JP2782572B2 - Pressure sensor and method of manufacturing the same - Google Patents
Pressure sensor and method of manufacturing the sameInfo
- Publication number
- JP2782572B2 JP2782572B2 JP5082812A JP8281293A JP2782572B2 JP 2782572 B2 JP2782572 B2 JP 2782572B2 JP 5082812 A JP5082812 A JP 5082812A JP 8281293 A JP8281293 A JP 8281293A JP 2782572 B2 JP2782572 B2 JP 2782572B2
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- JP
- Japan
- Prior art keywords
- pressure
- sensor element
- sensor
- introducing cylinder
- pressure introducing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、流体の圧力を検出す
る圧力センサであって、特に半導体素子により流体圧力
を受けて電気的に圧力を検出する圧力センサとその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor for detecting a pressure of a fluid, and more particularly to a pressure sensor for receiving a fluid pressure by a semiconductor element and electrically detecting the pressure, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来、流体の圧力を精度良く測ることの
できる小型圧力センサとして、半導体式圧力センサが提
供されている。この半導体式圧力センサは、図５の縦断
面図に示すように、金属製の本体１に、ガラス台座２を
介してセンサ素子３が固定されている。本体１は、カバ
ー４で覆われ、カバー４内は大気圧に開放されている。
本体１のセンサ素子３の取付部には、透孔５が形成さ
れ、圧力導入筒６がこの透孔５に取り付けられている、
センサ素子３とガラス台座２は、陽極接合により気密状
態に接合され、ガラス台座２と本体１とは、ハンダ付け
により密閉状態にされている。従って、圧力導入筒６か
ら導入された圧力はセンサ素子３にかかり、大気圧には
抜けないように形成されている。さらにセンサ素子３の
電極部と本体１に取りつけられた端子７とが金線８によ
りワイヤボンディングされている。2. Description of the Related Art Conventionally, a semiconductor type pressure sensor has been provided as a small pressure sensor capable of accurately measuring the pressure of a fluid. In this semiconductor type pressure sensor, as shown in a longitudinal sectional view of FIG. 5, a sensor element 3 is fixed to a metal main body 1 via a glass pedestal 2. The main body 1 is covered with a cover 4, and the inside of the cover 4 is open to atmospheric pressure.
A through hole 5 is formed in a mounting portion of the sensor element 3 of the main body 1, and a pressure introducing cylinder 6 is mounted in the through hole 5.
The sensor element 3 and the glass pedestal 2 are joined in an airtight state by anodic bonding, and the glass pedestal 2 and the main body 1 are sealed by soldering. Therefore, the pressure introduced from the pressure introducing cylinder 6 is applied to the sensor element 3 so that the pressure is not released to the atmospheric pressure. Further, the electrode portion of the sensor element 3 and the terminal 7 attached to the main body 1 are wire-bonded by a gold wire 8.
【０００３】この半導体式圧力センサの測定方法は、ま
ず、圧力導入筒６から被測定圧がかかると、大気圧と被
測定圧との差により、センサ素子３に物理的な歪が生じ
る。この歪は、被測定圧と大気圧との差に比例する。そ
して、センサ素子３の圧力検出面に歪が生じると、セン
サ素子３に形成された抵抗の値が、歪の大きさに比例し
て変化する。この抵抗値の変化を検出し、増幅して出力
することにより被測定圧と大気圧の差圧を測定すること
ができる。In this method of measuring a semiconductor pressure sensor, first, when a measured pressure is applied from the pressure introducing cylinder 6, a physical distortion occurs in the sensor element 3 due to a difference between the atmospheric pressure and the measured pressure. This distortion is proportional to the difference between the measured pressure and the atmospheric pressure. Then, when distortion occurs on the pressure detection surface of the sensor element 3, the value of the resistance formed on the sensor element 3 changes in proportion to the magnitude of the distortion. By detecting the change in the resistance value, amplifying and outputting the amplified value, the pressure difference between the measured pressure and the atmospheric pressure can be measured.
【０００４】また、本願出願人による特開平４−１５５
９７０号公報に開示するように、半導体圧力センサにお
いて、樹脂ケースにリードフレーム端子をインサート成
形し、このケース内の端子の基端部に、センサ素子を固
定した圧力センサも提案されている。この場合、センサ
素子は、端子の基端部に連接した接続片に、気密状態で
固定されているものであるFurther, Japanese Patent Application Laid-Open No. 4-155 by the present applicant
As disclosed in Japanese Patent Publication No. 970, a pressure sensor in which a lead frame terminal is insert-molded in a resin case in a semiconductor pressure sensor and a sensor element is fixed to a base end of the terminal in the case has been proposed. In this case, the sensor element is air-tightly fixed to the connection piece connected to the base end of the terminal.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記従来
の前者の場合、センサ素子３をガラス台座２に密着さ
せ、このガラス台座２と本体部１とをハンダ付けするも
のであり、組み立て工数がかかり、部品のコストも高い
ものである。さらに、センサ素子と他の部材との接合箇
所が多く、導入した圧力が大気側に漏れやすく、正確に
測定できなかったり、有毒なガスが外部に漏れたりする
恐れがあった。また、上記従来の技術の後者の場合も、
インサート成形したリードフレームの接続片と樹脂との
間の気密性がなく、この接続片と樹脂との間から被測定
圧が漏れ、上記と同様の問題が生じるものであった。However, in the former case, the sensor element 3 is brought into close contact with the glass pedestal 2, and the glass pedestal 2 and the main body 1 are soldered. The cost of parts is also high. Furthermore, there are many joints between the sensor element and other members, and the introduced pressure is likely to leak to the atmosphere side, so that accurate measurement cannot be performed or toxic gas may leak to the outside. Also, in the latter case of the above conventional technology,
There is no airtightness between the connection piece and the resin of the insert-molded lead frame, and the measured pressure leaks from between the connection piece and the resin, causing the same problem as described above.
【０００６】この発明は上記従来の技術の問題点に鑑み
て成されたもので、センサの気密性が高く、被測定圧力
媒体が外部に漏れることがなく、かつ高精度で簡単な構
成の圧力センサとその製造方法を提供することを目的と
する。The present invention has been made in view of the above-mentioned problems of the prior art, and has a high airtightness of a sensor, a pressure medium to be measured which does not leak to the outside, and a high-precision and simple pressure sensor. An object of the present invention is to provide a sensor and a manufacturing method thereof.
【０００７】[0007]
【課題を解決するための手段】この発明は、半導体の圧
力センサ素子と、上記センサ素子の熱膨張率と近い熱膨
張率の金属製の管であってその基端部にフランジ部を有
し被測定圧を導入する圧力導入筒を有し、このセンサ素
子を収容する樹脂製のセンサケースと一体に、上記セン
サ素子に接続され表面実装型のリードフレーム端子と上
記圧力導入筒の上記フランジ部とを一体にインサート成
形し、上記センサケース内に露出した上記フランジ部の
基端面に上記センサ素子を当接させ上記センサ素子の周
囲に接着剤が付着して上記センサ素子と上記圧力導入筒
とを気密状態に接合した圧力センサである。SUMMARY OF THE INVENTION The present invention provides a semiconductor pressure sensor element and a metal tube having a coefficient of thermal expansion close to the coefficient of thermal expansion of the sensor element and having a flange at a base end thereof.
And it has a pressure introduction tube for introducing the object to be measured pressure, together with a resin sensor case for accommodating the sensor element, the sensor
The surface mount type lead frame terminal connected to the sensor element and the flange portion of the pressure introducing cylinder are integrally insert-molded to form the flange portion exposed in the sensor case.
A pressure sensor in which the sensor element is brought into contact with a base end surface, an adhesive is adhered around the sensor element, and the sensor element and the pressure introducing cylinder are joined in an airtight state.
【０００８】またこの発明は、被測定圧を導入し基端部
にフランジ部を有する金属製の圧力導入筒と、リードフ
レーム端子とを設け、センサ素子を収容する樹脂製のセ
ンサケースと一体的に上記リードフレーム端子と上記圧
力導入筒の上記フランジ部とをインサート成形し、上記
圧力導入筒の上記ケース内に露出した基端面に接着剤を
塗布し、上記センサ素子を上記圧力導入筒基端面に当接
させ、上記センサ素子の周囲に接着剤を付着させて上記
センサ素子と上記圧力導入筒とを気密状態に接合するこ
とを特徴とする圧力センサの製造方法である。[0008] The present invention, the proximal end portion to introduce the measuring pressure
A metal pressure introducing cylinder having a flange portion and a lead frame terminal are provided, and the lead frame terminal and the flange portion of the pressure introducing cylinder are inserted integrally with a resin sensor case for housing the sensor element. Molding, applying an adhesive to the base end surface exposed in the case of the pressure introducing cylinder, bringing the sensor element into contact with the base end surface of the pressure introducing cylinder, and applying an adhesive around the sensor element. A method for manufacturing a pressure sensor, wherein the sensor element and the pressure introducing cylinder are joined in an airtight state.
【０００９】[0009]
【作用】この発明の圧力センサは、圧力導入筒の基端面
に直接センサ素子が密着接合されているので、被測定圧
力媒体が圧力導入筒を経て、半導体の圧力センサ素子の
裏面側に直接侵入し、圧力センサの圧力導入筒とセンサ
素子以外の構成要素には被測定圧がかからないようにし
たものである。According to the pressure sensor of the present invention, a base end face of a pressure introducing cylinder is provided.
Since the sensor element is directly bonded to the pressure sensor, the pressure medium to be measured directly penetrates the back side of the semiconductor pressure sensor element via the pressure introducing cylinder, and enters the components other than the pressure introducing cylinder and the sensor element of the pressure sensor. Is such that the measured pressure is not applied.
【００１０】[0010]
【実施例】以下この発明の一実施例について図面に基づ
いて説明する。この実施例の圧力センサは、Ｓｉ半導体
のセンサ素子２０がセンサケース２１内に設けられ、セ
ンサ素子２０とリードフレーム端子２２の基端部２２ａ
とが、金線２３によりワイヤボンディングされている。
センサケース２１は、ＰＰＳ樹脂等の耐熱性のある樹脂
であり、リードフレーム端子２２と、圧力導入筒２５と
がインサート成形により一体に設けられている。An embodiment of the present invention will be described below with reference to the drawings. In the pressure sensor of this embodiment, a sensor element 20 made of a Si semiconductor is provided in a sensor case 21, and the sensor element 20 and a base end 22 a of a lead frame terminal 22 are provided.
Are bonded by a gold wire 23.
The sensor case 21 is a heat-resistant resin such as PPS resin, and the lead frame terminal 22 and the pressure introducing cylinder 25 are integrally provided by insert molding.
【００１１】この圧力導入筒２５は、シリコンの熱膨張
率（３．２×１０）に近い熱膨張率の鉄−ニッケル系合
金であり、さらにクロムやアルミ又は銅を含有するもの
でも良い。この圧力導入筒２５は、鍛造により形成され
た円筒状の管であり、基端部にはセンサ取付用のフラン
ジ部２６が形成され、センサ素子２０が、フランジ部２
６の基端面にシリコン系や金属接着用の接着剤２７によ
り気密状態に接着されている。そして、この圧力導入筒
２５は、センサケース２１の中央部から図面下方に突出
して形成されている。The pressure introducing cylinder 25 is an iron-nickel alloy having a coefficient of thermal expansion close to that of silicon (3.2 × 10), and may further contain chromium, aluminum or copper. The pressure introduction tube 25 is a cylindrical tube formed by forging, the flange portion 26 of the sensor mounting is formed at the proximal end, the sensor element 20, the flange portion 2
6 is bonded to the base end surface of the base member 6 in an airtight state by a bonding agent 27 for bonding silicon or metal. The pressure introducing cylinder 25 is formed to protrude downward from the center of the sensor case 21 in the drawing .
【００１２】この実施例の圧力センサの製造方法は、先
ず、図４に示すリードフレーム３０を形成し、このリー
ドフレーム３０の各リードフレーム端子２２の基端部２
２ａと圧力導入筒２５のフランジ部２６が対面するよう
に設置して、これらを囲むように、センサケース２１を
インサート成型する。この時、フランジ部２６の端面は
矩形状に樹脂が被らない露出部分を形成するとともに、
リードフレーム端子２２の基端部２２ａの表面も樹脂が
被らないように露出させる。その後、センサケース２１
の内部に位置した圧力導入筒２５のフランジ部２６の端
面に、センサ素子２０を密着させ、接着剤２７で接着
し、センサ素子２０の周囲を密閉し、センサ素子２０の
表裏の間で気体が漏れないようにする。そして、リード
フレーム端子２２の基端部２２ａとセンサ素子２０の電
極との間を、金線２３でワイヤボンディングする。さら
にセンサ素子２０の表面側に樹脂被覆等を施し、リード
フレーム端子２２を折り曲げて所定の形状に成形し、こ
の実施例の圧力センサの組立が終了する。In the method of manufacturing the pressure sensor of this embodiment, first, a lead frame 30 shown in FIG. 4 is formed, and the base end 2 of each lead frame terminal 22 of the lead frame 30 is formed.
The sensor case 21 is insert-molded so as to surround the flange 2a and the flange portion 26 of the pressure introducing cylinder 25 so as to face each other. At this time, the end face of the flange portion 26 forms an exposed portion in which the resin does not cover in a rectangular shape,
The surface of the base end 22a of the lead frame terminal 22 is also exposed so as not to be covered with the resin. Then, the sensor case 21
Of the flange portion 26 of the pressure introducing cylinder 25 located inside the
The sensor element 20 is adhered to the surface and adhered with an adhesive 27 to seal the periphery of the sensor element 20 so that gas does not leak between the front and back of the sensor element 20. Then, wire bonding is performed between the base end portion 22a of the lead frame terminal 22 and the electrode of the sensor element 20 with the gold wire 23. Further, a resin coating or the like is applied to the surface side of the sensor element 20, and the lead frame terminal 22 is bent and formed into a predetermined shape, and the assembly of the pressure sensor of this embodiment is completed.
【００１３】ここで、この圧力センサは、リードフレー
ム３０に多数同時に形成された後、個々の基板に取り付
けられるものである。従って、リードフレーム３０に
は、リードフレーム端子２２が、リードフレーム３０の
両側部の保持部３２から切り離されても、リードフレム
３０の保持部３２からセンサケース２１及び圧力導入筒
２５が脱落しないように、ケースとともにインサート成
形される保持片３４が四方に形成されている。この保持
片３４は、保持部３２に連結し、リードフレーム端子２
２が切断されて、所定形状に形成された後、基板にこの
圧力センサを組み込む際に切断される。Here, a large number of such pressure sensors are formed on the lead frame 30 at the same time and then attached to individual substrates. Therefore, even if the lead frame terminals 22 are cut off from the holding portions 32 on both sides of the lead frame 30, the sensor case 21 and the pressure introducing cylinder 25 do not fall off from the holding portions 32 of the lead frame 30. The holding piece 34 that is insert-molded with the case is formed on all sides. The holding piece 34 is connected to the holding portion 32 and is connected to the lead frame terminal 2.
2 is cut and formed into a predetermined shape, and then cut when the pressure sensor is incorporated into a substrate.
【００１４】以上のように構成された圧力センサは、図
３に示すように、リードフレーム端子２２が、基板４０
にハンダ付けされ、基板４０に取り付けられた外部接続
端子４２に電気的に接続される。ここで、図３におい
て、中心線の右側がリードフレーム端子２２の延出方向
の縦断面であり、中心線の左側は上記リードフレーム端
子２２の延出方向と直交する方向の縦断面である。基板
４０が固定されたセンサケース２１は、外装ケース本体
４１に取りつけられ、圧力導入筒２５が、この外装ケー
ス本体４１の取付部４４に嵌め込まれる。取付部４４
は、外装ケース本体４１と一体に成形され、被測定圧力
媒体が導かれる圧力導入部４５に同軸的に連通してい
る。外装ケース本体４１は、ＰＰＳ樹脂等の耐薬品性及
び耐蝕性に優れた樹脂により形成されている。そして、
取付部４４に嵌入された圧力導入筒２５の外側面と、取
付部４４の内壁面との間には、Ｏリング４６が緊密に嵌
め込まれている。Ｏリング４６は、両側が圧力導入筒２
５と取付部４４とによって弾性的に気密状態に圧接され
ているとともに、取付部４４の下面には接触せず、ま
た、取付部４４の上面に固定されたストッパ板４７にも
接触しない状態に固定されている。In the pressure sensor configured as described above, as shown in FIG.
And is electrically connected to an external connection terminal 42 attached to the substrate 40. Here, in FIG. 3, the right side of the center line is a vertical section in the extension direction of the lead frame terminal 22, and the left side of the center line is a vertical section in a direction orthogonal to the extension direction of the lead frame terminal 22. The sensor case 21 to which the substrate 40 is fixed is attached to the outer case main body 41, and the pressure introducing cylinder 25 is fitted into the mounting portion 44 of the outer case main body 41. Mounting part 44
Is formed integrally with the outer case main body 41 and coaxially communicates with a pressure introducing portion 45 to which the pressure medium to be measured is guided. The outer case body 41 is formed of a resin having excellent chemical resistance and corrosion resistance such as PPS resin. And
An O-ring 46 is tightly fitted between the outer surface of the pressure introducing tube 25 fitted into the mounting portion 44 and the inner wall surface of the mounting portion 44. The O-ring 46 has a pressure introducing cylinder 2 on both sides.
5 and the mounting portion 44 are elastically pressed in an airtight state, do not contact the lower surface of the mounting portion 44, and do not contact the stopper plate 47 fixed to the upper surface of the mounting portion 44. Fixed.
【００１５】センサケース２１内は、センサ素子２０の
表面側に、柔軟なポリウレタンゲルやシリコンゲル等の
充填材が充填され、センサ素子２０等が完全に密閉され
ている。また、外装ケース本体４１には、蓋部材４８が
取り付けられている。蓋部材４８は、その内面に形成さ
れた取付部５０に、センサケース２１の開口部が嵌合
し、センサケース２１を確実に保持するとともに、圧力
導入筒２５が取付部４４から抜けないように保持してい
る。また、蓋部材４８には、大気圧側に接続される大気
圧導入口４９が形成され、大気圧がセンサ素子２０の表
側に確実にかかるように形成されている。In the sensor case 21, the surface of the sensor element 20 is filled with a filler such as a flexible polyurethane gel or silicone gel, and the sensor element 20 and the like are completely sealed. Further, a lid member 48 is attached to the outer case main body 41. The opening of the sensor case 21 fits into the mounting portion 50 formed on the inner surface of the lid member 48 to securely hold the sensor case 21 and prevent the pressure introducing cylinder 25 from falling out of the mounting portion 44. keeping. An atmospheric pressure inlet 49 connected to the atmospheric pressure side is formed in the lid member 48 so that the atmospheric pressure is reliably applied to the front side of the sensor element 20.
【００１６】この実施例の圧力センサの使用法方は、圧
力導入部４５を被測定圧力側に接続し、大気圧圧力導入
口４９を大気圧側に開放する。被測定圧力媒体は、例え
ば、ＬＰガス等の可燃性ガス、その他の有毒ガスや高圧
ガス等に使用することができる。In the method of using the pressure sensor of this embodiment, the pressure introducing section 45 is connected to the measured pressure side, and the atmospheric pressure introducing port 49 is opened to the atmospheric pressure side. The pressure medium to be measured can be used, for example, as a combustible gas such as LP gas, other toxic gas, high-pressure gas, or the like.
【００１７】この実施例の圧力センサによれば、圧力測
定するガス等は、圧力導入部４５を通り、圧力導入筒２
５を経てセンサ素子２０の裏面側に直接接触し圧力がセ
ンサ素子２０に直接かかるものである。従って、感度が
きわめて高く、装置も小型化でき、低い圧力の検出に際
してもきわめて正確な測定が可能である。さらに、セン
サ素子２０は、これと熱膨張率の近い圧力導入筒２５に
直接接合されているので、熱歪による応力がセンサ素子
２０にはほとんど伝わらず、しかも気密性がきわめて高
く、信頼性も高いものにすることができる。特に、セン
サ素子２０の周囲に接着剤２７を付着させてセンサ素子
２０と圧力導入筒２５を接合しているので、気密性が高
く、センサ素子２０と圧力導入筒２５との熱膨張率の僅
かな差による位置ずれを吸収し、気密が破れることがな
いようにしている。さらに、圧力導入筒２５のフランジ
部がセンサケース２１にインサート成形されているの
で、圧力導入筒２５とセンサケース２１との間の気密性
及び強度がきわめて高く、万一気密性が破れても、圧力
導入筒２５とセンサケース２１が外れることがなく、ま
た両者の接合面積が広いので、ある程度の気密性は確保
できる。また、この圧力センサは、金属製の圧力導入筒
２５を介して被測定ガスを導入しているので、腐食性ガ
ス等に対する耐久性も高いものである。また、この圧力
センサを組み込んだ外装ケース本体４１のセンサ装置に
おいても、圧力を測定するガスは、圧力導入部４５、Ｏ
リング４６、圧力導入筒２５及びセンサ素子２０にのみ
接触するものであり、他の構成要素や接合部には触れ
ず、上記各部材は、対腐食性、耐久性等に対する信頼性
はきわめて高いものが選択できる。従って、有毒ガスや
可燃性ガスの測定に際しても十分な安全性を確保するこ
とができるものである。According to the pressure sensor of this embodiment, the gas or the like to be subjected to pressure measurement passes through the pressure introducing section 45 and passes through the pressure introducing cylinder 2.
5 and directly contact the back surface side of the sensor element 20 to apply pressure directly to the sensor element 20. Accordingly, the sensitivity is extremely high, the apparatus can be downsized, and extremely accurate measurement can be performed even when detecting a low pressure. Further, since the sensor element 20 is directly joined to the pressure introducing cylinder 25 having a thermal expansion coefficient close to that of the sensor element 20, the stress due to thermal strain is hardly transmitted to the sensor element 20, and the airtightness is extremely high and the reliability is high. Can be expensive. In particular, since the sensor element 20 and the pressure introducing cylinder 25 are joined by attaching an adhesive 27 to the periphery of the sensor element 20, the airtightness is high, and the coefficient of thermal expansion between the sensor element 20 and the pressure introducing cylinder 25 is small. It absorbs misalignment due to differences and prevents airtightness from breaking. Furthermore, the flange of the pressure introducing cylinder 25
Part is insert molded in the sensor case 21
The airtightness between the pressure introducing cylinder 25 and the sensor case 21
And the strength is extremely high.
The introduction cylinder 25 and the sensor case 21 do not come off,
Also, the joint area between them is large, so some airtightness is secured.
it can. In addition, since the pressure sensor introduces the gas to be measured through the metal pressure introduction cylinder 25, the pressure sensor has high durability against corrosive gases and the like. Also, in the sensor device of the outer case main body 41 in which the pressure sensor is incorporated, the gas for measuring the pressure is supplied to the pressure introducing section 45,
It comes into contact only with the ring 46, the pressure introducing cylinder 25, and the sensor element 20, does not touch other components or joints, and the above members have extremely high reliability against corrosion, durability and the like. Can be selected. Therefore, sufficient safety can be ensured even when measuring a toxic gas or a flammable gas.
【００１８】尚、この発明の圧力センサは、上記の実施
例に限定されるものではなく、センサ素子と圧力導入筒
との接合方法は接着剤以外の接合方法でも良いものであ
る。また、センサ素子をインサート成形前に圧力導入筒
に接合しても良いものである。圧力導入筒の材質は適宜
変更可能であり、センサ素子の熱膨張率と近いものであ
れば良い。The pressure sensor according to the present invention is not limited to the above-described embodiment, and the joining method between the sensor element and the pressure introducing cylinder may be a joining method other than the adhesive. Further, the sensor element may be joined to the pressure introducing cylinder before insert molding. The material of the pressure introducing cylinder can be changed as appropriate, and may be any material as long as it is close to the coefficient of thermal expansion of the sensor element.
【００１９】[0019]
【発明の効果】この発明の圧力センサは、上記センサ素
子と圧力導入筒を互いに直接接合したので、気密性に対
する信頼性をきわめて高いものにすることができる。さ
らに、センサ素子の周囲に接着剤を付着させてセンサ素
子と圧力導入筒を接合しているので、気密性が高く、セ
ンサ素子と圧力導入筒との熱膨張率の僅かな差による位
置ずれを吸収し、気密が破れることがないようにしてい
る。また、この圧力センサは、センサ素子の熱膨張率と
近い熱膨張率の圧力導入筒にセンサ素子を取り付けたの
で、センサ素子に熱歪が伝わらず、正確な測定が可能で
ある。また、この圧力センサの製造も、インサート成形
により簡単に行うことができ、センサ素子と圧力導入筒
との接合も容易に可能であり、製造コストも安価なもの
にすることができるものである。さらに、圧力導入筒の
フランジ部がセンサケースにインサート成形されている
ので、圧力導入筒とセンサケースとの間の気密性及び強
度がきわめて高い。 According to the pressure sensor of the present invention, since the above-mentioned sensor element and the pressure introducing cylinder are directly joined to each other, the reliability for airtightness can be made extremely high. Furthermore, since the sensor element and the pressure introducing cylinder are joined by attaching an adhesive around the sensor element, the airtightness is high, and the displacement due to a slight difference in the coefficient of thermal expansion between the sensor element and the pressure introducing cylinder is reduced. It absorbs and does not break airtight. Further, in this pressure sensor, since the sensor element is attached to the pressure introducing cylinder having a coefficient of thermal expansion close to the coefficient of thermal expansion of the sensor element, accurate measurement is possible without transmitting thermal strain to the sensor element. Also, the pressure sensor can be easily manufactured by insert molding, the sensor element and the pressure introducing cylinder can be easily joined, and the manufacturing cost can be reduced. In addition, the pressure
Flange is insert molded in the sensor case
Therefore, the airtightness and strength between the pressure introducing cylinder and the sensor case
Very high degree.
【図１】この発明の一実施例の圧力センサの縦断面図で
ある。FIG. 1 is a longitudinal sectional view of a pressure sensor according to an embodiment of the present invention.
【図２】この実施例の圧力センサの平面図である。FIG. 2 is a plan view of the pressure sensor of this embodiment.
【図３】この実施例の圧力センサを外装ケースに取り付
けた状態の縦断面図でる。FIG. 3 is a longitudinal sectional view showing a state where the pressure sensor of this embodiment is attached to an outer case.
【図４】この実施例の圧力センサに用いられるリードフ
レームの平面図である。FIG. 4 is a plan view of a lead frame used in the pressure sensor of the embodiment.
【図５】従来の技術の圧力センサの縦断面図である。FIG. 5 is a longitudinal sectional view of a conventional pressure sensor.
２０ センサ素子 ２１ センサケース ２２ リードフレーム端子 ２５ 圧力導入筒 Reference Signs List 20 sensor element 21 sensor case 22 lead frame terminal 25 pressure introducing cylinder
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−155970（ＪＰ，Ａ) 特開 平３−37536（ＪＰ，Ａ) 特開 平３−72229（ＪＰ，Ａ) 実開 平３−19939（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) G01L 9/04 101────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-155970 (JP, A) JP-A-3-37536 (JP, A) JP-A-3-72229 (JP, A) 19939 (JP, U) (58) Field surveyed (Int. Cl. 6 , DB name) G01L 9/04 101
Claims (2)
素子の熱膨張率と近い熱膨張率の金属製の管であってそ
の基端部にフランジ部を有し被測定圧を導入する圧力導
入筒を有し、このセンサ素子を収容する樹脂製のセンサ
ケースと一体に、上記センサ素子に接続されたリードフ
レーム端子と上記圧力導入筒の上記フランジ部とを一体
にインサート成形し、上記センサケース内に露出した上
記フランジ部の基端面に上記センサ素子を当接させ上記
センサ素子の周囲に接着剤が付着して上記センサ素子と
上記圧力導入筒とを気密状態に接合したことを特徴とす
る圧力センサ。1. A pressure sensor element comprising a semiconductor pressure sensor element and a metal pipe having a coefficient of thermal expansion close to the coefficient of thermal expansion of the sensor element and having a flange at a base end thereof for introducing a pressure to be measured. has a cylindrical, integral with the resin of the sensor case for accommodating the sensor element, integrating the above flange portion of the lead frame terminal and the pressure introduction tube connected to said sensor element
On the insert molded, exposed in the sensor casing
A pressure sensor, wherein the sensor element is brought into contact with a base end surface of the flange portion, an adhesive is attached around the sensor element, and the sensor element and the pressure introducing cylinder are joined in an airtight state.
有する金属製の圧力導入筒と、リードフレーム端子とを
設け、センサ素子を収容する樹脂製のセンサケースと一
体的に上記リードフレーム端子と上記圧力導入筒の上記
フランジ部とをインサート成形し、上記圧力導入筒の上
記ケース内に露出した基端面に接着剤を塗布し、上記セ
ンサ素子を上記圧力導入筒基端面に当接させ、上記セン
サ素子の周囲に接着剤を付着させて上記センサ素子と上
記圧力導入筒とを気密状態に接合することを特徴とする
圧力センサの製造方法。2. A pressure to be measured is introduced, and a flange portion is provided at a base end portion.
A metal pressure introducing cylinder and a lead frame terminal are provided, and the lead frame terminal and the pressure introducing cylinder are integrally formed with a resin sensor case accommodating a sensor element.
The flange and the insert are insert-molded, an adhesive is applied to the base end surface of the pressure introducing cylinder exposed in the case, and the sensor element is brought into contact with the pressure introducing cylinder base end surface and adhered around the sensor element. A method for manufacturing a pressure sensor, wherein an agent is attached to join the sensor element and the pressure introducing cylinder in an airtight state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5082812A JP2782572B2 (en) | 1993-03-16 | 1993-03-16 | Pressure sensor and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5082812A JP2782572B2 (en) | 1993-03-16 | 1993-03-16 | Pressure sensor and method of manufacturing the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09347074A Division JP3081179B2 (en) | 1997-12-01 | 1997-12-01 | Pressure sensor and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06273248A JPH06273248A (en) | 1994-09-30 |
| JP2782572B2 true JP2782572B2 (en) | 1998-08-06 |
Family
ID=13784829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5082812A Expired - Lifetime JP2782572B2 (en) | 1993-03-16 | 1993-03-16 | Pressure sensor and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2782572B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1376090A4 (en) | 2001-03-29 | 2007-06-06 | Hitachi Ltd | Semiconductor pressure sensor |
| JP4774678B2 (en) * | 2003-08-29 | 2011-09-14 | 富士電機株式会社 | Pressure sensor device |
| JP5278448B2 (en) * | 2003-08-29 | 2013-09-04 | 富士電機株式会社 | Pressure sensor device |
| JP2006010547A (en) * | 2004-06-28 | 2006-01-12 | Denso Corp | Humidity sensor module and humidity sensor mounting structure |
| JP2007078461A (en) | 2005-09-13 | 2007-03-29 | Denso Corp | Pressure sensor |
| JP7029261B2 (en) * | 2017-09-19 | 2022-03-03 | 株式会社Subaru | Object velocity calculation device |
| JP6970569B2 (en) * | 2017-09-25 | 2021-11-24 | アルプスアルパイン株式会社 | Manufacturing method of pressure detector |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0337536A (en) * | 1989-07-03 | 1991-02-18 | Fuji Electric Co Ltd | Manufacture of semiconductor pressure transducer |
| JP2968329B2 (en) * | 1990-10-19 | 1999-10-25 | 北陸電気工業株式会社 | Semiconductor pressure sensor |
-
1993
- 1993-03-16 JP JP5082812A patent/JP2782572B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06273248A (en) | 1994-09-30 |
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