JPH06273248A - Pressure sensor and manufacture thereof - Google Patents
Pressure sensor and manufacture thereofInfo
- Publication number
- JPH06273248A JPH06273248A JP8281293A JP8281293A JPH06273248A JP H06273248 A JPH06273248 A JP H06273248A JP 8281293 A JP8281293 A JP 8281293A JP 8281293 A JP8281293 A JP 8281293A JP H06273248 A JPH06273248 A JP H06273248A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensor
- sensor element
- introducing cylinder
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、流体の圧力を検出す
る圧力センサであって、特に半導体素子により流体圧力
を受けて電気的に圧力を検出する圧力センサとその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor for detecting the pressure of a fluid, and more particularly to a pressure sensor for electrically detecting the pressure by receiving a fluid pressure from a semiconductor element and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、流体の圧力を精度良く測ることの
できる小型圧力センサとして、半導体式圧力センサが提
供されている。この半導体式圧力センサは、図５の縦断
面図に示すように、金属製の本体１に、ガラス台座２を
介してセンサ素子３が固定されている。本体１は、カバ
ー４で覆われ、カバー４内は大気圧に開放されている。
本体１のセンサ素子３の取付部には、透孔５が形成さ
れ、圧力導入筒６がこの透孔５に取り付けられている、
センサ素子３とガラス台座２は、陽極接合により気密状
態に接合され、ガラス台座２と本体１とは、ハンダ付け
により密閉状態にされている。従って、圧力導入筒６か
ら導入された圧力はセンサ素子３にかかり、大気圧には
抜けないように形成されている。さらにセンサ素子３の
電極部と本体１に取りつけられた端子７とが金線８によ
りワイヤボンディングされている。2. Description of the Related Art Conventionally, a semiconductor type pressure sensor has been provided as a compact pressure sensor capable of accurately measuring the pressure of a fluid. As shown in the vertical sectional view of FIG. 5, this semiconductor pressure sensor has a sensor element 3 fixed to a metal body 1 via a glass pedestal 2. The main body 1 is covered with a cover 4, and the inside of the cover 4 is open to the atmospheric pressure.
A through hole 5 is formed in a mounting portion of the sensor element 3 of the main body 1, and a pressure introducing cylinder 6 is mounted in the through hole 5.
The sensor element 3 and the glass pedestal 2 are joined to each other in an airtight state by anodic bonding, and the glass pedestal 2 and the main body 1 are sealed by soldering. Therefore, the pressure introduced from the pressure introducing cylinder 6 is applied to the sensor element 3 and is formed so as not to escape to the atmospheric pressure. Further, the electrode portion of the sensor element 3 and the terminal 7 attached to the main body 1 are wire-bonded with a gold wire 8.
【０００３】この半導体式圧力センサの測定方法は、ま
ず、圧力導入筒６から被測定圧がかかると、大気圧と被
測定圧との差により、センサ素子３に物理的な歪が生じ
る。この歪は、被測定圧と大気圧との差に比例する。そ
して、センサ素子３の圧力検出面に歪が生じると、セン
サ素子３に形成された抵抗の値が、歪の大きさに比例し
て変化する。この抵抗値の変化を検出し、増幅して出力
することにより被測定圧と大気圧の差圧を測定すること
ができる。In this semiconductor pressure sensor measuring method, when a pressure to be measured is applied from the pressure introducing cylinder 6, the sensor element 3 is physically distorted due to the difference between the atmospheric pressure and the pressure to be measured. This strain is proportional to the difference between the measured pressure and the atmospheric pressure. When strain occurs on the pressure detection surface of the sensor element 3, the value of the resistance formed on the sensor element 3 changes in proportion to the magnitude of the strain. The differential pressure between the measured pressure and the atmospheric pressure can be measured by detecting this change in the resistance value, amplifying and outputting it.
【０００４】また、本願出願人による特開平４−１５５
９７０号公報に開示するように、半導体圧力センサにお
いて、樹脂ケースにリードフレーム端子をインサート成
形し、このケース内の端子の基端部に、センサ素子を固
定した圧力センサも提案されている。この場合、センサ
素子は、端子の基端部に連接した接続片に、気密状態で
固定されているものであるFurther, Japanese Patent Application Laid-Open No. 4-155 filed by the applicant of the present application
As disclosed in Japanese Patent Publication No. 970, a pressure sensor in which a lead frame terminal is insert-molded in a resin case and a sensor element is fixed to the base end portion of the terminal in the case is also proposed in the semiconductor pressure sensor. In this case, the sensor element is fixed in an airtight state to the connection piece connected to the base end of the terminal.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記従来
の前者の場合、センサ素子３をガラス台座２に密着さ
せ、このガラス台座２と本体部１とをハンダ付けするも
のであり、組み立て工数がかかり、部品のコストも高い
ものである。さらに、センサ素子と他の部材との接合箇
所が多く、導入した圧力が大気側に漏れやすく、正確に
測定できなかったり、有毒なガスが外部に漏れたりする
恐れがあった。また、上記従来の技術の後者の場合も、
インサート成形したリードフレームの接続片と樹脂との
間の気密性がなく、この接続片と樹脂との間から被測定
圧が漏れ、上記と同様の問題が生じるものであった。However, in the former case described above, the sensor element 3 is brought into close contact with the glass pedestal 2 and the glass pedestal 2 and the main body 1 are soldered, which requires a lot of assembling steps. The cost of parts is also high. Furthermore, since there are many joints between the sensor element and other members, the introduced pressure is likely to leak to the atmosphere side, which may result in inaccurate measurement or leakage of toxic gas to the outside. In the latter case of the above conventional technique,
There is no airtightness between the connection piece of the insert-molded lead frame and the resin, and the measured pressure leaks from between the connection piece and the resin, causing the same problem as described above.
【０００６】この発明は上記従来の技術の問題点に鑑み
て成されたもので、センサの気密性が高く、被測定圧力
媒体が外部に漏れることがなく、かつ高精度で簡単な構
成の圧力センサとその製造方法を提供することを目的と
する。The present invention has been made in view of the above-mentioned problems of the prior art. The sensor has high airtightness, the pressure medium to be measured does not leak to the outside, and the pressure of a high precision and simple structure is obtained. An object of the present invention is to provide a sensor and a manufacturing method thereof.
【０００７】[0007]
【課題を解決するための手段】この発明は、半導体の圧
力センサ素子と、上記センサ素子の熱膨張率と近い熱膨
張率の金属製の管であって被測定圧を導入する圧力導入
筒を有し、このセンサ素子を収容する樹脂製のセンサケ
ースと一体に、リードフレーム端子と上記圧力導入筒を
インサート成形し、上記圧力導入筒の上記センサケース
内基端部に上記センサ素子を気密状態に接合した圧力セ
ンサである。According to the present invention, there is provided a semiconductor pressure sensor element and a pressure introducing tube for introducing a measured pressure, the metal tube having a coefficient of thermal expansion close to that of the sensor element. The lead frame terminal and the pressure introducing cylinder are insert-molded integrally with the resin sensor case that houses the sensor element, and the sensor element is hermetically sealed at the base end of the pressure introducing cylinder in the sensor case. Is a pressure sensor bonded to.
【０００８】またこの発明は、被測定圧を導入す金属製
の圧力導入筒と、リードフレーム端子とを設け、センサ
素子を収容する樹脂製のケースと一体的に上記リードフ
レーム端子と圧力導入筒とをインサート成形し、上記圧
力導入筒の上記ケース内基端部に上記センサ素子を気密
状態に接合する圧力センサの製造方法である。Further, according to the present invention, a metal pressure introducing cylinder for introducing the pressure to be measured and a lead frame terminal are provided, and the lead frame terminal and the pressure introducing cylinder are integrally formed with a resin case for accommodating the sensor element. Is insert-molded, and the sensor element is bonded to the base end portion of the pressure introducing cylinder in the case in an airtight state.
【０００９】[0009]
【作用】この発明の圧力センサは、圧力導入筒に直接セ
ンサ素子が密着接合されているので、被測定圧力媒体が
圧力導入筒を経て、半導体の圧力センサ素子の裏面側に
直接侵入し、圧力センサの圧力導入筒とセンサ素子以外
の構成要素には被測定圧がかからないようにしたもので
ある。In the pressure sensor of the present invention, since the sensor element is directly adhered to the pressure introducing cylinder, the pressure medium to be measured directly penetrates into the back surface side of the semiconductor pressure sensor element through the pressure introducing cylinder, and The pressure-measured cylinder of the sensor and the constituent elements other than the sensor element are not applied with the measured pressure.
【００１０】[0010]
【実施例】以下この発明の一実施例について図面に基づ
いて説明する。この実施例の圧力センサは、Ｓｉ半導体
のセンサ素子２０がセンサケース２１内に設けられ、セ
ンサ素子２０とリードフレーム端子２２の基端部２２ａ
とが、金線２３によりワイヤボンディングされている。
センサケース２１は、ＰＰＳ樹脂等の耐熱性のある樹脂
であり、リードフレーム端子２２と、圧力導入筒２５と
がインサート成形により一体に設けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In the pressure sensor of this embodiment, the sensor element 20 made of Si semiconductor is provided in the sensor case 21, and the sensor element 20 and the base end portion 22 a of the lead frame terminal 22.
And are wire-bonded by the gold wire 23.
The sensor case 21 is made of a heat-resistant resin such as PPS resin, and the lead frame terminal 22 and the pressure introducing tube 25 are integrally provided by insert molding.
【００１１】この圧力導入筒２５は、シリコンの熱膨張
率（３．２×１０-6）に近い熱膨張率の鉄−ニッケル系
合金であり、さらにクロムやアルミ又は銅を含有するも
のでも良い。この圧力導入筒２５は、鍛造により形成さ
れた円筒状の管であり、基端部にはセンサ取付用のフラ
ンジ部２６が形成され、センサ素子２０が、シリコン系
や金属接着用の接着剤２７により気密状態に接着されて
いる。そして、この圧力導入筒２５は、センサケース２
１の中央部から下方に突出して形成されている。The pressure introducing cylinder 25 is an iron-nickel alloy having a coefficient of thermal expansion close to that of silicon (3.2 × 10 -6 ), and may further contain chromium, aluminum or copper. . The pressure introducing cylinder 25 is a cylindrical tube formed by forging, a flange portion 26 for sensor attachment is formed at the base end portion, and the sensor element 20 has an adhesive 27 for silicon-based or metal adhesion. It is adhered in an airtight state by. The pressure introducing cylinder 25 is attached to the sensor case 2
It is formed so as to protrude downward from the central portion of the No. 1.
【００１２】この実施例の圧力センサの製造方法は、先
ず、図４に示すリードフレーム３０を形成し、このリー
ドフレーム３０の各リードフレーム端子２２の基端部２
２ａと圧力導入筒２５のフランジ部２６が対面するよう
に設置して、これらを囲むように、センサケース２１を
インサート成型する。この時、フランジ部２６の端面は
矩形状に樹脂が被らない露出部分を形成するとともに、
リードフレーム端子２２の基端部２２ａの表面も樹脂が
被らないように露出させる。その後、センサケース２１
の内部に位置した圧力導入筒２５のフランジ部２６に、
センサ素子２０を、接着剤２７で接着し、センサ素子２
０の周囲を密閉し、センサ素子２０の表裏の間で気体が
漏れないようにする。そして、リードフレーム端子２２
の基端部２２ａとセンサ素子２０の電極との間を、金線
２３でワイヤボンディングする。さらにセンサ素子２０
の表面側に樹脂被覆等を施し、リードフレーム端子２２
を折り曲げて所定の形状に成形し、この実施例の圧力セ
ンサの組立が終了する。In the method of manufacturing the pressure sensor of this embodiment, first, the lead frame 30 shown in FIG. 4 is formed, and the base end portions 2 of the lead frame terminals 22 of the lead frame 30 are formed.
2a and the flange portion 26 of the pressure introducing cylinder 25 are installed so as to face each other, and the sensor case 21 is insert-molded so as to surround them. At this time, the end surface of the flange portion 26 forms a rectangular exposed portion that is not covered with the resin, and
The surface of the base end 22a of the lead frame terminal 22 is also exposed so as not to be covered with the resin. After that, the sensor case 21
To the flange portion 26 of the pressure introducing cylinder 25 located inside the
The sensor element 20 is bonded to the sensor element 20 with an adhesive 27,
The circumference of 0 is sealed to prevent gas from leaking between the front and back of the sensor element 20. Then, the lead frame terminal 22
The gold wire 23 is wire-bonded between the base end portion 22a and the electrode of the sensor element 20. Furthermore, the sensor element 20
The lead frame terminal 22
Is bent and molded into a predetermined shape, and the assembly of the pressure sensor of this embodiment is completed.
【００１３】ここで、この圧力センサは、リードフレー
ム３０に多数同時に形成された後、個々の基板に取り付
けられるものである。従って、リードフレーム３０に
は、リードフレーム端子２２が、リードフレーム３０の
両側部の保持部３２から切り離されても、リードフレム
３０の保持部３２からセンサケース２１及び圧力導入筒
２５が脱落しないように、ケースとともにインサート成
形される保持片３４が四方に形成されている。この保持
片３４は、保持部３２に連結し、リードフレーム端子２
２が切断されて、所定形状に形成された後、基板にこの
圧力センサを組み込む際に切断される。Here, a large number of the pressure sensors are formed on the lead frame 30 at the same time and then attached to the individual substrates. Therefore, in the lead frame 30, even if the lead frame terminals 22 are separated from the holding portions 32 on both sides of the lead frame 30, the sensor case 21 and the pressure introducing cylinder 25 do not fall off from the holding portions 32 of the lead frame 30. A holding piece 34 that is insert-molded together with the case is formed in four directions. The holding piece 34 is connected to the holding portion 32, and the lead frame terminal 2
After 2 is cut and formed into a predetermined shape, it is cut when this pressure sensor is incorporated in the substrate.
【００１４】以上のように構成された圧力センサは、図
３に示すように、リードフレーム端子２２が、基板４０
にハンダ付けられ、基板４０に取り付けられた外部接続
端子４２に電気的に接続される。ここで、図３におい
て、中心線の右側がリードフレーム端子２２の延出方向
の縦断面であり、中心線の左側は上記リードフレーム端
子２２の延出方向と直交する方向の縦断面である。基板
４０が固定されたセンサケース２１は、外装ケース本体
４１に取りつけられ、圧力導入筒２５が、この外装ケー
ス本体４１の取付部４４に嵌め込まれる。取付部４４
は、外装ケース本体４１と一体に成形され、被測定圧力
媒体が導かれる圧力導入部４５に同軸的に連通してい
る。外装ケース本体４１は、ＰＰＳ樹脂等の耐薬品性及
び耐蝕性に優れた樹脂により形成されている。そして、
取付部４４に嵌入された圧力導入筒２５の外側面と、取
付部４４の内壁面との間には、Ｏリング４６が緊密に嵌
め込まれている。Ｏリング４６は、両側が圧力導入筒２
５と取付部４４とによって弾性的に気密状態に圧接され
ているとともに、取付部４４の下面には接触せず、ま
た、取付部４４の上面に固定されたストッパ板４７にも
接触しない状態に固定されている。In the pressure sensor configured as described above, as shown in FIG.
And is electrically connected to the external connection terminal 42 mounted on the substrate 40. Here, in FIG. 3, the right side of the center line is a vertical section in the extending direction of the lead frame terminal 22, and the left side of the center line is a vertical section in a direction orthogonal to the extending direction of the lead frame terminal 22. The sensor case 21 to which the substrate 40 is fixed is attached to the outer case body 41, and the pressure introducing cylinder 25 is fitted into the mounting portion 44 of the outer case body 41. Mounting part 44
Is formed integrally with the outer case body 41 and coaxially communicates with a pressure introducing portion 45 through which the pressure medium to be measured is guided. The outer case body 41 is formed of a resin having excellent chemical resistance and corrosion resistance such as PPS resin. And
An O-ring 46 is tightly fitted between the outer side surface of the pressure introducing cylinder 25 fitted into the mounting portion 44 and the inner wall surface of the mounting portion 44. Both sides of the O-ring 46 are pressure introducing tubes 2
5 is elastically pressure-contacted by the mounting portion 44 and the mounting portion 44, and does not come into contact with the lower surface of the mounting portion 44 or the stopper plate 47 fixed to the upper surface of the mounting portion 44. It is fixed.
【００１５】センサケース２１内は、センサ素子２０の
表面側に、柔軟なポリウレタンゲルやシリコンゲル等の
充填材が充填され、センサ素子２０等が完全に密閉され
ている。また、外装ケース本体４１には、蓋部材４８が
取り付けられている。蓋部材４８は、その内面に形成さ
れた取付部５０に、センサケース２１の開口部が嵌合
し、センサケース２１を確実に保持するとともに、圧力
導入筒２５が取付部４４から抜けないように保持してい
る。また、蓋部材４８には、大気圧側に接続される大気
圧導入口４９が形成され、大気圧がセンサ素子２０の表
側に確実にかかるように形成されている。Inside the sensor case 21, the surface of the sensor element 20 is filled with a filling material such as a flexible polyurethane gel or silicon gel to completely seal the sensor element 20. A lid member 48 is attached to the outer case body 41. In the lid member 48, the opening of the sensor case 21 is fitted to the mounting portion 50 formed on the inner surface of the lid member 48 to securely hold the sensor case 21 and prevent the pressure introducing cylinder 25 from coming off the mounting portion 44. keeping. Further, the lid member 48 is formed with an atmospheric pressure inlet port 49 connected to the atmospheric pressure side so that the atmospheric pressure is reliably applied to the front side of the sensor element 20.
【００１６】この実施例の圧力センサの使用法方は、圧
力導入部４５を被測定圧力側に接続し、大気圧圧力導入
口４９を大気圧側に開放する。被測定圧力媒体は、例え
ば、ＬＰガス等の可燃性ガス、その他の有毒ガスや高圧
ガス等に使用することができる。In the method of using the pressure sensor of this embodiment, the pressure introducing portion 45 is connected to the measured pressure side and the atmospheric pressure introducing port 49 is opened to the atmospheric pressure side. The pressure medium to be measured can be used, for example, as a combustible gas such as LP gas, other toxic gas, or high pressure gas.
【００１７】この実施例の圧力センサによれば、圧力測
定するガス等は、圧力導入部４５を通り、圧力導入筒２
５を経てセンサ素子２０の裏面側に直接接触し圧力がセ
ンサ素子２０に直接かかるものである。従って、感度が
きわめて高く、装置も小型化でき、低い圧力の検出に際
してもきわめて正確な測定が可能である。さらに、セン
サ素子２０は、これと熱膨張率の近い圧力導入筒２５に
直接接合されているので、熱歪による応力がセンサ素子
２０にはほとんど伝わらず、しかも気密性がきわめて高
く、信頼性も高いものにすることができる。さらに、腐
食性ガス等に対する耐久性も高いものである。また、こ
の圧力センサを組み込んだ外装ケース本体４１のセンサ
装置においても、圧力を測定するガスは、圧力導入部４
５、Ｏリング４６、圧力導入筒２５及びセンサ素子２０
にのみ接触するものであり、他の構成要素や接合部には
触れず、上記各部材は、対腐食性、耐久性等に対する信
頼性はきわめて高いものが選択できる。従って、有毒ガ
スや可燃性ガスの測定に際しても十分な安全性を確保す
ることができるものである。According to the pressure sensor of this embodiment, the gas or the like whose pressure is to be measured passes through the pressure introducing portion 45 and passes through the pressure introducing cylinder 2.
The pressure is directly applied to the sensor element 20 by directly contacting the back surface side of the sensor element 20 via the pressure sensor 5. Therefore, the sensitivity is extremely high, the apparatus can be downsized, and extremely accurate measurement is possible even when detecting low pressure. Further, since the sensor element 20 is directly joined to the pressure introducing tube 25 having a thermal expansion coefficient close to that of the sensor element 20, stress due to thermal strain is hardly transmitted to the sensor element 20, and the airtightness is extremely high and the reliability is high. It can be expensive. Further, it has high durability against corrosive gas and the like. Further, also in the sensor device of the outer case body 41 incorporating this pressure sensor, the gas whose pressure is to be measured is the pressure introducing portion 4
5, O-ring 46, pressure introducing cylinder 25 and sensor element 20
The above-mentioned members can be selected to have extremely high reliability with respect to corrosion resistance, durability, etc., without touching other components or joints. Therefore, it is possible to secure sufficient safety even when measuring toxic gas or flammable gas.
【００１８】尚、この発明の圧力センサは、上記の実施
例に限定されるものではなく、センサ素子と圧力導入筒
との接合方法は接着剤以外の接合方法でも良いものであ
る。また、センサ素子をインサート成形前に圧力導入筒
に接合しても良いものである。圧力導入筒の材質は適宜
変更可能であり、センサ素子の熱膨張率と近いものであ
れば良い。The pressure sensor of the present invention is not limited to the above embodiment, and the method of joining the sensor element and the pressure introducing cylinder may be a joining method other than an adhesive. Further, the sensor element may be joined to the pressure introducing cylinder before insert molding. The material of the pressure introducing cylinder can be changed as appropriate, and may be any material close to the coefficient of thermal expansion of the sensor element.
【００１９】[0019]
【発明の効果】この発明の圧力センサは、上記センサ素
子と圧力導入筒を互いに直接接合したので、気密性に対
する信頼性をきわめて高いものにすることができる。さ
らに、この圧力センサは、センサ素子の熱膨張率と近い
熱膨張率の圧力導入筒にセンサ素子を取り付けたので、
センサ素子に熱歪が伝わらず、正確な測定が可能であ
る。また、この圧力センサの製造も、インサート成形に
より簡単に行うことができ、センサ素子と圧力導入筒と
の接合も容易に可能であり、製造コストも安価なものに
することができるものである。According to the pressure sensor of the present invention, since the sensor element and the pressure introducing cylinder are directly joined to each other, the reliability of the airtightness can be made extremely high. Further, in this pressure sensor, since the sensor element is attached to the pressure introducing cylinder having a thermal expansion coefficient close to that of the sensor element,
Accurate measurement is possible without thermal strain being transmitted to the sensor element. Also, the pressure sensor can be easily manufactured by insert molding, the sensor element and the pressure introducing cylinder can be easily joined, and the manufacturing cost can be reduced.
【図面の簡単な説明】[Brief description of drawings]
【図１】この発明の一実施例の圧力センサの縦断面図で
ある。FIG. 1 is a vertical sectional view of a pressure sensor according to an embodiment of the present invention.
【図２】この実施例の圧力センサの平面図である。FIG. 2 is a plan view of the pressure sensor of this embodiment.
【図３】この実施例の圧力センサを外装ケースに取り付
けた状態の縦断面図でる。FIG. 3 is a vertical cross-sectional view showing a state in which the pressure sensor of this embodiment is attached to an outer case.
【図４】この実施例の圧力センサに用いられるリードフ
レームの平面図である。FIG. 4 is a plan view of a lead frame used in the pressure sensor of this embodiment.
【図５】従来の技術の圧力センサの縦断面図である。FIG. 5 is a vertical cross-sectional view of a conventional pressure sensor.
２０ センサ素子 ２１ センサケース ２２ リードフレーム端子 ２５ 圧力導入筒 20 sensor element 21 sensor case 22 lead frame terminal 25 pressure introducing tube
Claims (2)
素子の熱膨張率と近い熱膨張率の金属製の管であって被
測定圧を導入する圧力導入筒を有し、このセンサ素子を
収容する樹脂製のセンサケースと一体に、リードフレー
ム端子と上記圧力導入筒とをインサート成形し、上記圧
力導入筒の上記センサケース内の基端部に上記センサ素
子を気密状態に接合したことを特徴とする圧力センサ。1. A semiconductor pressure sensor element, and a metal-made tube having a coefficient of thermal expansion close to that of the sensor element, the tube having a pressure introducing tube for introducing a pressure to be measured, and the sensor element is housed. Integrating with the resin sensor case, the lead frame terminal and the pressure introducing cylinder are insert-molded, and the sensor element is bonded to the base end portion of the pressure introducing cylinder in the sensor case in an airtight state. And pressure sensor.
と、リードフレーム端子とを設け、センサ素子を収容す
る樹脂製のセンサケースと一体的に上記リードフレーム
端子と圧力導入筒とをインサート成形し、上記圧力導入
筒の上記ケース内基端部に上記センサ素子を気密状態に
接合することを特徴とする圧力センサの製造方法。2. A pressure introducing cylinder made of metal for introducing a pressure to be measured and a lead frame terminal are provided, and the lead frame terminal and the pressure introducing cylinder are integrally formed with a resin sensor case for accommodating a sensor element. A method of manufacturing a pressure sensor, comprising insert-molding, and joining the sensor element to a base end portion of the pressure introducing cylinder in the case in an airtight state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5082812A JP2782572B2 (en) | 1993-03-16 | 1993-03-16 | Pressure sensor and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5082812A JP2782572B2 (en) | 1993-03-16 | 1993-03-16 | Pressure sensor and method of manufacturing the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09347074A Division JP3081179B2 (en) | 1997-12-01 | 1997-12-01 | Pressure sensor and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06273248A true JPH06273248A (en) | 1994-09-30 |
| JP2782572B2 JP2782572B2 (en) | 1998-08-06 |
Family
ID=13784829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5082812A Expired - Lifetime JP2782572B2 (en) | 1993-03-16 | 1993-03-16 | Pressure sensor and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2782572B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002079743A1 (en) * | 2001-03-29 | 2002-10-10 | Hitachi, Ltd. | Semiconductor pressure sensor |
| JP2005098976A (en) * | 2003-08-29 | 2005-04-14 | Fuji Electric Device Technology Co Ltd | Pressure sensor unit |
| JP2006010547A (en) * | 2004-06-28 | 2006-01-12 | Denso Corp | Humidity sensor module and humidity sensor mounting structure |
| US7406875B2 (en) | 2005-09-13 | 2008-08-05 | Denso Corporation | Pressure sensor for a vehicle |
| JP2011102811A (en) * | 2003-08-29 | 2011-05-26 | Fuji Electric Systems Co Ltd | Pressure sensor device |
| JP2019053011A (en) * | 2017-09-19 | 2019-04-04 | 株式会社Ｓｕｂａｒｕ | Object speed calculation device |
| JP2019060626A (en) * | 2017-09-25 | 2019-04-18 | アルプスアルパイン株式会社 | Pressure detection device and assembling method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0337536A (en) * | 1989-07-03 | 1991-02-18 | Fuji Electric Co Ltd | Manufacture of semiconductor pressure transducer |
| JPH04155970A (en) * | 1990-10-19 | 1992-05-28 | Hokuriku Electric Ind Co Ltd | Semiconductor pressure sensor and its manufacture |
-
1993
- 1993-03-16 JP JP5082812A patent/JP2782572B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0337536A (en) * | 1989-07-03 | 1991-02-18 | Fuji Electric Co Ltd | Manufacture of semiconductor pressure transducer |
| JPH04155970A (en) * | 1990-10-19 | 1992-05-28 | Hokuriku Electric Ind Co Ltd | Semiconductor pressure sensor and its manufacture |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002079743A1 (en) * | 2001-03-29 | 2002-10-10 | Hitachi, Ltd. | Semiconductor pressure sensor |
| US6964200B2 (en) | 2001-03-29 | 2005-11-15 | Hitachi, Ltd. | Light source device and display device |
| JP2005098976A (en) * | 2003-08-29 | 2005-04-14 | Fuji Electric Device Technology Co Ltd | Pressure sensor unit |
| JP2011102811A (en) * | 2003-08-29 | 2011-05-26 | Fuji Electric Systems Co Ltd | Pressure sensor device |
| JP2006010547A (en) * | 2004-06-28 | 2006-01-12 | Denso Corp | Humidity sensor module and humidity sensor mounting structure |
| US7406875B2 (en) | 2005-09-13 | 2008-08-05 | Denso Corporation | Pressure sensor for a vehicle |
| JP2019053011A (en) * | 2017-09-19 | 2019-04-04 | 株式会社Ｓｕｂａｒｕ | Object speed calculation device |
| JP2019060626A (en) * | 2017-09-25 | 2019-04-18 | アルプスアルパイン株式会社 | Pressure detection device and assembling method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2782572B2 (en) | 1998-08-06 |
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