring is disposed in a recess at the bottom of the storage.
According to a 29th aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure on the pressure receiving portion; the first surface; A base member having a through hole penetrating the surface and having a metal thin film on the first surface, and a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface; A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip, and the pressure sensor chip faces the through hole of the pedestal member, and the pressure sensor chip is a second surface of the pedestal member. And the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material in a state where the through hole of the pressure introducing means is connected to the through hole of the pedestal member. And the first of the pressure introducing means The entire surface is exposed, the resin case is adhered to the second surface of the pressure introducing means, the signal terminal protrudes outside the end surface of the resin case, and the pressure sensor chip and the signal terminal are connected to each other. A pressure sensor cell that is electrically connected by wire bonding; a housing having a through-hole that accommodates the pressure sensor cell; and a fixing jig having a screw member that fixes the housing. The first surface and the second surface of the resin case are sandwiched between the housing and the fixing jig, and the pressure sensor cell has the housing so that the opening of the first surface of the pressure introducing means is opened. The signal terminal of the pressure sensor cell protrudes from the housing to the outside, the through hole of the housing is connected to the through hole of the pressure introducing device, and the first surface of the pressure introducing device and the housing Hand sealed between the body Characterized in that it is sealed by.

According to a thirty-sixth aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a signal terminal for taking out the electric signal from the pressure sensor chip The pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, and the through hole of the pressure introducing means In a state connected to the through hole of the pedestal member, the second surface of the pressure introducing means is adhered to the first surface of the pedestal member with an adhesive, and the resin case is adhered to the pressure introducing means, Pressure introduction hand Has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact, and the signal terminal protrudes outside of the end surface of the resin case. A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding, a housing having a through hole, and housing the pressure sensor cell, and a screw member for fixing the housing. And a first surface and a second surface of the resin case are sandwiched between the housing and the fixing jig, and the pressure sensor cell is a first of the pressure introducing means. The opening of the surface is accommodated in the housing, the signal terminal of the pressure sensor cell protrudes outside from the housing, the through hole of the housing is connected to the through hole of the pressure introducing means, First of pressure introducing means Between surface and the housing characterized in that it is sealed by the sealing means.

According to a thirty-first aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface and having a metal thin film on the first surface, and a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface; A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip, and the pressure sensor chip faces the through hole of the pedestal member, and the pressure sensor chip is a second surface of the pedestal member. And the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material in a state where the through hole of the pressure introducing means is connected to the through hole of the pedestal member. And the first of the pressure introducing means The entire surface is exposed, the resin case is adhered to the second surface of the pressure introducing means, the signal terminal protrudes outside the end surface of the resin case, and the pressure sensor chip and the signal terminal are connected to each other. A pressure sensor cell electrically connected by wire bonding; a housing having a through hole and accommodating the pressure sensor cell; and the first surface and the second surface of the resin case, The pressure sensor cell is sandwiched between the casing and a caulking portion rising from the casing, and the pressure sensor cell is accommodated in the casing so that the opening of the first surface of the pressure introducing means is opened. The terminal protrudes from the casing to the outside, the through hole of the casing is connected to the through hole of the pressure introducing means, and the space between the first surface of the pressure introducing means and the casing is sealed by the sealing means. that it is sealed And features.

According to a thirty-second aspect of the present invention, there is provided a pressure sensor device comprising: a semiconductor pressure sensor chip having means for converting a distortion of a pressure receiving portion into an electric signal by receiving pressure at the pressure receiving portion; a first surface; A base member having a through hole penetrating the surface, a pressure introducing means comprising a metal plate member having a through hole penetrating the first surface and the second surface, and a signal terminal for taking out the electric signal from the pressure sensor chip The pressure sensor chip is joined to the second surface of the pedestal member in a state where the pressure receiving portion faces the through hole of the pedestal member, and the through hole of the pressure introducing means In a state connected to the through hole of the pedestal member, the second surface of the pressure introducing means is adhered to the first surface of the pedestal member with an adhesive, and the resin case is adhered to the pressure introducing means, Pressure introduction hand Has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact, and the signal terminal protrudes outside of the end surface of the resin case. A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected to each other by wire bonding, and a housing having a through hole and accommodating the pressure sensor cell. The first surface and the second surface are sandwiched between the casing and a caulking portion that stands up from the casing, and the pressure sensor cell is configured so that the opening of the first surface of the pressure introducing means is opened. The signal terminal of the pressure sensor cell that is housed in the housing protrudes outward from the housing, the through hole of the housing is connected to the through hole of the pressure introducing device, and the first surface of the pressure introducing device and the Sealing between housings Characterized in that it is sealed by the step.

A pressure sensor device according to a thirty-third aspect of the present invention is the pressure sensor device according to any one of the twenty-ninth to thirty-second aspects, wherein the sealing means is an O-ring and is provided at the bottom of the casing. A recess having a hole in the bottom is provided, and the O-ring is disposed in a recess provided in the bottom of the housing.
A pressure sensor device according to a thirty-fourth aspect of the present invention is the pressure sensor device according to any one of the twenty-ninth to thirty-second aspects, wherein the pedestal member is made of glass, and the pressure sensor chip is bonded to the pedestal member by electrostatic bonding. It is characterized by being.
A pressure sensor device according to a thirty-fifth aspect of the present invention is the pressure sensor device according to any one of the twenty-third to thirty-third aspects, wherein the base member and the pressure sensor chip are made of silicon, and the pressure sensor chip is the base member. It is characterized by being bonded to each other by a low melting point glass.
A pressure sensor device according to a thirty-sixth aspect of the present invention is the pressure sensor device according to any one of the twenty-third to thirty-fifth aspects, wherein the pressure introducing means is made of 42 alloy, and nickel plating or nickel plating and gold plating are formed on the surface thereof. It is characterized by being given.
According to a 37th aspect of the present invention, in the pressure sensor device according to the 1st, 12th or 14th aspect of the present invention, the metal thin film is composed of three layers of chromium, platinum and gold. And

According to the invention of claim 1, 2, 23 or 24 , since the pressure medium is guided to the pressure receiving portion of the pressure sensor chip through the pressure introducing means, silicon oil which has a great influence on the pressure sensor chip is not used. However, the pressure can be directly received by the pressure receiving portion. Therefore, fluctuations in the output signal due to the influence of silicon oil can be avoided, so that the accuracy and reliability of the measurement signal can be increased. Moreover, since the area of the site | part which receives a pressure is limited to the back surface of the pressure receiving part of a silicon chip, the load applied to a pressure sensor main body becomes small. Therefore, the pressure sensor device can be miniaturized and the structure can be simplified.

According to the inventions of claims 5 , 6, 12 to 15 , and 26 to 32 , an explosion-proof file-safe structure using a pressure medium can be realized with a simple configuration with a small number of parts, and thus a highly reliable pressure sensor. A device can be obtained. Moreover, member cost and assembly cost can be kept low. Furthermore, since the stress from the threaded portion when the pressure sensor device is screwed into the oil sealing block or the like is relieved by, for example, an O-ring that is a sealing means, the accuracy and reliability of the measurement signal can be increased. . In addition, a pressure sensor device is obtained in which a signal terminal to the outside is disposed at the opening at the open end of the pressure introducing means, that is, on the opposite side of the pressure introducing port.

According to the invention of claim 37 , when the pressure introducing means is joined to the glass pedestal member, chromium is excellent in adhesion to glass. Further, when gold / tin eutectic solder or high temperature solder is used for joining the pressure introducing means and the pedestal member, the surface of the metal thin film on the solder side is preferably gold, but it is preferable to contact gold and chromium. There is no platinum between gold and chromium to avoid contact between gold and chromium. For this reason, by providing a metal thin film having a three-layer structure, the bonding strength between the pressure introducing means and the base member is increased.

According to invention of Claim 2, 24 , the cost of a member can be lowered | hung by fixing a base member and a pressure introduction means with an adhesive agent.
According to the invention of claim 1, 2, 23 or 24 , by constituting the pressure introducing means by a metal plate member, the cost of the member can be reduced as compared with the case where the pressure introducing means is constituted by a metal pipe member. .

According to the invention of claim 1, the pressure introducing means, a support portion protruding outward from the resin case, being in contact with other members, such as connector member, the other members in the pressure introducing means Since a pressure sensor cell or a pressure sensor device capable of measuring pressure up to a high pressure range can be obtained.

  According to the pressure sensor device of the present invention, the number of connection points on the signal transmission path to the outside is minimized, and the failure probability is lowered. Therefore, an effect that a pressure sensor device having a long-term reliability can be obtained. Play. In addition, there is an effect that a low-cost pressure sensor device with a small number of parts can be obtained. In addition, since fluctuations in the output signal due to the influence of silicon oil can be avoided, the accuracy and reliability of the measurement signal is enhanced. Furthermore, since the stress from the screw portion when the pressure sensor device is screwed in is relieved, there is an effect that the accuracy and reliability of the measurement signal is increased. In addition, there is an effect that a pressure sensor device in which a signal terminal to the outside is arranged on the side opposite to the pressure inlet is obtained.

It is sectional drawing which shows the structure of the pressure sensor cell concerning Embodiment 1 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 2 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 3 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 4 of this invention. It is sectional drawing which shows the structure of the pressure sensor cell concerning Embodiment 5 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 6 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 7 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 8 of this invention. It is a top view which shows the structure of the pressure sensor cell concerning Embodiment 9 of this invention. It is sectional drawing which shows the structure of the pressure sensor cell concerning Embodiment 9 of this invention. It is sectional drawing which shows the structure of the pressure sensor cell concerning Embodiment 9 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 10 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 10 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 11 of this invention. It is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 12 of this invention. It is sectional drawing which shows the structure of the conventional pressure sensor apparatus. It is a disassembled perspective view for demonstrating the structure of the conventional pressure sensor apparatus. It is sectional drawing which shows the structure of the conventional pressure sensor apparatus. It is sectional drawing which shows the structure of the conventional pressure sensor apparatus.

  Exemplary embodiments of a pressure sensor device according to the present invention will be explained below in detail with reference to the accompanying drawings. In the following description of each embodiment, the same components as those in the other embodiments are denoted by the same reference numerals and description thereof is omitted.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a configuration of a pressure sensor cell according to the first embodiment of the present invention. As shown in FIG. 1, the pressure sensor cell 100 includes a pressure sensor chip 41, a base member 42, a metal pipe member 43, and a resin case 44.

  The pressure sensor chip 41 includes a diaphragm 45 that is a pressure receiving portion formed by recessing, for example, from a first surface (lower surface in FIG. 1) of semiconductor silicon. The diaphragm 45 receives pressure. At least four gauges (not shown) made of diffused resistors are formed on the second surface (upper surface in FIG. 1) of the semiconductor silicon at a position corresponding to the back side of the diaphragm 45. These gauges convert a strain generated on the second surface of the semiconductor silicon when a pressure is applied to the concave surface of the diaphragm 45 into a resistance value. The pressure sensor chip 41 may be made of other semiconductor materials.

  Although not shown, the pressure sensor chip 41 includes a Wheatstone bridge circuit constituted by the gauge, a circuit for amplifying the output signal of the Wheatstone bridge circuit, a circuit for correcting sensitivity, and a circuit for correcting offset. A circuit for correcting temperature characteristics of sensitivity and offset is formed. The pressure sensor chip 41 is also formed with a surge protection element, a filter (not shown), and the like.

  The base member 42 is not particularly limited, but is made of, for example, a glass material, that is, Pyrex (registered trademark) glass, Tempax glass, or the like. A through hole 46 through which a pressure medium such as air or oil passes is provided at the center of the base member 42. The base member 42 and the pressure sensor chip 41 are joined by electrostatic joining using a joining condition of 400 ° C./400V. At that time, the diaphragm 45 is aligned and joined so as to face the through hole 46. By thus electrostatically bonding, the pressure sensor chip 41 and the pedestal member 42 can be bonded while maintaining high airtightness between them. Therefore, a highly airtight structure can be realized.

  A metal thin film 47 composed of three layers of chromium, platinum, and gold is laminated on the surface of the pedestal member 42 on the side to be joined to the metal pipe member 43 that is the pressure introducing means. Since chromium is excellent in adhesion to the glass material, the metal thin film 47 is not peeled off. Moreover, the contact of chromium and gold is prevented by platinum. Gold is suitable for joining the pedestal member 42 and the metal pipe member 43 through gold / tin eutectic solder, high-temperature solder, or the like.

  The metal pipe member 43 is not particularly limited, but is made of, for example, 42 alloy, and the surface thereof is plated with nickel. Alternatively, a combination of nickel plating and gold plating may be used. A through-hole 48 through which a pressure medium such as air or oil passes is provided at the center of the metal pipe member 43. The metal pipe member 43 and the base member 42 are aligned so that their through holes 46 and 48 are continuous, and are joined by a metal material 49 such as gold / tin eutectic solder or high temperature solder. The reason why the metal pipe member 43 is plated is that the bonding strength with the base member 42 is increased.

The reason why gold / tin eutectic solder or high temperature solder is used as the metal material 49 is to withstand use at high temperatures. Moreover, since the Young's modulus of these solders is low, the stress between the base member 42 and the metal pipe member 43 can be relieved. Here, the thermal expansion coefficients of chromium, platinum, and gold are 4.5 × 10 ⁻⁶ / ° C., 9 × 10 ⁻⁶ / ° C., and 14.3 × 10 ⁻⁶ / ° C., respectively. Further, the thermal expansion coefficient of the glass material of the base member 42 is 3.2 × 10 ⁻⁶ / ° C. The thermal expansion coefficient of the 42 alloy material of the metal pipe member 43 is 4.3 × 10 ⁻⁶ / ° C.

  Also, the metal pipe member 43 faces outward from the end joined to the base member 42 to the other end, that is, the open end where the through hole 48 of the metal pipe member 43 opens. Has a stepped portion 50 protruding from the top. In the following description, the opening of the through hole 48 at the open end 51 of the metal pipe member 43 is referred to as a pressure introduction port 52.

  The resin case 44 has a recess 53 on one end side thereof. The recess 53 accommodates the pressure sensor chip 41 and the pedestal member 42. Further, a hole portion 54 penetrating from the bottom of the concave portion 53 to the opposite end portion is provided. A metal pipe member 43 is accommodated in the hole 54. A recess 55 into which the stepped portion 50 of the metal pipe member 43 is formed is formed at the end of the resin case 44 opposite to the recess 53. In a state where the stepped portion 50 is in the concave portion 55, the surface 56 of the stepped portion 50 on the side opposite to the pressure introduction port 52 and the surface 57 of the concave portion 55 with which the surface 56 abuts are bonded.

  By adhering these surfaces 56 and 57, when pressure is applied by the pressure medium introduced from the pressure introduction port 52, the pressure presses the stepped portion 50 of the metal pipe member 43 against the resin case 44. Therefore, the structural reliability against pressure is high. The resin case 44 has an external signal terminal 58, and the base end of the signal terminal 58 is exposed to the side of the recess 53. The exposed portion of the signal terminal 58 and the pressure sensor chip 41 are electrically connected by wire bonding 59.

  In the pressure sensor cell 100 having the above-described configuration, when a pressure medium is introduced from the pressure introduction port 52 and pressure is received by the diaphragm 45 of the pressure sensor chip 41, the diaphragm 45 is deformed. And the gauge resistance value on the diaphragm 45 changes, and the voltage signal according to it changes. The voltage signal is amplified by an amplifier circuit adjusted by an adjustment circuit such as a sensitivity correction circuit, an offset correction circuit, or a temperature characteristic correction circuit, and is output from the pressure sensor chip 41. The output signal is output to the signal terminal 58 via the wire bonding 59.

At that time, the pressure medium contacts only the inner wall of the metal pipe member 43, the inner wall of the base member 42, and the diaphragm 45 of the pressure sensor chip 41. Therefore, even if the pressure medium is an air conditioner medium such as R134a gas or CO ₂ gas, or oil or lubricating oil, the pressure sensor cell 100 does not deteriorate, and high reliability can be obtained over a long period of time. . In addition, even when measuring high pressure, the area for receiving pressure (pressure receiving area) is only the diaphragm 45, so that the structure and material of the pressure sensor device using the pressure sensor cell 100 can be made as small and light as possible. Therefore, a low-cost pressure sensor device can be realized.

Specifically, for example, it is assumed that the measurement pressure is 20 MPa and the diameter of the diaphragm 45 is φ1 mm. In this case, the pressure receiving area is 0.78 mm ^2, the load pressure sensor cell 100 is subjected is calculated at 20 MPa × 0.78 mm ^2. When the area of the surface 57 of the concave portion 55 of the resin case 44, that is, the surface 57 (hereinafter referred to as a back surface support portion) against which the stepped portion 50 of the metal pipe member 43 is pressed by pressure is 14.9 mm ² , the back surface of the resin case 44 compressive stress generated in the support portion is calculated in 20MPa × 0.78mm ² /14.9mm ^2, a 1.05 MPa.

  In general, as a resin material used for such a use, that is, the resin case 44 and the like, there are an epoxy resin, a polyphenylene sulfide (PPS) resin, a polybutene terephthalate (PBT) resin, a nylon resin, and the like. The fracture stress of these resins is 98 to 196 Pa level. Therefore, even if a compressive stress of about 1.05 MPa is generated on the back surface support portion of the resin case 44, safety is sufficiently ensured, so that extremely high reliability can be obtained over a long period of time.

  In addition, since the number of connection points of the signal transmission path until output to the outside can be minimized, the failure probability is lowered at each stage. Silicon can also be used as the material of the base member 42. In that case, what is necessary is just to join the pressure sensor chip 41 and the base member 42 using low melting glass. By doing so, the thermal stress received by the pressure sensor chip 41 from the metal pipe member 43 is absorbed by the pedestal member 42, so that the thermal stress from the metal pipe member 43 can be reduced.

Embodiment 2. FIG.
FIG. 2 is a cross-sectional view showing the configuration of the pressure sensor device according to the second embodiment of the present invention. As shown in FIG. 2, the pressure sensor device 200 according to the second embodiment is configured such that the pressure sensor cell 100 according to the first embodiment is sandwiched between a connector member 61 and a joint member 62, and the joint member 62 is caulked to thereby press the pressure sensor cell 100. The connector member 61 and the joint member 62 are integrated.

  The connector member 61 has a structure in which a housing part 63 for accommodating the pressure sensor cell 100 and a socket part 64 for taking out the output of the pressure sensor device 200 to the outside are integrally formed. The socket part 64 is thinner than the housing part 63, and a step part 65 is formed between the housing part 63 and the socket part 64. An external signal terminal 66 is embedded in a partition portion between the housing portion 63 and the socket portion 64. One end of the signal terminal 66 is exposed in the housing portion 63, and the other end is exposed in the socket portion 64.

  The connector member 61 and the pressure sensor cell 100 are opened such that the pressure introduction port 52 of the pressure sensor cell 100 is opened at an end surface (arrangement portion) exposed in the housing portion 63 of the partition portion between the housing portion 63 and the socket portion 64. The end surface opposite to the end 51 is integrated by bonding with a silicon adhesive or an epoxy adhesive. As described above, the pressure sensor cell 100 is bonded to the connector member 61, so that the reliability against mechanical shocks such as vibrations and shocks is further improved. In addition, the base end portion of the signal terminal 66 exposed in the housing portion 63 is electrically connected to the signal terminal 58 of the pressure sensor cell 100 by laser welding.

  A through hole 67 is provided in a partition portion between the housing portion 63 and the socket portion 64. The through hole 67 is provided so that the space of the recess 53 in which the pressure sensor chip 41 is accommodated in the resin case 44 of the pressure sensor cell 100 is not sealed. When this through hole 67 is not provided, when the connector member 61 is attached to the pressure sensor cell 100, the gas confined in the recess 53 contracts due to a temperature change, and the characteristics of the pressure sensor fluctuate.

  In the present embodiment, the presence of the through hole 67 allows the gas to enter and exit through the through hole 67 even if the gas in the recess 53 contracts due to a temperature change, so that the characteristics of the pressure sensor do not change. . In the example shown in FIG. 2, the recess 53 in which the pressure sensor chip 41 is accommodated is filled with a gel 68. The gel 68 may be omitted, but it is effective for protecting the pressure sensor chip 41. Therefore, the recess 68 is preferably filled with the gel 68.

  The joint member 62 has a fixing portion that fixes the housing portion 63 of the connector member 61, and includes a storage portion 69 that stores the pressure sensor cell 100, and a screw portion 70 that protrudes from the bottom portion of the storage portion 69 to the outside of the storage portion 69. The structure is formed integrally. A through-hole 71 through which a pressure medium such as air or oil passes is provided at the center of the screw portion 70. The joint member 62 and the connector member 61 cover the housing portion 63 of the connector member 61 to which the pressure sensor cell 100 is bonded with the housing portion 69 of the joint member 62, and the leading edge of the housing portion 69 is stepped by a machine or the like. It can be fixed by caulking along. Fixing may be performed by a method other than caulking, such as adhesion. By being fixed, the pressure introduction port 52 of the pressure sensor cell 100 is configured to be connected to the through hole 71 of the screw portion 70.

  As shown in FIG. 2, the pressure sensor device 200 is attached to the housing 300 by screwing a screw portion 70 into a screw hole 301 that penetrates the housing 300 in which the pressure medium is sealed. In the attached state, the through hole 71 of the screw portion 70 is connected to a space in the housing 300 in which the pressure medium is enclosed. Therefore, the pressure medium is guided to the diaphragm 45 of the pressure sensor chip 41 through the through hole 71 of the screw portion 70, the metal pipe member 43 of the pressure sensor cell 100, and the through holes 48 and 46 of the base member 42. The housing 300 is, for example, an oil-filled block of a transmission or a block of a hydraulic actuator.

  A recess 72 is formed at the bottom of the storage unit 69. The end portion of the metal pipe member 43 on the pressure introduction port 52 side enters the recess 72. Further, an O-ring 73 which is a sealing means for sealing between the metal pipe member 43 and the joint member 62 is housed in the recess 72. The O-ring 73 seals between at least the side surface of the recess 72 and the side surface of the metal pipe member 43 in the recess 72 of the storage unit 69. The O-ring 73 prevents the pressure medium guided to the metal pipe member 43 through the through hole 71 of the threaded portion 70 from flowing into a portion other than the through hole 48 of the metal pipe member 43. As a means for sealing, it is also possible to seal between the metal pipe member 43 and the joint member 62 by projection welding, laser welding, or the like.

  Also, an O-ring 74 is provided between the housing part 63 of the connector member 61 and the storage part 69 of the joint member 62 to seal the gap therebetween. The O-ring 74 causes the pressure medium to leak when the pressure medium leaks from the metal pipe member 43, when the pressure sensor chip 41 is damaged, or when the bonding interface between the pressure sensor chip 41 and the base member 42 is peeled off. Prevents leakage to the outside.

  Thus, since it is a simple structure, member cost and assembly cost can be held down. Further, since the stress from the screw portion 70 when the pressure sensor device 200 is screwed into the housing 300 is transmitted to the pressure sensor chip 41 through the O-ring 73, the stress is relieved by the O-ring 73. Therefore, the accuracy and reliability of the measurement signal is increased. Further, an external signal terminal 66 is disposed on the opposite side to the opening for introducing the pressure medium.

Embodiment 3 FIG.
FIG. 3 is a cross-sectional view showing a configuration of a pressure sensor device according to Embodiment 3 of the present invention. As shown in FIG. 3, the pressure sensor device according to the third embodiment is obtained by fixing the pressure sensor cell 100 according to the first embodiment to a housing 300 enclosing a pressure medium using a fixing jig 310. That is, the housing 300 is provided with a recess 302, and the pressure sensor cell 100 is accommodated in the recess 302. A fixing jig 310 is placed over the housing 300 and the pressure sensor cell 100 and is fixed to the housing 300 by a screw member 311. The pressure sensor cell 100 is fixed by the pressure applied from the pressure inlet 52 and the reaction force from the fixing jig 310 against the pressure.

  A second-stage recess 303 is formed at the bottom of the recess 302. The end of the metal pipe member 43 of the pressure sensor cell 100 on the pressure introduction port 52 side enters the recess 303. A through hole 304 through which a pressure medium such as air or oil passes is provided at the bottom of the second-stage recess 303. The through hole 304 is connected to the through hole 48 of the metal pipe member 43. Therefore, the pressure medium is guided to the diaphragm 45 of the pressure sensor chip 41 through the through hole 304 of the housing 300, the metal pipe member 43 of the pressure sensor cell 100, and the through holes 48 and 46 of the base member 42.

  An O-ring 75 that seals between the metal pipe member 43 and the housing 300 is accommodated in the second-stage recess 303. The O-ring 75 seals at least the side surface of the recess 303 and the side surface of the metal pipe member 43 in the second-stage recess 303. The O-ring 75 prevents the pressure medium guided to the metal pipe member 43 through the through hole 304 of the housing 300 from flowing into a portion other than the through hole 48 of the metal pipe member 43. An O-ring 76 that seals between the resin case 44 of the pressure sensor cell 100 and the housing 300 is housed in the first-stage recess 302. The O-ring 76 causes the pressure medium to leak when the pressure medium leaks from the metal pipe member 43, when the pressure sensor chip 41 is damaged, or when the bonding interface between the pressure sensor chip 41 and the base member 42 is peeled off. Prevents leakage to the outside.

  As shown in FIG. 3, in the third embodiment, the signal terminal 58 of the pressure sensor cell 100 is bent and connected to a printed circuit board 400 installed near the housing 300 by direct soldering or the like. Here, when the fixing jig 310 completely closes the concave portion 302 of the housing 300, although not shown in the drawing, the fixing jig 310 is provided with a through hole, and the resin of the pressure sensor cell 100 is provided. The space of the recess 53 in which the pressure sensor chip 41 is accommodated in the case 44 is not sealed. Alternatively, the fixing jig 310 is configured to open a part of the recess 53 without completely closing the recess 53 of the resin case 44. The recess 53 may be filled with gel.

Embodiment 4 FIG.
FIG. 4 is a cross-sectional view showing a configuration of a pressure sensor device according to Embodiment 4 of the present invention. As shown in FIG. 4, the pressure sensor device according to the fourth embodiment uses the fixing jig 310 and the screw member 311 to fix the pressure sensor cell 100 in the third embodiment, instead of the concave portions 302 and 303 of the housing 300. The pressure sensor cell 100 placed inside is fixed by caulking a caulking portion 321 rising from the housing 300 using a machine or the like. Therefore, in the fourth embodiment, the fixing jig 310 and the screw member 311 are unnecessary, and the number of parts can be reduced. Also in the fourth embodiment, the O-ring 75 seals at least the side surface of the recess 303 and the side surface of the metal pipe member 43 in the second-stage recess 303 of the housing 300. Other configurations are the same as those of the third embodiment.

Embodiment 5 FIG.
FIG. 5 is a cross-sectional view showing a configuration of a pressure sensor cell according to the fifth embodiment of the present invention. As shown in FIG. 5, the pressure sensor cell 101 includes a pressure sensor chip 41, a base member 42, a metal plate member 143, and a resin case 144. The configurations of the pressure sensor chip 41 and the base member 42 are the same as those in the first embodiment.

  The metal plate member 143 is not particularly limited, but is made of, for example, 42 alloy, and the surface thereof is plated with nickel. Alternatively, a combination of nickel plating and gold plating may be used. A through hole 148 through which a pressure medium such as air or oil passes is provided at the center of the metal plate member 143. The metal plate member 143 and the pedestal member 42 are aligned so that the through hole 46 of the pedestal member 42 and the through hole 148 of the metal plate member 143 are continuous with each other, such as gold / tin eutectic solder or high temperature solder. Joined by a metal material 49. The reason for plating the metal plate member 143 is that the bonding strength with the base member 42 is increased.

  The resin case 144 has a first recess 153 on one end side thereof. In the first recess 153, the pressure sensor chip 41 and the base member 42 are accommodated. In addition, a second concave portion 155 having an opening area larger than that of the first concave portion 153 and connected to the first concave portion 153 is formed at an end of the resin case 144 opposite to the first concave portion 153. Yes. That is, the first recess 153 and the second recess 155 form a hole that penetrates the resin case 144. A metal plate member 143 is accommodated in the second recess 155. When the opening of the through hole 148 at the open end 151 of the metal plate member 143 is a pressure introduction port 152, a surface 156 opposite to the pressure introduction port 152 and a bottom surface 157 of the second recess 155 with which the surface 156 abuts. And are adhered.

  By adhering these surfaces 156 and 157, when pressure is applied by the pressure medium introduced from the pressure introduction port 152, the pressure acts to press the metal plate member 143 against the resin case 144. Therefore, structural reliability against pressure is high. The resin case 144 has an external signal terminal 158, and the base end of the signal terminal 158 is exposed to the side of the first recess 153. The exposed portion of the signal terminal 158 and the pressure sensor chip 41 are electrically connected by wire bonding 59.

  In the pressure sensor cell 101 having the above-described configuration, when a pressure medium is introduced from the pressure introduction port 152 and pressure is received by the diaphragm 45 of the pressure sensor chip 41, the diaphragm 45 is deformed. And the gauge resistance value on the diaphragm 45 changes, and the voltage signal according to it changes. The voltage signal is amplified by an amplifier circuit adjusted by an adjustment circuit such as a sensitivity correction circuit, an offset correction circuit, or a temperature characteristic correction circuit, and is output from the pressure sensor chip 41. Then, the output signal is output to the signal terminal 158 via the wire bonding 59.

  At that time, the pressure medium contacts only the inner wall of the metal plate member 143, the inner wall of the base member 42, and the diaphragm 45 of the pressure sensor chip 41. Therefore, even if the pressure medium is an air conditioner medium, oil, lubricating oil, or the like, the pressure sensor cell 101 is not deteriorated, and high reliability can be obtained over a long period of time. In addition, even when measuring high pressure, the area for receiving pressure (pressure receiving area) is only the diaphragm 45, so that the structure and material of the pressure sensor device using the pressure sensor cell 101 can be made as small and light as possible. Therefore, a low-cost pressure sensor device can be realized.

Specifically, for example, when the measurement pressure is 20 MPa and the diameter of the diaphragm 45 is φ1 mm, the pressure receiving area is 0.78 mm ² , so the load received by the pressure sensor cell 101 is calculated as 20 MPa × 0.78 mm ² . Is done. When the area of the bottom surface 157 of the second recess 155 of the resin case 144, that is, the back surface support portion against which the metal plate member 143 is pressed by pressure is 14.9 mm ² , the compressive stress generated in the back surface support portion of the resin case 144 is It is calculated by 20 MPa × 0.78 mm ² /14.9 mm ² and becomes 1.05 MPa.

  As in the first embodiment, the resin material used for the resin case 144 is an epoxy resin, a polyphenylene sulfide (PPS) resin, a polybutylene terephthalate (PBT) resin, a nylon resin, or the like. Since the fracture stress of these resins is at a level of 98 to 196 Pa, safety is sufficiently ensured even if a compressive stress of about 1.05 MPa is generated on the back surface support portion of the resin case 144. Therefore, extremely high reliability can be obtained over a long period of time.

  Further, as in the first embodiment, since the number of signal transmission path connection points until output to the outside can be minimized, the failure probability is lowered at each stage. Further, when silicon is used as the material of the pedestal member 42 and the pressure sensor chip 41 and the pedestal member 42 are bonded using low-melting glass, the thermal stress received by the pressure sensor chip 41 from the metal plate member 143 is the pedestal member. Therefore, the thermal stress from the metal plate member 143 can be reduced. Further, by using the metal plate member 143 instead of the metal pipe member 43, the member cost can be reduced as compared with the first embodiment.

Embodiment 6 FIG.
FIG. 6 is a cross-sectional view showing a configuration of a pressure sensor device according to Embodiment 6 of the present invention. As shown in FIG. 6, the pressure sensor device 201 according to the sixth embodiment sandwiches the pressure sensor cell 101 according to the fifth embodiment between the connector member 61 and the joint member 62 in the same manner as in the second embodiment. By caulking, the pressure sensor cell 101, the connector member 61, and the joint member 62 are integrated. The configurations of the connector member 61 and the joint member 62 are the same as those in the second embodiment.

  The connector member 61 and the pressure sensor cell 101 are connected to the pressure introduction port 152 of the pressure sensor cell 101 on the end surface (arrangement portion) exposed in the housing portion 63 of the partition portion between the housing portion 63 and the socket portion 64 of the connector member 61. Are integrated by adhering an end face opposite to the open end 151 where the opening is opened with a silicon adhesive or an epoxy adhesive. As described above, the pressure sensor cell 101 is bonded to the connector member 61, so that the reliability against mechanical shock such as vibration and shock is further improved. The base end portion of the signal terminal 66 exposed in the housing portion 63 is electrically connected to the signal terminal 158 of the pressure sensor cell 101 by laser welding.

  In the example shown in FIG. 6, the first recess 153 in which the pressure sensor chip 41 is accommodated is filled with the gel 68. Although there is no need for the gel 68, it is effective for protecting the pressure sensor chip 41. Therefore, the gel 68 is preferably filled in the first recess 153. In the pressure sensor device 201, the pressure medium sealed in the space in the casing 300 is transmitted through the through hole 71 of the screw portion 70 of the joint member 62, the metal plate member 143 of the pressure sensor cell 101, and the through holes 148 and 46 of the base member 42. Then, it is guided to the diaphragm 45 of the pressure sensor chip 41.

  An O-ring 173, which is a sealing means for sealing between the metal plate member 143 and the joint member 62, is housed in a recess 72 formed at the bottom of the storage portion 69 of the joint member 62. The O-ring 173 seals at least the bottom surface of the recess 72 and the open end 151 of the metal plate member 143 in the recess 72 of the storage unit 69. The O-ring 173 prevents the pressure medium guided to the metal plate member 143 through the through hole 71 of the screw portion 70 from flowing into a portion other than the through hole 148 of the metal plate member 143.

  Thus, according to Embodiment 6, since it is a simple structure, member cost and assembly cost can be held down low. Further, since the stress from the screw portion 70 when the pressure sensor device 201 is screwed into the housing 300 is transmitted to the pressure sensor chip 41 via the O-ring 173, the stress is relieved by the O-ring 173. Therefore, the accuracy and reliability of the measurement signal is increased. Further, an external signal terminal 66 is disposed on the opposite side to the opening for introducing the pressure medium.

  Furthermore, in the sixth embodiment, the load acting on the pressure sensor cell 101 by the pressure medium is determined by the area S1 of the shape formed by the tangent line between the open end 151 of the metal plate member 143 and the O-ring 173. On the other hand, in the second embodiment, the load acting on the pressure sensor cell 100 by the pressure medium is determined by the area S2 of the shape formed by the tangent line between the side surface of the recess 72 of the joint member 62 and the O-ring 73. Since S1 is smaller than S2, in the sixth embodiment, the load acting on the pressure sensor cell 102 is smaller than in the second embodiment. Therefore, the sixth embodiment is suitable for measuring a higher pressure than the second embodiment.

Embodiment 7 FIG.
FIG. 7: is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 7 of this invention. As shown in FIG. 7, the pressure sensor device according to the seventh embodiment includes the pressure sensor cell 101 according to the fifth embodiment and the pressure sensor cell 101 in the recess 302 formed in the housing 300 as in the third embodiment. The fixing jig 310 is screwed onto the housing 300 with a screw member 311 from above. The pressure sensor cell 101 is fixed by the pressure applied from the pressure inlet 152 and the reaction force from the fixing jig 310 against the pressure.

  An O-ring 175 that seals between the metal plate member 143 and the housing 300 is housed in a second-stage recess 303 formed at the bottom of the recess 302. The O-ring 175 seals between the at least bottom surface of the recess 303 and the open end 151 of the metal plate member 143 in the second-stage recess 303. The O-ring 175 prevents the pressure medium guided to the metal plate member 143 through the through hole 304 of the housing 300 from flowing into a portion other than the through hole 148 of the metal plate member 143. Further, the signal terminal 158 of the pressure sensor cell 101 is bent and connected to the printed circuit board 400 installed near the housing 300 by direct soldering or the like.

Embodiment 8 FIG.
FIG. 8: is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 8 of this invention. As shown in FIG. 8, the pressure sensor device according to the eighth embodiment is similar to the fourth embodiment in place of fixing the pressure sensor cell 101 using the fixing jig 310 and the screw member 311 in the seventh embodiment. The pressure sensor cell 101 placed in the recesses 302 and 303 of the housing 300 is fixed by caulking a caulking portion 321 standing from the housing 300 using a machine or the like. Therefore, in the eighth embodiment, the fixing jig 310 and the screw member 311 are not necessary, and the number of parts can be reduced as compared with the seventh embodiment. Also in the eighth embodiment, the O-ring 175 seals between at least the bottom surface of the recess 303 and the open end 151 of the metal plate member 143 in the second recess 303 of the housing 300. . Other configurations are the same as those of the seventh embodiment.

Embodiment 9 FIG.
FIG. 9 is a plan view showing the configuration of the pressure sensor cell according to the ninth embodiment of the present invention, and FIGS. 10 and 11 are cross-sectional views showing the configuration along the cutting lines AA and BB in FIG. 9, respectively. It is. As shown in these drawings, the pressure sensor cell 102 includes a pressure sensor chip 41, a base member 42, a metal plate member 243, and a resin case 244. The configurations of the pressure sensor chip 41 and the base member 42 are the same as those in the first embodiment.

  The resin case 244 is not particularly limited. For example, the planar shape is rectangular, and for example, four signal terminals 258 protrude from a pair of opposing sides. The signal terminal 258 arranged on one side of the resin case 244 is an external connection terminal for taking out the output of the pressure sensor cell 102 to the outside. The signal terminals 258 arranged on the other side of the resin case 244 are internal adjustment terminals used when adjusting the characteristics of the pressure sensor cell 102, and may be shorter than the external connection terminals, for example.

  Further, the resin case 244 has a recess 253. The recess 253 accommodates the pressure sensor chip 41 and the pedestal member 42, and the base end of the signal terminal 258 is exposed. The exposed portion of the signal terminal 258 and the pressure sensor chip 41 are electrically connected by wire bonding 59. The back surface of the resin case 244 is bonded to one surface of the metal plate member 243.

  The metal plate member 243 protrudes outward from both end surfaces of the resin case 244 where the signal terminal 258 does not protrude. Portions of the metal plate member 243 that protrude outward from both end faces of the resin case 244 are other members integrated with the metal plate member 243 (for example, a connector member 161 according to Embodiment 10 described later). Becomes the support portion 245 with which the contact is made. The signal terminal 258 protrudes outward from both end faces of the metal plate member 243 from which the signal terminal 258 protrudes from the resin case 244.

  Further, the metal plate member 243 is not particularly limited, and is made of, for example, 42 alloy, and the surface thereof is plated with nickel for increasing the bonding strength with the base member 42. Alternatively, a combination of nickel plating and gold plating may be used. A through hole 248 through which a pressure medium such as air or oil passes is provided at the center of the metal plate member 243. The pedestal member 42 is aligned with one surface of the metal plate member 243 so that the through hole 46 of the pedestal member 42 and the through hole 248 of the metal plate member 243 are continuous, and the gold / tin eutectic solder And a metal material 49 such as high-temperature solder.

  In the pressure sensor cell 102 configured as described above, when a pressure medium is introduced through the through hole 248 of the metal plate member 243 and pressure is received by the diaphragm 45 of the pressure sensor chip 41, the diaphragm 45 is deformed. And the gauge resistance value on the diaphragm 45 changes, and the voltage signal according to it changes. The voltage signal is amplified by an amplifier circuit adjusted by an adjustment circuit such as a sensitivity correction circuit, an offset correction circuit, or a temperature characteristic correction circuit, and is output from the pressure sensor chip 41. Then, the output signal is output to the signal terminal 258 via the wire bonding 59.

  At that time, the pressure medium contacts only the inner wall of the metal plate member 243, the inner wall of the base member 42, and the diaphragm 45 of the pressure sensor chip 41. Therefore, even if the pressure medium is an air conditioner medium, oil, lubricating oil, or the like, the pressure sensor cell 102 is not deteriorated, and high reliability can be obtained over a long period of time. In addition, even when measuring high pressure, the pressure receiving area (pressure receiving area) is only the diaphragm 45, so that the structure and material of the pressure sensor device using the pressure sensor cell 102 can be made as small as possible and light in weight. Therefore, a low-cost pressure sensor device can be realized.

  Specifically, when the resin case 244 is made of an epoxy resin, polyphenylene sulfide (PPS) resin, polybutene terephthalate (PBT) resin, nylon resin, or the like, as in the fifth embodiment, the resin case 244 Even if a compressive stress of about 1.05 MPa occurs, safety is sufficiently ensured. Therefore, extremely high reliability can be obtained over a long period of time.

  Further, as in the first embodiment, since the number of signal transmission path connection points until output to the outside can be minimized, the failure probability is lowered at each stage. Further, when silicon is used as the material of the pedestal member 42 and the pressure sensor chip 41 and the pedestal member 42 are bonded using low-melting glass, the thermal stress that the pressure sensor chip 41 receives from the metal plate member 243 is the pedestal member. Therefore, the thermal stress from the metal plate member 243 can be reduced. Further, by using the metal plate member 243 instead of the metal pipe member 43, the member cost can be reduced as compared with the first embodiment.

Embodiment 10 FIG.
12 and 13 are cross-sectional views illustrating the configuration of the pressure sensor device according to the tenth embodiment of the present invention, and illustrate configurations at the cutting planes corresponding to the cutting lines AA and BB in FIG. 9, respectively. It is sectional drawing. As shown in these drawings, the pressure sensor device 202 according to the tenth embodiment sandwiches the pressure sensor cell 102 according to the ninth embodiment between the connector member 161 and the joint member 62 in the same manner as in the second embodiment. By caulking 62, the pressure sensor cell 102, the connector member 161, and the joint member 62 are integrated. The configuration of the joint member 62 is the same as that of the second embodiment.

  The connector member 161 has a structure in which a housing portion 163 that accommodates the pressure sensor cell 102 and a socket portion 164 for taking out the output of the pressure sensor device 202 are integrally formed. The socket part 164 is thinner than the housing part 163, and a step part 165 is formed between the housing part 163 and the socket part 164. An external signal terminal 166 is embedded in a partition portion between the housing portion 163 and the socket portion 164. One end of the signal terminal 166 is exposed in the housing portion 163, and the other end is exposed in the socket portion 164.

  The height of the housing portion 163 is different between the side where the signal terminal 258 is provided and the side where the signal terminal 258 is not provided. As shown in FIG. 12, on the side of the metal plate member 243 where the signal terminal 258 is located, that is, the side along the long side of the metal plate member 243, the lower end of the housing portion 163 is outside the metal plate member 243, and the joint member 62 is in contact with the bottom surface. On the other hand, as shown in FIG. 13, on the side of the metal plate member 243 where the signal terminal 258 is not provided, that is, the side along the short side of the metal plate member 243, the lower end of the housing portion 163 is the support portion 245 of the metal plate member 243. Abut. As described above, the connector member 161 is supported by the joint member 62 and the metal plate member 243, thereby preventing an excessive load from being applied to the resin case 244 when measuring a high pressure.

  The connector member 161 and the pressure sensor cell 102 are connected to the pressure introduction port 252 of the pressure sensor cell 102 on the end surface (arrangement portion) exposed in the housing portion 163 of the partition portion between the housing portion 163 and the socket portion 164 of the connector member 161. Are integrated by adhering the end face opposite to the open end 251 with a silicon adhesive or an epoxy adhesive. As described above, the pressure sensor cell 102 is bonded to the connector member 161, so that the reliability with respect to a mechanical shock such as vibration or shock is further improved. Further, the base end portion of the signal terminal 166 exposed in the housing portion 163 is electrically connected to the signal terminal 258 of the pressure sensor cell 102 by laser welding.

  A through hole 167 is provided in a partition portion between the housing portion 163 and the socket portion 164. The through hole 167 is provided so that the space of the recess 253 in which the pressure sensor chip 41 is accommodated in the resin case 244 of the pressure sensor cell 102 is not sealed. The recess 253 is filled with a gel 68 for protecting the pressure sensor chip 41, for example.

  The joint member 62 has a fixing portion that fixes the housing portion 163 of the connector member 161. In the joint member 62 and the connector member 161, the housing portion 163 of the connector member 161 to which the pressure sensor cell 102 is bonded is covered with the storage portion 69 of the joint member 62, and the front end edge of the storage portion 69 is stepped by a machine or the like. It can be fixed by caulking along. Fixing may be performed by a method other than caulking, such as adhesion.

  In the pressure sensor device 202, the pressure medium sealed in the space in the housing 300 is transmitted through the through hole 71 of the screw portion 70 of the joint member 62, the metal plate member 243 of the pressure sensor cell 102, and the through holes 248 and 46 of the base member 42. Then, it is guided to the diaphragm 45 of the pressure sensor chip 41. An O-ring 173 serving as a sealing means is housed in a recess 72 formed at the bottom of the storage portion 69 of the joint member 62. The O-ring 173 seals at least the bottom surface of the recess 72 and the open end 251 of the metal plate member 243 in the recess 72 of the storage unit 69. The O-ring 173 prevents the pressure medium guided to the metal plate member 243 through the through hole 71 of the screw portion 70 from flowing into a portion other than the through hole 248 of the metal plate member 243.

  An O-ring 174 is also provided between the outer side surface of the housing portion 163 of the connector member 161 and the inner side surface of the storage portion 69 of the joint member 62. The O-ring 174 causes the pressure medium to leak when the pressure medium leaks from the metal plate member 143, when the pressure sensor chip 41 is damaged, or when the bonding interface between the pressure sensor chip 41 and the base member 42 is peeled off. Prevents leakage to the outside.

  Thus, according to Embodiment 10, since it is a simple structure, member cost and assembly cost can be suppressed low. Further, since the stress from the screw portion 70 when the pressure sensor device 202 is screwed into the housing 300 is transmitted to the pressure sensor chip 41 via the O-ring 173, the stress is relieved by the O-ring 173. Therefore, the accuracy and reliability of the measurement signal is increased. Further, an external signal terminal 166 is disposed on the opposite side to the opening for introducing the pressure medium.

  Furthermore, in the tenth embodiment, the load acting on the pressure sensor cell 102 by the pressure medium is determined by the area S3 of the shape formed by the tangent line between the open end 251 of the metal plate member 243 and the O-ring 173. On the other hand, in the second embodiment, it is determined by S2 described above. Since S3 is smaller than S2, the load acting on the pressure sensor cell 102 is smaller in the tenth embodiment than in the second embodiment. Therefore, the tenth embodiment is suitable for measuring a higher pressure than the second embodiment. Furthermore, as described above, the tenth embodiment has a configuration in which an excessive load is not applied to the resin case 244, and thus is suitable for measuring a pressure higher than that of the sixth embodiment.

Embodiment 11 FIG.
FIG. 14: is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 11 of this invention. As shown in FIG. 14, the pressure sensor device according to the eleventh embodiment includes the pressure sensor cell 102 according to the ninth embodiment, and the pressure sensor cell 102 within the recess 302 formed in the housing 300 as in the third embodiment. The fixing jig 312 is screwed to the housing 300 with a screw member 311 from above. A hanging piece 313 protrudes from the lower surface of the fixing jig 312. The hanging piece 313 contacts the support portion 245 of the metal plate member 243. The pressure sensor cell 102 is fixed by the pressure applied from the pressure inlet 252 and the reaction force from the fixing jig 312 against the pressure.

  An O-ring 175 that seals between the metal plate member 243 and the housing 300 is housed in a second-stage recess 303 formed at the bottom of the recess 302. The O-ring 175 seals between the at least bottom surface of the recess 303 and the open end 251 of the metal plate member 243 in the second-stage recess 303. The O-ring 175 prevents the pressure medium guided to the metal plate member 243 through the through hole 304 of the housing 300 from flowing into a portion other than the through hole 248 of the metal plate member 243.

  Further, the signal terminal 258 of the pressure sensor cell 102 is bent and connected to the printed circuit board 400 installed near the housing 300 by direct soldering or the like. In the eleventh embodiment, the metal plate member 243 may be disk-shaped, and the support portion 245 may be provided over the entire outer periphery thereof.

Embodiment 12 FIG.
FIG. 15: is sectional drawing which shows the structure of the pressure sensor apparatus concerning Embodiment 12 of this invention. As shown in FIG. 15, the pressure sensor device according to the twelfth embodiment is arranged in the recess 302 of the housing 300 instead of fixing the pressure sensor cell 102 using the fixing jig 312 and the screw member 311 in the eleventh embodiment. The support part 245 of the inserted metal plate member 243 is fixed by caulking the caulking part 322 rising from the housing 300 using a machine or the like. Therefore, in the twelfth embodiment, the fixing jig 312 and the screw member 311 are unnecessary, and the number of parts can be reduced as compared with the eleventh embodiment. Also in the twelfth embodiment, the O-ring 175 seals between the at least bottom surface of the recess 303 and the open end 251 of the metal plate member 243 in the second-stage recess 303 of the housing 300. . Other configurations are the same as those of the eleventh embodiment.

  As described above, the present invention is not limited to the above-described embodiments, and various modifications can be made. For example, in the second embodiment or the sixth embodiment, in place of the O-ring 74 that seals between the lower end of the housing portion 63 of the connector member 61 and the inner bottom surface of the storage portion 69 of the joint member 62, or this O-ring 74. In addition to the ring 74, as in the tenth embodiment, an O-ring that seals between the outer side surface of the housing portion 63 of the connector member 61 and the inner side surface of the storage portion 69 of the joint member 62 may be provided.

  Further, in each embodiment, the metal pipe member 43 or the metal plate members 143 and 243 and the pedestal member 42 are bonded together by an adhesive such as epoxy without providing the metal thin film 47 on the back surface of the pedestal member 42. It is good also as a structure to make. If it does in this way, member cost can be lowered. Whether the metal pipe member 43 or the metal plate members 143 and 243 and the base member 42 are fixed by soldering or by an adhesive is appropriately selected depending on the pressure medium to be measured.

  As described above, the pressure sensor device according to the present invention is useful for a pressure sensor device that measures a high pressure of 1 MPa or more, and is particularly used for various devices such as automobiles, medical devices, industrial devices, and consumer devices. Suitable for pressure sensor device.

41 Pressure sensor chip 42 Base member 43 Pressure introducing means (metal pipe member)
44, 144, 244 Resin case 45 Pressure receiving part (diaphragm)
46, 48, 71 Through-hole 47 Metal thin film 49 Metal material 50, 65, 165 Stepped portion 51, 151, 251 Open end 58, 66, 158, 166, 258 Signal terminal 59 Wire bonding 61, 161 Connector member 62 Joint member 63 , 163 Housing part 64, 164 Socket part 69 Storage part 70 Screw part 73, 173 Sealing means (O-ring)
100, 101, 102 Pressure sensor cell 143, 243 Pressure introducing means (metal plate member)
200, 201, 202 Pressure sensor device 245 support part

Claims (37)

A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface, and having a metal thin film on the first surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
The pressure sensor chip and the signal terminal are electrically connected by wire bonding ,
The planar shape of the resin case is a rectangular shape, and has the support portion on two opposite sides of the rectangular shape,
The said signal terminal consists of a pressure sensor cell provided so that it may protrude from the edge | side which adjoins two said rectangular-shaped opposing sides which have the said support part . A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
The pressure sensor chip and the signal terminal are electrically connected by wire bonding ,
The planar shape of the resin case is a rectangular shape, and has the support portion on two opposite sides of the rectangular shape,
The said signal terminal consists of a pressure sensor cell provided so that it may protrude from the edge | side which adjoins two said rectangular-shaped opposing sides which have the said support part . The resin case includes a through-hole penetrating the first surface and the second surface, the first surface is bonded to the second surface of the pressure introducing means, and the pressure sensor chip is attached to the resin case. The pressure sensor device according to claim 1, wherein the pressure sensor device is accommodated in the through hole with a distance from the resin case. The pressure sensor device according to claim 1, wherein the resin case is disposed on a second surface of the pressure introducing unit. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface, and having a metal thin film on the first surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding;
A housing part that accommodates the pressure sensor cell and an arrangement part that arranges the pressure sensor cell, one end of which is electrically connected to the signal terminal of the pressure sensor cell and the other end of which projects to the outside are integrally formed. A connector member,
A joint member comprising: a screw part having a through hole; and a storage part that has a fixing part for fixing the connector member and stores a pressure sensor cell disposed on the connector member,
The pressure sensor cell is disposed on the connector member such that the opening of the first surface of the pressure introducing means is opened;
The joint member abuts on the first surface of the support;
The first surface side end of the housing part abuts on the second surface of the support part,
The signal terminal of the pressure sensor cell and the signal terminal formed integrally with the connector member are electrically connected,
The through hole of the threaded portion is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the joint member is sealed by a sealing means. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding;
A housing part that accommodates the pressure sensor cell and an arrangement part that arranges the pressure sensor cell, one end of which is electrically connected to the signal terminal of the pressure sensor cell and the other end of which projects to the outside are integrally formed. A connector member,
A joint member comprising: a screw part having a through hole; and a storage part that has a fixing part for fixing the connector member and stores a pressure sensor cell disposed on the connector member,
The pressure sensor cell is disposed on the connector member such that the opening of the first surface of the pressure introducing means is opened;
The joint member abuts on the first surface of the support;
The first surface side end of the housing part abuts on the second surface of the support part,
The signal terminal of the pressure sensor cell and the signal terminal formed integrally with the connector member are electrically connected,
The through hole of the threaded portion is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the joint member is sealed by a sealing means. The pressure sensor device according to claim 5 or 6 , wherein the connector member and the resin case are bonded by an adhesive . The planar shape of the resin case is a rectangular shape, and has the support portion on two opposite sides of the rectangular shape,
8. The pressure according to claim 5, wherein the signal terminal is provided so as to protrude from two sides adjacent to the two opposing sides of the rectangular shape having the support portion. 9. Sensor device. The resin case includes a through-hole penetrating the first surface and the second surface, the first surface is bonded to the second surface of the pressure introducing means, and the pressure sensor chip is attached to the resin case. The pressure sensor device according to any one of claims 5 to 8, wherein the pressure sensor device is accommodated in the through hole with a distance from the resin case . The pressure sensor device according to claim 5, wherein the resin case is disposed on a second surface of the pressure introducing unit . The sealing means comprises an O-ring;
The joint member includes a recess provided at a bottom portion of the storage portion and having a through hole of the screw portion at a bottom portion,
The pressure sensor device according to any one of claims 5 to 10, wherein the O-ring is disposed in a recess at a bottom portion of the storage portion . A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface, and having a metal thin film on the first surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding;
A housing having a through hole and accommodating the pressure sensor cell;
A fixing jig having a screw member for fixing the housing;
The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened;
The housing contacts the first surface of the support;
The end surface on the first surface side of the fixing jig abuts on the second surface of the support portion,
The signal terminal of the pressure sensor cell protrudes from the housing to the outside,
The through hole of the housing is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the housing is sealed by a sealing means. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding;
A housing having a through hole and accommodating the pressure sensor cell;
A fixing jig having a screw member for fixing the housing;
The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened;
The housing contacts the first surface of the support;
The end surface on the first surface side of the fixing jig abuts on the second surface of the support portion,
The signal terminal of the pressure sensor cell protrudes from the housing to the outside,
The through hole of the housing is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the housing is sealed by a sealing means. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface, and having a metal thin film on the first surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding;
A housing having a through hole and accommodating the pressure sensor cell;
The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened;
The housing contacts the first surface of the support;
The caulking portion that stands up from the housing abuts on the second surface of the support portion,
The signal terminal of the pressure sensor cell protrudes from the housing to the outside,
The through hole of the housing is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the housing is sealed by a sealing means. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding;
A housing having a through hole and accommodating the pressure sensor cell;
The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened;
The housing contacts the first surface of the support;
The caulking portion that stands up from the housing abuts on the second surface of the support portion,
The signal terminal of the pressure sensor cell protrudes from the housing to the outside,
The through hole of the housing is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the housing is sealed by a sealing means. The planar shape of the resin case is a rectangular shape, and has the support portion on two opposite sides of the rectangular shape,
The pressure according to any one of claims 12 to 15, wherein the signal terminal is provided so as to protrude from a side adjacent to the two opposing sides of the rectangular shape having the support portion. Sensor device. The resin case includes a through-hole penetrating the first surface and the second surface, the first surface is bonded to the second surface of the pressure introducing means, and the pressure sensor chip is attached to the resin case. The pressure sensor device according to claim 12, wherein the pressure sensor device is accommodated in the through hole with a distance from the resin case . The pressure sensor device according to claim 12, wherein the resin case is disposed on a second surface of the pressure introducing unit . The pressure sensor device according to claim 12, wherein the sealing unit includes an O-ring .
The pressure sensor device according to claim 1, wherein the base member is made of glass, and the pressure sensor chip is bonded to the base member by electrostatic bonding .   The pedestal member and the pressure sensor chip are made of silicon, and the pressure sensor chip is bonded to the pedestal member with a low-melting glass. Pressure sensor device.   The pressure sensor device according to any one of claims 1 to 21, wherein the pressure introducing means is made of 42 alloy, and the surface thereof is nickel-plated or nickel-plated and gold-plated. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface, and having a metal thin film on the first surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material,
The entire first surface of the pressure introducing means is exposed;
The resin case is bonded to the second surface of the pressure introducing means;
The signal terminal protrudes outside the end surface of the resin case,
The pressure sensor chip and the signal terminal are electrically connected by wire bonding ,
The resin case includes a first recess in which the pressure introducing means is housed in a first surface, and a second surface having a smaller opening area than the first recess and connected to the first recess. A pressure sensor device comprising a pressure sensor cell including a recess, the second recess having a distance from the resin case and accommodating the pressure sensor chip . A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive,
The entire first surface of the pressure introducing means is exposed;
The resin case is bonded to the second surface of the pressure introducing means;
The signal terminal protrudes outside the end surface of the resin case,
The pressure sensor chip and the signal terminal are electrically connected by wire bonding ,
The resin case includes a first recess in which the pressure introducing means is housed in a first surface, and a second surface having a smaller opening area than the first recess and connected to the first recess. A pressure sensor device comprising a pressure sensor cell including a recess, the second recess having a distance from the resin case and accommodating the pressure sensor chip .   The pressure sensor device according to claim 23 or 24, wherein the second surface and the side surface of the pressure introducing means are bonded to the resin case. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface, and having a metal thin film on the first surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material,
The entire first surface of the pressure introducing means is exposed;
The resin case is bonded to the second surface of the pressure introducing means;
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding ;
A connector member having an arrangement part for arranging the pressure sensor cell, one end of which is electrically connected to a signal terminal of the pressure sensor cell, and the other end of which is integrally molded with a signal terminal;
A joint member comprising: a screw part having a through hole; and a storage part that has a fixing part for fixing the connector member and stores a pressure sensor cell disposed on the connector member,
The first surface and the second surface of the resin case are sandwiched between the joint member and the connector member,
The pressure sensor cell is disposed on the connector member such that the opening of the first surface of the pressure introducing means is opened;
The signal terminal of the pressure sensor cell and the signal terminal formed integrally with the connector member are electrically connected,
The through hole of the threaded portion is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the joint member is sealed by a sealing means. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding ;
A connector member having an arrangement part for arranging the pressure sensor cell, one end of which is electrically connected to a signal terminal of the pressure sensor cell, and the other end of which is integrally molded with a signal terminal;
A joint member comprising: a screw part having a through hole; and a storage part that has a fixing part for fixing the connector member and stores a pressure sensor cell disposed on the connector member,
The first surface and the second surface of the resin case are sandwiched between the joint member and the connector member,
The pressure sensor cell is disposed on the connector member such that the opening of the first surface of the pressure introducing means is opened;
The signal terminal of the pressure sensor cell and the signal terminal formed integrally with the connector member are electrically connected,
The through hole of the threaded portion is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the joint member is sealed by a sealing means. The sealing means comprises an O-ring;
The joint member includes a recess provided at a bottom portion of the storage portion and having a through hole of the screw portion at a bottom portion,
28. The pressure sensor device according to claim 26 or 27, wherein the O-ring is disposed in a recess at a bottom of the storage unit. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface, and having a metal thin film on the first surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material,
The entire first surface of the pressure introducing means is exposed;
The resin case is bonded to the second surface of the pressure introducing means;
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding ;
A housing having a through hole and accommodating the pressure sensor cell;
A fixing jig having a screw member for fixing the housing;
The first surface and the second surface of the resin case are sandwiched between the housing and the fixing jig,
The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened;
The signal terminal of the pressure sensor cell protrudes from the housing to the outside,
The through hole of the housing is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the housing is sealed by a sealing means. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding ;
A housing having a through hole and accommodating the pressure sensor cell;
A fixing jig having a screw member for fixing the housing;
The first surface and the second surface of the resin case are sandwiched between the housing and the fixing jig,
The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened;
The signal terminal of the pressure sensor cell protrudes from the housing to the outside,
The through hole of the housing is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the housing is sealed by a sealing means. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface, and having a metal thin film on the first surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is joined to the first surface of the pedestal member via a metal material,
The entire first surface of the pressure introducing means is exposed;
The resin case is bonded to the second surface of the pressure introducing means;
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding ;
A housing having a through hole and accommodating the pressure sensor cell;
The first surface and the second surface of the resin case are sandwiched between the casing and a caulking portion standing up from the casing,
The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened;
The signal terminal of the pressure sensor cell protrudes from the housing to the outside,
The through hole of the housing is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the housing is sealed by a sealing means. A semiconductor pressure sensor chip having means for converting the distortion of the pressure receiving portion into an electrical signal by receiving pressure in the pressure receiving portion;
A pedestal member having a through-hole penetrating the first surface and the second surface;
A pressure introducing means comprising a metal plate member having a through-hole penetrating the first surface and the second surface;
A resin case having a signal terminal for taking out the electric signal from the pressure sensor chip,
With the pressure receiving portion facing the through hole of the pedestal member, the pressure sensor chip is joined to the second surface of the pedestal member,
With the through hole of the pressure introducing means connected to the through hole of the pedestal member, the second surface of the pressure introducing means is bonded to the first surface of the pedestal member with an adhesive,
The resin case is bonded to the pressure introducing means;
The pressure introducing means has a support portion on the outside of the end surface of the resin case, against which another member integrated with the pressure introducing means is in contact,
The signal terminal protrudes outside the end surface of the resin case,
A pressure sensor cell in which the pressure sensor chip and the signal terminal are electrically connected by wire bonding ;
A housing having a through hole and accommodating the pressure sensor cell;
The first surface and the second surface of the resin case are sandwiched between the casing and a caulking portion standing up from the casing,
The pressure sensor cell is housed in the housing such that the opening of the first surface of the pressure introducing means is opened;
The signal terminal of the pressure sensor cell protrudes from the housing to the outside,
The through hole of the housing is connected to the through hole of the pressure introducing means,
A pressure sensor device characterized in that a gap between the first surface of the pressure introducing means and the housing is sealed by a sealing means. The sealing means comprises an O-ring;
  A recess provided at the bottom of the housing and having a through hole in the housing at the bottom;
  The pressure sensor device according to any one of claims 29 to 32, wherein the O-ring is disposed in a recess provided in a bottom portion of the casing.   The pressure sensor device according to any one of claims 23 to 33, wherein the pedestal member is made of glass, and the pressure sensor chip is bonded to the pedestal member by electrostatic bonding.   34. The pedestal member and the pressure sensor chip are made of silicon, and the pressure sensor chip is bonded to the pedestal member with a low melting point glass. Pressure sensor device.   36. The pressure sensor device according to any one of claims 23 to 35, wherein the pressure introducing means is made of 42 alloy, and the surface thereof is nickel-plated or nickel-plated and gold-plated. 15. The pressure sensor device according to claim 1, wherein the metal thin film is composed of three layers of chromium, platinum, and gold.