JPS5645053A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5645053A
JPS5645053A JP12064479A JP12064479A JPS5645053A JP S5645053 A JPS5645053 A JP S5645053A JP 12064479 A JP12064479 A JP 12064479A JP 12064479 A JP12064479 A JP 12064479A JP S5645053 A JPS5645053 A JP S5645053A
Authority
JP
Japan
Prior art keywords
powders
alpha
impalpable
rays
impalpable powders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12064479A
Other languages
Japanese (ja)
Inventor
Hisayuki Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12064479A priority Critical patent/JPS5645053A/en
Publication of JPS5645053A publication Critical patent/JPS5645053A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent noise or misoperation by enclosing high purity impalpable powders containing no alpha-ray emitting substances in a package wherein the pakcage is protected from a semiconductor. CONSTITUTION:High purity is hardly emits alpha-rays and the amount of emission is below 10<-3> pieces/cm<2>/hr. Impalpable powders with the maximum diameter of 10mum or less are made by breaking the Si. The impalpable powders are accumulated on the upper part of a semiconductor element 3 at the height of 50mum or over and the impalpable powders are sealed with a ceramic cover 6. Then, all alpha-rays emitted from a ceramic package 1, the cover 6 and lead wires 2 are absorbed by the Si powders 5 and the alpha-rays will not reach the element 3. Therefore, noise and misoperation will be prevented. Furthermore, a leakage current will also be prevented by performing heat treatment for the Si powders and by forming an oxide thin film on the surface. Impalpable powders such as SiO2, Al2O3, C or the lime may be used in addition to Si.
JP12064479A 1979-09-21 1979-09-21 Semiconductor device Pending JPS5645053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12064479A JPS5645053A (en) 1979-09-21 1979-09-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12064479A JPS5645053A (en) 1979-09-21 1979-09-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5645053A true JPS5645053A (en) 1981-04-24

Family

ID=14791318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12064479A Pending JPS5645053A (en) 1979-09-21 1979-09-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5645053A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
FR2547113A1 (en) * 1983-06-03 1984-12-07 Inf Milit Spatiale Aeronaut ENCAPSULATION BOX FOR ELECTRONIC COMPONENT, CURED TO RADIATION
JPH04202555A (en) * 1990-11-30 1992-07-23 Toray Ind Inc Epoxy resin composition for sealing semiconductor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
FR2547113A1 (en) * 1983-06-03 1984-12-07 Inf Milit Spatiale Aeronaut ENCAPSULATION BOX FOR ELECTRONIC COMPONENT, CURED TO RADIATION
US4639826A (en) * 1983-06-03 1987-01-27 Compagnie D'informatique Militaire, Spatiale Et Aeronautique Radiation-hardened casing for an electronic component
JPH04202555A (en) * 1990-11-30 1992-07-23 Toray Ind Inc Epoxy resin composition for sealing semiconductor

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