JPS55165658A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55165658A
JPS55165658A JP7318279A JP7318279A JPS55165658A JP S55165658 A JPS55165658 A JP S55165658A JP 7318279 A JP7318279 A JP 7318279A JP 7318279 A JP7318279 A JP 7318279A JP S55165658 A JPS55165658 A JP S55165658A
Authority
JP
Japan
Prior art keywords
wiring board
radiator
stage
fitted
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7318279A
Other languages
Japanese (ja)
Other versions
JPS6142864B2 (en
Inventor
Norio Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7318279A priority Critical patent/JPS55165658A/en
Publication of JPS55165658A publication Critical patent/JPS55165658A/en
Publication of JPS6142864B2 publication Critical patent/JPS6142864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PURPOSE:To obtain a device which has a high effect of heat radiation, by fitting the opening of a multilayer wiring board on the peripheral surface of the lower end of a radiator which has radiation fins and is hermetically filled with CF4 afterwards and by placing a metal die stage on the wiring board whose obverse side is located on the board and whose reverse side is fixed with a semiconductor unit. CONSTITUTION:An opening provided in the central part of a multilayer wiring board 9 made of ceramic is fitted on the peripheral surface of the lower end of a hollow radiator which has numerous radiation fins on the peripheral part. A circular opening is provided in the center of a chip carrier 2, in which a semiconductor element 1 is housed. A metal die stage 4, which is made of Mo and holds the element 1 on the reverse side of the stage, is fitted on the central part of the chip carrier. The carrier 2 is fixed on the bottom of the wiring board 9 by a brazing material so that the obverse side of the stage 4 is located in the eopning of the hollow radiator 10. The element 1 is connected to the wiring board 9 by wires 3, conductors 5, etc. A lid 6 is fitted on the bottom of the carrier 2. CF4 is hermetically filled in the radiator 10 including a gap 9' around the stage 4. The top 13 of the radiator is welded to seal it up.
JP7318279A 1979-06-11 1979-06-11 Semiconductor device Granted JPS55165658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7318279A JPS55165658A (en) 1979-06-11 1979-06-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7318279A JPS55165658A (en) 1979-06-11 1979-06-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55165658A true JPS55165658A (en) 1980-12-24
JPS6142864B2 JPS6142864B2 (en) 1986-09-24

Family

ID=13510733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7318279A Granted JPS55165658A (en) 1979-06-11 1979-06-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55165658A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604827A1 (en) * 1986-10-06 1988-04-08 Alsthom Vaporisation cooling device for power semiconductors
GB2380057A (en) * 2001-09-19 2003-03-26 Thermosonic Technology Inc Heat dissipation structure with cavity for improved heat transfer
WO2006049768A1 (en) * 2004-10-29 2006-05-11 3M Innovative Properties Company Immersion cooling apparatus
US7053482B2 (en) * 2002-05-27 2006-05-30 Samsung Electro-Mechanics Co., Ltd. Ceramic package with radiating lid
US7755186B2 (en) * 2007-12-31 2010-07-13 Intel Corporation Cooling solutions for die-down integrated circuit packages
JP2014013808A (en) * 2012-07-04 2014-01-23 Mitsubishi Electric Corp Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135579A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Liquid sealing semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135579A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Liquid sealing semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604827A1 (en) * 1986-10-06 1988-04-08 Alsthom Vaporisation cooling device for power semiconductors
GB2380057A (en) * 2001-09-19 2003-03-26 Thermosonic Technology Inc Heat dissipation structure with cavity for improved heat transfer
US7053482B2 (en) * 2002-05-27 2006-05-30 Samsung Electro-Mechanics Co., Ltd. Ceramic package with radiating lid
WO2006049768A1 (en) * 2004-10-29 2006-05-11 3M Innovative Properties Company Immersion cooling apparatus
US7755186B2 (en) * 2007-12-31 2010-07-13 Intel Corporation Cooling solutions for die-down integrated circuit packages
JP2014013808A (en) * 2012-07-04 2014-01-23 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6142864B2 (en) 1986-09-24

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