JPH09178596A - Pressure sensor - Google Patents

Pressure sensor

Info

Publication number
JPH09178596A
JPH09178596A JP33656195A JP33656195A JPH09178596A JP H09178596 A JPH09178596 A JP H09178596A JP 33656195 A JP33656195 A JP 33656195A JP 33656195 A JP33656195 A JP 33656195A JP H09178596 A JPH09178596 A JP H09178596A
Authority
JP
Japan
Prior art keywords
pressure
pressure sensor
printed circuit
circuit board
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33656195A
Other languages
Japanese (ja)
Inventor
Masami Hori
正美 堀
Norikimi Kaji
紀公 梶
Takashi Yajima
孝志 矢島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP33656195A priority Critical patent/JPH09178596A/en
Publication of JPH09178596A publication Critical patent/JPH09178596A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a highly reliable pressure sensor by making an atmosphere introduction hole through the body with the outer open end thereof being located on the opposite side to a mounting board with respect to the body thereby preventing a foreign matter from intruding into the pressure sensor when it is mounted on the mounting board. SOLUTION: A pressure introduction tube 11 has a flow-in hole 11b communicating between the inside 1a and outside and an object for pressure measurement, i.e., a fluid, flows into the flow-in hole 11b. Since the outer open end 12a of atmosphere introduction hole 12b made through the body 1 is located on the opposite side to a mounting board 8, a pressure sensor chip 2 is not susceptible to corrosion due to gas intruding into the body 1 through introduction hole 12b on the contrary to a conventional structure where the introduction hole 12b is made through a cover 6. Consequently, the service life of chip 2 is prolonged and the introduction hole 12b is not choked with a foreign matter.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、端子が実装基板に
実装されて、流体の圧力と大気圧との差圧に基づいて流
体の圧力を測定するいわゆる差圧型の圧力センサに関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called differential pressure type pressure sensor in which terminals are mounted on a mounting board and the fluid pressure is measured based on the differential pressure between the fluid pressure and the atmospheric pressure.

【0002】[0002]

【従来の技術】従来、この種の圧力センサとして、図5
に示す構成のものが存在する。このものは、カバーAが
覆設される樹脂製のボディBと、ボディの内部B1と外
部とを連通し圧力測定対象である流体が流入する圧力導
入管Cと、ボディBの内部B1で圧力導入管端面C1に
密着固定されて圧力を電気信号に変換する圧力センサチ
ップDと、ボディBに装着されて圧力センサチップDと
ワイヤボンディングでもって接続されるプリント基板E
と、プリント基板Eに接続されてボディBの外部に導出
される端子Fと、外部開口端A1からボディBの内部B
1に大気を導入する大気導入孔A2と、を備えている。
2. Description of the Related Art Conventionally, as a pressure sensor of this type, FIG.
There exists a thing of a structure shown in FIG. This includes a resin-made body B on which a cover A is covered, a pressure introducing pipe C which communicates the inside B1 of the body with the outside and into which a fluid whose pressure is to be measured flows, and a pressure inside the body B1. A pressure sensor chip D that is tightly fixed to the end surface C1 of the introduction tube and converts pressure into an electric signal, and a printed circuit board E that is mounted on the body B and is connected to the pressure sensor chip D by wire bonding.
A terminal F connected to the printed circuit board E and led to the outside of the body B, and the inside B of the body B from the external opening end A1.
1 has an air introduction hole A2 for introducing the atmosphere.

【0003】[0003]

【発明が解決しようとする課題】上記した従来の圧力セ
ンサでは、カバーAに大気導入孔A2が設けられている
から、ボディBの内部B1の大気圧が測定の基準となる
外部の大気圧と等しくなって、流体の圧力と外部の大気
圧との差圧を正しく測定できる。
In the conventional pressure sensor described above, since the cover A is provided with the atmosphere introduction hole A2, the atmospheric pressure in the inside B1 of the body B is equal to the outside atmospheric pressure which serves as a reference for measurement. By making them equal, the differential pressure between the fluid pressure and the external atmospheric pressure can be measured correctly.

【0004】しかしながら、端子Fが実装基板Gにその
挿通孔G1に挿通されて実装された場合、半田付け時に
半田のフラックス等の異物が大気導入孔A2を通してボ
ディBの内部B1に侵入して、圧力センサチップDに腐
食等の悪影響を及ぼし、圧力センサチップDの信頼性を
阻害する場合があった。また、実装基板Gに搭載された
素子(図示せず)を防水構造とするために素子を樹脂で
封止するとき、樹脂が大気導入孔A2に入って、この樹
脂によって大気導入孔A2がつまる場合があった。
However, when the terminal F is mounted on the mounting board G by being inserted into the insertion hole G1, foreign matter such as flux of solder enters the inside B1 of the body B through the air introduction hole A2 during soldering. There are cases where the pressure sensor chip D is adversely affected by corrosion and the reliability of the pressure sensor chip D is impaired. Further, when the element (not shown) mounted on the mounting board G is sealed with resin in order to have a waterproof structure, the resin enters the air introduction hole A2 and the resin blocks the air introduction hole A2. There were cases.

【0005】本発明は、上記事由に鑑みてなしたもの
で、その目的とするところは、実装基板に実装しても半
田のフラックス等の異物がボディ内部に侵入せず、信頼
性の高い圧力センサを提供することにある。
The present invention has been made in view of the above circumstances, and an object thereof is to prevent foreign matter such as solder flux from entering the inside of a body even when it is mounted on a mounting board, and to provide a highly reliable pressure. To provide a sensor.

【0006】[0006]

【課題を解決するための手段】上記した課題を解決する
ために、請求項1記載のものは、カバーが覆設される樹
脂製のボディと、ボディの内部と外部とを連通し圧力測
定対象である流体が流入する圧力導入管と、ボディの内
部で圧力導入管端面に密着固定されて圧力を電気信号に
変換する圧力センサチップと、ボディに装着されて圧力
センサチップとワイヤボンディングでもって接続される
プリント基板と、プリント基板に接続されてボディの外
部に導出される端子と、外部開口端からボディの内部に
大気を導入する大気導入孔と、を備え、端子が実装基板
に実装され、流体の圧力と大気との差圧に基づいて流体
の圧力を測定する圧力センサにおいて、前記大気導入孔
は、前記外部開口端が前記ボディに対し前記実装基板と
反対側に位置するように前記ボディに設けられた構成に
してある。
In order to solve the above-mentioned problems, according to a first aspect of the present invention, a body made of resin having a cover and a pressure measuring object communicating the inside and the outside of the body. The pressure introducing pipe into which the fluid flows, the pressure sensor chip that is fixed in close contact with the end surface of the pressure introducing pipe inside the body and converts pressure into an electric signal, and mounted on the body and connected to the pressure sensor chip by wire bonding. A printed circuit board, a terminal connected to the printed circuit board and led to the outside of the body, and an air introduction hole for introducing the atmosphere into the body from the external opening end, and the terminal is mounted on the mounting board, In a pressure sensor that measures the pressure of a fluid based on the pressure difference between the pressure of the fluid and the atmosphere, the atmosphere introduction hole has the outer opening end located on the side opposite to the mounting substrate with respect to the body. It is the configuration provided in sea urchin the body.

【0007】請求項2記載のものは、請求項1記載のも
のにおいて、前記プリント基板がシリコンゲルでもって
被覆されたものであって、前記大気導入孔は筒状に形成
されプリント基板面から突出した構成にしてある。
According to a second aspect of the present invention, in the first aspect, the printed circuit board is covered with silicon gel, and the air introduction hole is formed in a cylindrical shape and protrudes from the printed circuit board surface. It has been configured.

【0008】請求項3記載のものは、請求項2記載のも
のにおいて、前記大気導入孔は前記ボディと一体形成さ
れた構成にしてある。
According to a third aspect of the present invention, in the second aspect, the atmosphere introducing hole is formed integrally with the body.

【0009】請求項4記載のものは、請求項1記載のも
のにおいて、前記端子と当接して接合固定される補助端
子が、前記プリント基板に設けられた構成にしてある。
According to a fourth aspect of the present invention, in the first aspect of the present invention, the printed circuit board is provided with an auxiliary terminal that abuts and is fixed to the terminal.

【0010】[0010]

【発明の実施の形態】本発明の第1実施形態を図1乃至
図3に基づいて以下に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS.

【0011】1はボディで、絶縁性の樹脂により、中心
位置にて一体形成された筒状の圧力導入管11が設けら
れ、後述するカバー6でもって形成される内部1aを有
している。圧力導入管11は、その基端部が突出して外
部に開口し、先端部が同様にに突出して圧力導入管端面
11aにて内部1aに開口して、内部1aと外部とを連
通した流入孔11bを有し、流入孔11bに圧力測定対
象である流体が流入する。さらに大気導入管12が設け
られている。
Reference numeral 1 denotes a body, which is provided with a cylindrical pressure introducing pipe 11 integrally formed at a central position by an insulating resin, and has an inside 1a formed by a cover 6 described later. The pressure introducing pipe 11 has a base end projecting and opening to the outside, a tip part similarly projecting and opening to the inside 1a at the pressure introducing pipe end face 11a, and an inflow hole communicating the inside 1a and the outside. A fluid having a pressure measurement target flows into the inflow hole 11b. Further, an air introduction pipe 12 is provided.

【0012】大気導入管12は、円筒状で圧力導入管1
1の軸と略平行にボディ1と一体形成され、外部開口端
12aからボディ内部1aに大気を導入する大気導入孔
12bを有し、一端部12cが外部に開口し、他端部1
2dがボディ1の内部1aに開口している。
The atmosphere introducing pipe 12 is cylindrical and has a pressure introducing pipe 1.
1 is formed substantially in parallel with the axis of the body 1 and has an air introduction hole 12b for introducing the atmosphere into the body interior 1a from the outer opening end 12a, and one end 12c is opened to the outside and the other end 1 is formed.
2d opens to the inside 1a of the body 1.

【0013】2は圧力センサチップで、シリコン半導体
素子であり、電極2aが設けられ、半田付け又はシリコ
ン系の接着剤によって圧力導入管端面11aに密着固定
されて、圧力導入管11の流入孔11bを遮蔽し、シリ
コンダイヤフラム上にピエゾ抵抗を配することによって
歪みゲージを形成し、流体の圧力を電気信号に変換す
る。
Reference numeral 2 denotes a pressure sensor chip, which is a silicon semiconductor element, is provided with an electrode 2a, and is closely adhered and fixed to the pressure introducing pipe end surface 11a by soldering or a silicon-based adhesive, and the inflow hole 11b of the pressure introducing pipe 11 is provided. The strain gauge is formed by shielding the piezoresistor and placing a piezoresistor on the silicon diaphragm to convert the fluid pressure into an electric signal.

【0014】3はプリント基板で、セラミック基板によ
り回路が形成され、四隅に4個の円形状の穴3aと1個
の円形状の穴3bと1個の四角状の貫挿穴3cと6個の
電極3dとを有し、増幅回路が配された素子3eを搭載
し、温度補償用の厚膜抵抗(図示せず)が形成されて、
ボディ1に装着されている。このとき、大気導入管12
の他端部12dが穴3bから突出して導出され、圧力セ
ンサチップ2が貫挿穴3c内に位置することになる。
Reference numeral 3 is a printed circuit board on which a circuit is formed by a ceramic substrate, and four circular holes 3a, one circular hole 3b and one square through hole 3c are provided at four corners. An element 3e having an amplifier circuit is mounted, and a thick film resistor (not shown) for temperature compensation is formed.
It is attached to the body 1. At this time, the air introduction pipe 12
The other end portion 12d of the pressure sensor chip 2 is projected and led out from the hole 3b, and the pressure sensor chip 2 is positioned in the through hole 3c.

【0015】4は端子で、Cu又はCu合金の金属によ
り、長尺状で略L字状に折曲形成され、側壁1bに固着
されてボディ1の両側方にそれぞれ2個設けられ、ボデ
ィ1の内部に配された内部端子41と外部に配された外
部端子42とを有し、内部端子41に突出片41aが設
けられその突出片41aがプリント基板3の穴3aに導
出され、外部端子42が、大気導入管12の外部開口端
12aとボディ1に対し反対側に導出されている。
Reference numeral 4 denotes a terminal, which is made of a metal such as Cu or a Cu alloy and is formed into a long and substantially L-shape, and fixed to the side wall 1b. Two terminals are provided on each side of the body 1. Has an internal terminal 41 arranged inside and an external terminal 42 arranged outside, and a protruding piece 41a is provided on the internal terminal 41, and the protruding piece 41a is led out to the hole 3a of the printed circuit board 3 42 is drawn out to the opposite side to the outer open end 12 a of the atmosphere introducing pipe 12 and the body 1.

【0016】5はワイヤで、Au又はAlの金属細線で
あり、端末がワイヤボンディングによって圧力センサチ
ップ2の電極2a及びプリント基板3の電極3dとを接
続している。6はカバーで、樹脂により、ボディ1に覆
設される。7はシリコンゲルで、有機物を含む樹脂によ
り、塗布時に液状で乾燥するとゲル状となって、圧力セ
ンサチップ2及びプリント基板3の実装面に被覆されて
いる。
Reference numeral 5 denotes a wire, which is a thin metal wire of Au or Al, and a terminal connects the electrode 2a of the pressure sensor chip 2 and the electrode 3d of the printed board 3 by wire bonding. Reference numeral 6 denotes a cover, which is covered with resin on the body 1. Reference numeral 7 denotes a silicon gel, which is made of a resin containing an organic substance and becomes a gel when dried in a liquid state at the time of application, and covers the mounting surfaces of the pressure sensor chip 2 and the printed board 3.

【0017】ここで、プリント基板3がボディ1に装着
され、内部端子41の突出片41aがプリント基板3の
穴3aにて半田付けされて、プリント基板3と端子4と
が電気的に接続されるとともに、ボディ1とプリント基
板3とが固定される。圧力センサチップ2が圧力導入管
端面11aに密着固定され、圧力センサチップ2の電極
2aとプリント基板3の電極3dとがワイヤ5でもって
ワイヤボンディングされて、それぞれが電気的に接続さ
れる。ここで、ワイヤボンディングは、圧力を負荷した
状態で超音波振動を負荷しボンディングする方法であ
る。
Here, the printed circuit board 3 is mounted on the body 1, and the protruding pieces 41a of the internal terminals 41 are soldered in the holes 3a of the printed circuit board 3 to electrically connect the printed circuit board 3 and the terminals 4. At the same time, the body 1 and the printed circuit board 3 are fixed. The pressure sensor chip 2 is closely fixed to the end surface 11a of the pressure introducing pipe, and the electrode 2a of the pressure sensor chip 2 and the electrode 3d of the printed board 3 are wire-bonded with the wire 5 to electrically connect them. Here, wire bonding is a method of bonding by applying ultrasonic vibration while applying pressure.

【0018】圧力導入管11の流入孔11bに空気等の
流体が流入されて圧力を負荷した状態で、温度を上昇及
び下降させ外部端子42からの出力電圧値を測定するこ
とによって、圧力センサチップ2の温度特性が測定され
る。この温度特性測定結果に基づいて、プリント基板3
の温度補償用の厚膜抵抗の抵抗値が調整される。この状
態で、圧力センサチップ2及びプリント基板3の表面に
シリコンゲル7が塗布される。このとき、大気導入管1
2の他端部12dがプリント基板3の穴3bから突出し
て導出されているから、シリコンゲル7が大気導入孔1
2bに侵入せず、大気導入孔12bがつまることがな
い。次いで、樹脂製のカバー6がボディ1に覆設されて
外部とボディ1の内部1aとを遮蔽する。
A pressure sensor chip is obtained by measuring the output voltage value from the external terminal 42 by raising and lowering the temperature in a state where a fluid such as air is flown into the inflow hole 11b of the pressure introducing pipe 11 and pressure is applied. The temperature characteristic of 2 is measured. Based on the temperature characteristic measurement result, the printed circuit board 3
The resistance value of the thick film resistor for temperature compensation is adjusted. In this state, the silicon gel 7 is applied to the surfaces of the pressure sensor chip 2 and the printed circuit board 3. At this time, the air introduction pipe 1
Since the other end portion 12d of 2 is projected and led out from the hole 3b of the printed circuit board 3, the silicon gel 7 is attached to the atmosphere introduction hole 1
2b does not enter, and the atmosphere introduction hole 12b is not clogged. Then, a resin cover 6 is provided on the body 1 to shield the outside from the inside 1a of the body 1.

【0019】ここで、外部端子42が実装基板8の挿通
孔8aに挿通され半田付部8bでもって実装基板8に実
装されると、実装基板8は、大気導入管12の外部に開
口した外部開口端12aとボディ1に対し反対側に位置
することになる。
Here, when the external terminal 42 is inserted into the insertion hole 8a of the mounting board 8 and mounted on the mounting board 8 by the soldering portion 8b, the mounting board 8 is opened to the outside of the atmosphere introducing tube 12 and the outside. The opening end 12a and the body 1 are located on the opposite side.

【0020】このものの動作を説明する。空気等の流体
は、圧力導入管11の流入孔11bに導入され、このと
き、流入孔11bが圧力センサチップ2で遮蔽されその
圧力センサチップ2が圧力導入管端面11aに密着固定
されているから、漏れることがない。流体の圧力が圧力
センサチップ2に負荷されると、シリコン半導体素子に
形成されたシリコンダイヤフラムが、流体の圧力と大気
圧との差に比例して撓む。そして、シリコンダイヤフラ
ムの上に形成されたピエゾ抵抗の抵抗値が撓みの大きさ
に比例して変化し、この抵抗値をプリント基板3に設け
られた厚膜抵抗の抵抗値でもって温度補償をしたうえ
で、電気信号を素子3eで増幅して端子4に出力する。
このようにして、流体の圧力と大気圧との差圧を測定す
る。
The operation of the above will be described. A fluid such as air is introduced into the inflow hole 11b of the pressure introducing pipe 11, and at this time, the inflow hole 11b is shielded by the pressure sensor chip 2 and the pressure sensor chip 2 is closely fixed to the pressure introducing pipe end surface 11a. , Never leak. When the pressure of the fluid is applied to the pressure sensor chip 2, the silicon diaphragm formed on the silicon semiconductor element bends in proportion to the difference between the fluid pressure and the atmospheric pressure. Then, the resistance value of the piezoresistor formed on the silicon diaphragm changes in proportion to the size of the deflection, and the resistance value is temperature-compensated by the resistance value of the thick film resistor provided on the printed circuit board 3. Then, the electric signal is amplified by the element 3e and output to the terminal 4.
In this way, the pressure difference between the fluid pressure and the atmospheric pressure is measured.

【0021】かかる第1実施形態の圧力センサにあって
は、上記したように、外部端子42を実装基板8に実装
すれば、外部からボディ1の内部1aに大気を導入する
大気導入孔12bの外部開口端12aが実装基板8と反
対側に位置するから、半田付け時に半田のフラックス等
の異物が、カバーに大気導入孔を設けた従来と異なり、
大気導入孔12bを通してボディ1の内部1aに侵入し
て圧力センサチップ2を腐食することがなく、圧力セン
サチップ2を高寿命化でき、また異物によって大気導入
孔12bがつまることもない。
In the pressure sensor of the first embodiment, if the external terminals 42 are mounted on the mounting substrate 8 as described above, the atmosphere introducing hole 12b for introducing the atmosphere from the outside into the inside 1a of the body 1 is formed. Since the external opening end 12a is located on the side opposite to the mounting substrate 8, foreign matter such as solder flux during soldering is different from the conventional case where the atmosphere introducing hole is provided in the cover.
The pressure sensor chip 2 is not corroded by entering the inside 1a of the body 1 through the air introduction hole 12b, the life of the pressure sensor chip 2 can be extended, and foreign matter does not clog the air introduction hole 12b.

【0022】また、圧力センサチップ2とプリント基板
3とをワイヤボンディングした後プリント基板3面をシ
リコンゲル7でもって被覆すれば、大気導入孔12bが
筒状の大気導入管12でもって形成されプリント基板3
面から突出しているから、シリコンゲル7が大気導入孔
12bに入ってつまることなくプリント基板3に塗布さ
れて、ワイヤボンディング部とプリント基板3に形成さ
れた回路とをボディ1の内部1aへ侵入した水分から保
護できる。
If the pressure sensor chip 2 and the printed circuit board 3 are wire-bonded and then the surface of the printed circuit board 3 is covered with the silicon gel 7, the air introduction hole 12b is formed by the cylindrical air introduction tube 12 and printed. Board 3
Since it protrudes from the surface, the silicon gel 7 is applied to the printed circuit board 3 without difficulty by entering the air introduction hole 12b, and the wire bonding portion and the circuit formed on the printed circuit board 3 enter the inside 1a of the body 1. You can protect it from moisture.

【0023】また、筒状に形成された大気導入孔12b
がボディ1と一体形成されているから、大気導入孔12
bを得るための管状の新規部品を必要とせず、コストを
安価にできる。
Further, the air introducing hole 12b formed in a cylindrical shape.
Is integrally formed with the body 1, the air introduction hole 12
No new tubular part is required to obtain b, and the cost can be reduced.

【0024】なお、第1実施形態では、大気導入孔12
bを、筒状の大気導入管12でもって形成したが、外部
開口端12aがボディ1に対し実装基板8と反対側に位
置するボディ1に設けられた穴としてもよく、限定され
ない。
In the first embodiment, the air introduction hole 12
Although b is formed by the cylindrical air introduction tube 12, the outer opening end 12a may be a hole provided in the body 1 located on the opposite side of the body 1 from the mounting substrate 8, and is not limited.

【0025】本発明の第2実施形態を図4に基づいて以
下に説明する。なお、第2実施形態では第1実施形態と
異なる機能について述べることとし、第1実施形態と実
質的に同一機能を有する部材については同一符号を付し
てある。
A second embodiment of the present invention will be described below with reference to FIG. In the second embodiment, the functions different from those in the first embodiment will be described, and the members having substantially the same functions as those in the first embodiment are designated by the same reference numerals.

【0026】プリント基板3は、金属からなり略L字状
で突出片を有する補助端子3fが四隅に設けられて、ボ
ディ1に装着されている。このとき、補助端子3fの突
出片が内部端子41の突出片41aと当接し、当接部に
てレーザ溶接でもって接合されて、プリント基板3と端
子4とが電気的に接続されるとともに、ボディ1とプリ
ント基板3とが固定される。
The printed circuit board 3 is mounted on the body 1 with auxiliary terminals 3f made of metal and having a substantially L shape and having protruding pieces provided at four corners. At this time, the protruding piece of the auxiliary terminal 3f comes into contact with the protruding piece 41a of the internal terminal 41, and is joined by laser welding at the abutting portion to electrically connect the printed board 3 and the terminal 4, and The body 1 and the printed circuit board 3 are fixed.

【0027】かかる第2実施形態の圧力センサにあって
は、上記したように、プリント基板3に補助端子3fが
設けられ内部端子41と当接してその当接部でもって接
合固定されるから、プリント基板3の回路と端子4とを
電気的に接続して、かつ、接合時の加熱部が局所化され
るので、プリント基板3の温度を上昇させることなくボ
ディ1とプリント基板3とを短時間に固定して、プリン
ト基板3に形成された回路及び搭載された素子3eを熱
障害から保護できる。
In the pressure sensor of the second embodiment, as described above, the printed circuit board 3 is provided with the auxiliary terminal 3f, abuts on the internal terminal 41, and is joined and fixed by the abutting portion. Since the circuit of the printed circuit board 3 and the terminal 4 are electrically connected and the heating part at the time of bonding is localized, the body 1 and the printed circuit board 3 can be shortened without increasing the temperature of the printed circuit board 3. By fixing the time, the circuit formed on the printed circuit board 3 and the mounted element 3e can be protected from thermal damage.

【0028】[0028]

【発明の効果】請求項1記載のものは、端子を実装基板
に実装すれば、ボディに設けられた大気導入孔の外部開
口端12aが実装基板8と反対側に位置するから、半田
付け時に半田のフラックス等の異物が、カバーに大気導
入孔を設けた従来と異なり、大気導入孔を通してボディ
の内部に侵入して圧力センサチップを腐食することがな
く、その圧力センサチップを高寿命化でき、また異物に
よって大気導入孔がつまることもない。
According to the first aspect of the present invention, when the terminals are mounted on the mounting board, the outer opening end 12a of the air introduction hole provided in the body is located on the side opposite to the mounting board 8. Unlike the conventional method in which foreign matter such as solder flux penetrates the inside of the body through the air introduction hole and does not corrode the pressure sensor chip unlike the conventional case where the air introduction hole is provided in the cover, the life of the pressure sensor chip can be extended. Also, foreign matter does not block the air introduction hole.

【0029】請求項2記載のものは、請求項1記載のも
のの効果に加えて、圧力センサチップとプリント基板と
をワイヤボンディングした状態でプリント基板面をシリ
コンゲルでもって被覆すれば、大気導入孔が筒状に形成
されプリント基板面から突出しているから、シリコンゲ
ルが大気導入孔に入ってつまることなくプリント基板に
塗布されて、ワイヤボンディング部とプリント基板に形
成された回路とをボディの内部に侵入した水分から保護
できる。
According to a second aspect of the present invention, in addition to the effect of the first aspect, when the pressure sensor chip and the printed circuit board are wire-bonded to each other and the printed circuit board surface is covered with silicon gel, the air introduction hole is formed. Since it is formed in a cylindrical shape and protrudes from the surface of the printed circuit board, silicon gel is applied to the printed circuit board without difficulty by entering the air introduction hole, so that the wire bonding portion and the circuit formed on the printed circuit board can be formed inside the body. Protects against moisture that has penetrated into.

【0030】請求項3記載のものは、請求項2記載のも
のの効果に加えて、筒状に形成された大気導入孔がボデ
ィと一体形成されているから、大気導入孔を得るための
管状の新規部品を必要とせず、コストを安価にできる。
According to the third aspect, in addition to the effect of the second aspect, since the cylindrical air introduction hole is integrally formed with the body, a tubular shape for obtaining the air introduction hole is provided. Costs can be reduced without the need for new parts.

【0031】請求項4記載のものは、請求項1記載のも
のの効果に加えて、プリント基板に補助端子が設けられ
端子と当接してその当接部でもって接合固定されるか
ら、プリント基板の回路と端子とを電気的に接続して、
かつ、接合時の加熱部が局所化されるので、プリント基
板の温度を上昇させることなくボディとプリント基板と
を短時間に固定して、プリント基板に形成された回路及
び搭載された素子を熱障害から保護できる。
According to a fourth aspect of the present invention, in addition to the effect of the first aspect, an auxiliary terminal is provided on the printed circuit board, and the auxiliary terminal is brought into contact with the terminal to be joined and fixed at the contact portion. By electrically connecting the circuit and the terminal,
Moreover, since the heating part at the time of bonding is localized, the body and the printed circuit board are fixed in a short time without raising the temperature of the printed circuit board, and the circuit formed on the printed circuit board and the mounted elements are heated. Can protect from obstacles.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1実施形態を示す側断面図である。FIG. 1 is a side sectional view showing a first embodiment of the present invention.

【図2】同上の正面図である。FIG. 2 is a front view of the same.

【図3】同上の斜視図である。FIG. 3 is a perspective view of the same.

【図4】本発明の第2実施形態を示す斜視図である。FIG. 4 is a perspective view showing a second embodiment of the present invention.

【図5】従来例を示す側断面図である。FIG. 5 is a side sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 ボディ 1a 内部 11 圧力導入管 11a 圧力導入管端面 11b 流入孔 12a 外部開口端 12b 大気導入孔 2 圧力センサチップ 3 プリント基板 3f 補助端子 4 端子 5 ワイヤ 6 カバー 7 シリコンゲル 8 実装基板 1 body 1a internal 11 pressure introduction pipe 11a pressure introduction pipe end face 11b inflow hole 12a external opening end 12b atmosphere introduction hole 2 pressure sensor chip 3 printed circuit board 3f auxiliary terminal 4 terminal 5 wire 6 cover 7 silicon gel 8 mounting substrate

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 カバーが覆設される樹脂製のボディと、
ボディの内部と外部とを連通し圧力測定対象である流体
が流入する圧力導入管と、ボディの内部で圧力導入管端
面に密着固定されて圧力を電気信号に変換する圧力セン
サチップと、ボディに装着されて圧力センサチップとワ
イヤボンディングでもって接続されるプリント基板と、
プリント基板に接続されてボディの外部に導出される端
子と、外部開口端からボディの内部に大気を導入する大
気導入孔と、を備え、端子が実装基板に実装され、流体
の圧力と大気との差圧に基づいて流体の圧力を測定する
圧力センサにおいて、 前記大気導入孔は、前記外部開口端が前記ボディに対し
前記実装基板と反対側に位置するように前記ボディに設
けられたことを特徴とする圧力センサ。
1. A resin body having a cover provided thereon,
A pressure introducing pipe that communicates the inside and outside of the body with the fluid to be measured flowing in, a pressure sensor chip that is tightly fixed inside the body to the end surface of the pressure introducing pipe and converts pressure into an electric signal, and A printed circuit board mounted and connected to the pressure sensor chip by wire bonding;
A terminal connected to the printed circuit board and led out to the outside of the body, and an atmosphere introduction hole for introducing the atmosphere into the body from the outer opening end are mounted on the mounting board, and the pressure of the fluid and the atmosphere. In the pressure sensor for measuring the pressure of the fluid based on the differential pressure, the atmosphere introducing hole is provided in the body so that the outer opening end is located on the side opposite to the mounting substrate with respect to the body. Characteristic pressure sensor.
【請求項2】 前記プリント基板がシリコンゲルでもっ
て被覆されたものであって、前記大気導入孔は筒状に形
成されプリント基板面から突出したことを特徴とする請
求項1記載の圧力センサ。
2. The pressure sensor according to claim 1, wherein the printed circuit board is covered with silicon gel, and the air introduction hole is formed in a cylindrical shape and protrudes from the surface of the printed circuit board.
【請求項3】 前記大気導入孔は前記ボディと一体形成
されてなることを特徴とする請求項2記載の圧力セン
サ。
3. The pressure sensor according to claim 2, wherein the atmosphere introducing hole is formed integrally with the body.
【請求項4】 前記端子と当接して接合固定される補助
端子が、前記プリント基板に設けられたことを特徴とす
る請求項1記載の圧力センサ。
4. The pressure sensor according to claim 1, wherein an auxiliary terminal that is brought into contact with and fixed to the terminal is provided on the printed circuit board.
JP33656195A 1995-12-25 1995-12-25 Pressure sensor Pending JPH09178596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33656195A JPH09178596A (en) 1995-12-25 1995-12-25 Pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33656195A JPH09178596A (en) 1995-12-25 1995-12-25 Pressure sensor

Publications (1)

Publication Number Publication Date
JPH09178596A true JPH09178596A (en) 1997-07-11

Family

ID=18300422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33656195A Pending JPH09178596A (en) 1995-12-25 1995-12-25 Pressure sensor

Country Status (1)

Country Link
JP (1) JPH09178596A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
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WO2013122141A1 (en) * 2012-02-16 2013-08-22 北陸電気工業株式会社 Pressure sensor module
JP2014209109A (en) * 2013-03-27 2014-11-06 北陸電気工業株式会社 Sensor module
WO2016204389A1 (en) * 2015-06-15 2016-12-22 주식회사 아이티엠반도체 Pressure sensor device and manufacturing method therefor
KR20160147504A (en) * 2015-06-15 2016-12-23 주식회사 아이티엠반도체 Pressure sensor device and method of fabricating the same
WO2017164549A1 (en) * 2016-03-23 2017-09-28 주식회사 아이티엠반도체 Pressure sensor apparatus and method for manufacturing pressure sensor apparatus and pressure sensor assembly
JP2019023594A (en) * 2017-07-25 2019-02-14 京セラ株式会社 Tire air pressure detection device
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013122141A1 (en) * 2012-02-16 2013-08-22 北陸電気工業株式会社 Pressure sensor module
CN104114990A (en) * 2012-02-16 2014-10-22 北陆电气工业株式会社 Pressure sensor module
KR20140127823A (en) * 2012-02-16 2014-11-04 호쿠리쿠 덴키 고교 가부시키가이샤 Pressure sensor module
JP2014209109A (en) * 2013-03-27 2014-11-06 北陸電気工業株式会社 Sensor module
US10648880B2 (en) 2015-06-15 2020-05-12 Itm Semiconductor Co., Ltd. Pressure sensor device and manufacturing method thereof
KR20160147504A (en) * 2015-06-15 2016-12-23 주식회사 아이티엠반도체 Pressure sensor device and method of fabricating the same
CN107820566A (en) * 2015-06-15 2018-03-20 Itm半导体有限公司 Pressure sensor apparatus and its manufacture method
WO2016204389A1 (en) * 2015-06-15 2016-12-22 주식회사 아이티엠반도체 Pressure sensor device and manufacturing method therefor
WO2017164549A1 (en) * 2016-03-23 2017-09-28 주식회사 아이티엠반도체 Pressure sensor apparatus and method for manufacturing pressure sensor apparatus and pressure sensor assembly
US10900855B2 (en) 2016-03-23 2021-01-26 Itm Semiconductor Co., Ltd. Pressure sensor apparatus and method for manufacturing pressure sensor apparatus and pressure sensor assembly
JP2019023594A (en) * 2017-07-25 2019-02-14 京セラ株式会社 Tire air pressure detection device
CN114459665A (en) * 2022-02-10 2022-05-10 南京沃天科技股份有限公司 Easily assemble differential pressure transmitter structure
CN114459665B (en) * 2022-02-10 2023-09-26 南京沃天科技股份有限公司 Differential pressure transmitter structure easy to assemble

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