GB2380057A - Heat dissipation structure with cavity for improved heat transfer - Google Patents
Heat dissipation structure with cavity for improved heat transfer Download PDFInfo
- Publication number
- GB2380057A GB2380057A GB0122575A GB0122575A GB2380057A GB 2380057 A GB2380057 A GB 2380057A GB 0122575 A GB0122575 A GB 0122575A GB 0122575 A GB0122575 A GB 0122575A GB 2380057 A GB2380057 A GB 2380057A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cpu
- cavity
- heat dissipation
- heat transfer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000006185 dispersion Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat dissipation structure (100) for a CPU comprises fins (102) and a central cavity (110) which is mounted over the centre of the CPU. The cavity is filled with a high heat transfer material and sealed by top and bottom blocks (200, 201). The central high heat transfer region improves the conductance of heat away from the CPU towards the fins. The high heat transfer material may be copper or a liquid or gas partially filling the cavity to allow for expansion. The central cavity walls may be slotted (110A) to further improve the heat transfer from the cavity to the fins.
Description
<Desc/Clms Page number 1>
TITLE OF THE INVENTION
AN IMPROVED STRUCTURE OF HEAT DISSIPATION FIN FOR
CPU
BACKGROUND OF THE INVENTION (a) Field of the Invention
The present invention relates to heat dissipation fin, and in particular, an improved structure of heat dissipation fin having a cavity to adapt a high heat material to provide rapid heat dissipation from a CPU.
(b) Description of the Prior Art
Conventionally, a heat dissipation fin is mounted onto the top of the CPU to dissipate heat in order to avoid over heating of the CPU. This structure is normally a flat surface made of a single type of heat transfer material mounted to the CPU and a plurality of branched fins are provided thereto.
Due to the fast development of new material, a CPU can be made into a smaller size with high speed operation. However, the CPU will also more heat that to be dissipated so that the CPU can operate normally. As a result, the heat fins have to be enlarged in order to dissipate heat. But the enlarge of the fins will increase the heat transfer material and the cost of production will increase.
<Desc/Clms Page number 2>
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide an improved structure of heat dissipation fin for CPU, which can mitigate the drawback due to increase of production cost.
Yet another object of the present invention is to provide an improved structure of heat dissipation fins for CPU, characterized in that the center of the interior close to the bottom end of the heat dissipation fin is provided with a cavity having the top, bottom end sealed enclosing a high heat transfer material, and the surrounding shape of the heat transfer material is completely sealed with the cavity wall such that the CPU heat dissipation fin uses some high heat transfer material directly adjacent to the CPU heat accumulated center to absorb excessive temperature of the CPU and to transfer the heat energy to the surrounding heat dissipation branched fins for dispersion.
A further object of the present invention is to provide an improved structure of heat dissipation fin for CPU, the cavity wall is made into a plurality of slots, and the shape of the heat transfer material is a plurality of protruded structures corresponding to the
<Desc/Clms Page number 3>
slots such that the contact surface area between the cavity wall and the heat transfer material is extended.
Yet another object of the present invention is to provide an improved structure of heat dissipation fin for CPU, the filled material is a gas which is high heat energy absorbing.
Other object and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawing.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a perspective view of an improved structure of heat dissipation fin for CPU of the present invention.
Fig. 2 is a perspective exploded view of an improved structure of heat dissipation fin for CPU of the present invention.
Fig. 3 is a top view of an improved structure of heat dissipation fin for CPU of the present invention.
Fig. 4 is a sectional view of an improved structure of heat dissipation fin for CPU of the present invention.
<Desc/Clms Page number 4>
Figs. 5 to 7 are sectional views of an improved structure of heat dissipation fin for CPU of the present invention.
Fig. 8 is an exploded perspective view of another preferred embodiment in accordance with the present invention.
DETAILED DESCRIPTION OF THE PRESENT INVENTION
Fig. 1 is a perspective view of an improved structure of heat dissipation fin for CPU of the present invention. Referring to Figs.
2 and 3, there is shown an improved heat dissipation fin 100 structure having a bottom end mounted closely to the flat surface of the CPU, and the surrounding thereof being a plurality of heat dissipation branched fins 101,102 so as to extend large surface of heat dissipation for the CPU (referring to Figs. 4 to 7). The enlarged heat dissipation surface provides efficient heat dissipation by having a high heat transfer material 120 or 121 mounted in a cavity formed at the interior at the center of the fins and covered with a covering blocks 200,201. The surround shape of the high heat transfer material 120 is sealed with the inner wall of the cavity 110 such that the high heat transfer
<Desc/Clms Page number 5>
material 120 is directly adjacent to the heat concentration center of the CPU.
The sealed fins 100, after polishing of the surface, are shown in Fig. 1, and the entire heat transfer material will not be exposed beyond the cavity 100. In accordance with the present invention, a circular soldered sealed slit 100A can be seen. The heat transfer material 121 such as a copper is filled into the cavity 110, the surrounding of the material 121 can engage with the cavity 110 inner wall such that the filled heat transfer material 121 will not be dislocated even without the covering blocks 200, 201. The top and bottom of the cavity 110 are sealed such that the heat transfer material 121 will not be dislocated.
Referring to Figs. 4 to 7, there is shown the formation of a high heat transfer material 120 into the cavity 110 of the fins 100. As shown in Fig. 4, the heat transfer material 121 is closely engaged to the cavity 110. The bottom of the material 121 is flatly adhered to the surface of the CPU 300 and the heat of the CPU is released. As shown in Fig. 5, the filled material is a solid material 120 (or a liquid state material heated to become solid wax). Covering blocks 200,201 are used to seal at the top and bottom of the cavity 110 such that the heat transfer material 120 will not be dislocated from the cavity 110. As shown in Fig. 6,
<Desc/Clms Page number 6>
the filled material of the cavity 110 is a liquid (alcohol, or water) and the cavity 110 is not fully filled but left a space 112 for expansion. The change of liquid state of the alcohol to gaseous state will rapidly absorb heat of the CPU 300 from the heat dissipation fins 100. The heated vapour of the cavity 110 raises and condenses at the branched fins 101,102 and flows back to the bottom of the cavity. This will rapidly dissipate heat energy.
Referring to Fig. 6 the filled material 120 of the cavity 110 is high heat absorbing material, therefore, heat from the CPU 300 at the bottom of the heat dissipation fins 100 is released.
Fig. 8 is another preferred embodiment of the present invention. The surrounding inner wall of the cavity 110 is made into a plurality of teeth-like slots 11 OA, 11 OB, and the solid high heat transfer material 120 is filled into the cavity 110. The teethlike slots 110A, 11 OB are in combination with the protrusions 120A, 120B at the surface of the transfer material 1 20 to provide a heat dissipation surface so as to increase the heat dissipation from the inner wall of the cavity to the outside.
While the invention has been described with respect to preferred embodiment, it will be clear to those skilled in the art that modifications and improvements may be made to the invention without departing from the spirit and scope of the invention. Therefore, the invention is not to be limited by the
<Desc/Clms Page number 7>
specific illustrative embodiment, but only by the scope of the appended claims.
Claims (3)
- CLAIMS 1. An improved structure of heat dissipation fins for CPU, characterized in that the center of the interior close to the bottom end of the heat dissipation fin is provided with a cavity having the top, bottom end sealed enclosing a high heat transfer material, and the surrounding shape of the heat transfer material is completely sealed with the cavity wall such that the CPU heat dissipation fin uses some high heat transfer material directly adjacent to the CPU heat accumulated center to absorb excessive temperature of the CPU and to transfer the heat energy to the surrounding heat dissipation branched fins for dispersion.2. An improved structure of heat dissipation fins for CPU as set forth in Claim 1, wherein the cavity wall is made into a plurality of slots, and the shape of the heat transfer material is a plurality of protruded structures corresponding to the slots such that the contact surface area between the cavity wall and the heat transfer material is extended.
- 2. An improved structure of heat dissipation fins for CPU as set forth in Claim 1 or 2, wherein the filled material within the cavity is a liquid and is partially filled the cavity to allow liquid expansion.<Desc/Clms Page number 9>
- 3. An improved structure of heat dissipation fins for CPU as set forth in Claim 1 or 2, wherein the filled material is a gas which is high heat energy absorbing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0122575A GB2380057A (en) | 2001-09-19 | 2001-09-19 | Heat dissipation structure with cavity for improved heat transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0122575A GB2380057A (en) | 2001-09-19 | 2001-09-19 | Heat dissipation structure with cavity for improved heat transfer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0122575D0 GB0122575D0 (en) | 2001-11-07 |
| GB2380057A true GB2380057A (en) | 2003-03-26 |
Family
ID=9922332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0122575A Withdrawn GB2380057A (en) | 2001-09-19 | 2001-09-19 | Heat dissipation structure with cavity for improved heat transfer |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2380057A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021123731A1 (en) | 2021-09-14 | 2023-03-16 | TDK Europe GmbH | Electrical component with improved cooling and corresponding module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB804297A (en) * | 1956-08-11 | 1958-11-12 | Bbc Brown Boveri & Cie | Improvements in or relating to cooling means for semi-conductor elements |
| JPS55165658A (en) * | 1979-06-11 | 1980-12-24 | Fujitsu Ltd | Semiconductor device |
| EP0268081A1 (en) * | 1986-10-29 | 1988-05-25 | BBC Brown Boveri AG | Cooling device for semiconductor components |
| JPH05218250A (en) * | 1992-02-06 | 1993-08-27 | Mitsubishi Heavy Ind Ltd | Heat dissipating apparatus with variable heat transfer rate |
| JPH0917920A (en) * | 1995-06-30 | 1997-01-17 | Riyoosan:Kk | Semiconductor element cooling heat sink |
-
2001
- 2001-09-19 GB GB0122575A patent/GB2380057A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB804297A (en) * | 1956-08-11 | 1958-11-12 | Bbc Brown Boveri & Cie | Improvements in or relating to cooling means for semi-conductor elements |
| JPS55165658A (en) * | 1979-06-11 | 1980-12-24 | Fujitsu Ltd | Semiconductor device |
| EP0268081A1 (en) * | 1986-10-29 | 1988-05-25 | BBC Brown Boveri AG | Cooling device for semiconductor components |
| JPH05218250A (en) * | 1992-02-06 | 1993-08-27 | Mitsubishi Heavy Ind Ltd | Heat dissipating apparatus with variable heat transfer rate |
| JPH0917920A (en) * | 1995-06-30 | 1997-01-17 | Riyoosan:Kk | Semiconductor element cooling heat sink |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021123731A1 (en) | 2021-09-14 | 2023-03-16 | TDK Europe GmbH | Electrical component with improved cooling and corresponding module |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0122575D0 (en) | 2001-11-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |