CN216218321U

CN216218321U - Electronic device

Info

Publication number: CN216218321U
Application number: CN202121667739.XU
Authority: CN
Inventors: 刘振武; 蔡唯佳
Original assignee: Shenzhen Megmeet Electrical Co Ltd
Current assignee: Shenzhen Megmeet Electrical Co Ltd
Priority date: 2021-07-21
Filing date: 2021-07-21
Publication date: 2022-04-05
Anticipated expiration: 2031-07-21

Abstract

The embodiment of the utility model relates to the technical field of heat dissipation, in particular to electronic equipment. The electronic device includes: casing, circuit component and radiator unit. Wherein the circuit assembly is accommodated in the shell. The heat dissipation assembly is connected with the circuit assembly, the shell is provided with heat dissipation holes, and at least part of the heat dissipation assembly extends into the heat dissipation holes. Heating element spare is connected to radiator unit one end, and the louvre extends out to one end, directly conducts the heat that heating element spare produced in the outside air. That is, this application embodiment has improved the present situation that present electronic equipment heat dispersion is not enough.

Description

Electronic device

Technical Field

The embodiment of the utility model relates to the technical field of heat dissipation, in particular to electronic equipment.

Background

Electronic equipment often adopts the mode heat dissipation of pasting the fin on heating devices such as circuit subassembly, if electronic equipment's radiating effect is not good, can lead to problems such as electronic components overheat protection, performance degradation, material thermal ageing and equipment life reduction. The heat conduction mode of the patch heat dissipation mode is as follows: the heat is conducted from the heating device to the radiating fins, conducted from the radiating fins to the air in the shell, conducted to the shell through the air and finally dissipated to the outside; or heat is conducted from the heat generating device to the heat sink, from the heat sink to the housing, and then to the air.

The inventor of the utility model finds out that: because the radiating fin is located inside the shell, heat generated by long-time work of the electronic equipment is still gathered in the shell, and the radiating effect of the radiating fin is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an electronic device to improve the heat dissipation performance of the electronic device.

The utility model adopts a technical scheme that: provided is an electronic device including: casing, circuit component and radiator unit. Wherein the circuit assembly is accommodated in the shell. The heat dissipation assembly is connected with the circuit assembly, the shell is provided with heat dissipation holes, and at least part of the heat dissipation assembly extends into the heat dissipation holes.

Optionally, the heat sink assembly comprises a heat sink comprising a base and a heat sink module. The base is connected with the circuit assembly. The radiating fin module comprises at least one radiating fin, one end of the radiating fin is arranged on the base part, and the other end of the radiating fin extends out of the shell through the radiating hole.

Optionally, the heat sink module includes a plurality of heat sinks, and the plurality of heat sinks are arranged at intervals along a first preset direction.

Optionally, the heat sink includes a plurality of heat sink modules, and the plurality of heat sink modules are arranged at intervals along a second preset direction. The second preset direction is intersected with the first preset direction.

Optionally, the circuit assembly includes a circuit board and a radio frequency component, and the radio frequency component is mounted on the circuit board. The heat dissipation assembly is connected with the radio frequency element.

Optionally, the radio frequency component is mounted on a side of the circuit board away from the heat sink, and the circuit board is provided with a heat dissipation through hole corresponding to the radio frequency component. The radiating assembly is connected with one side, facing the radiating through hole, of the radio frequency element.

Optionally, the heat dissipation assembly further comprises a heat conducting medium. The heat conducting medium is filled in the heat dissipation through hole and is respectively connected with the radio frequency element and the radiator.

Optionally, a side of the heat conducting medium facing the heat sink protrudes out of the circuit board.

Optionally, the heat conducting medium is heat conducting cement.

Optionally, the electronic device is a radio frequency device.

The beneficial effects of the embodiment of the application are as follows:

an electronic device provided in an embodiment of the present application includes: casing, circuit component and radiator unit. Wherein the circuit assembly is accommodated in the shell. The heat dissipation assembly is connected with the circuit assembly, the shell is provided with heat dissipation holes, and at least part of the heat dissipation assembly extends into the heat dissipation holes.

The shell is provided with heat dissipation holes, one end of the heat dissipation assembly is connected with the heating component, and the other end of the heat dissipation assembly extends out of the heat dissipation holes to directly conduct heat generated by the heating component to outside air. That is, the heat dissipation performance of the electronic device is improved.

Drawings

To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly describe the embodiments. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present invention.

Fig. 2 is an exploded view of the electronic device of fig. 1.

Fig. 3 is a schematic diagram of a heat sink in the electronic device of fig. 2.

Detailed Description

In order to facilitate an understanding of the utility model, the utility model is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like as used herein are for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, the technical features mentioned in the different embodiments of the utility model described below can be combined with each other as long as they do not conflict with each other.

Referring to fig. 1 and fig. 2, which respectively show a perspective view and an exploded view of an electronic device 1, the electronic device 1 includes a housing 100, a circuit assembly 200, and a heat dissipation assembly 300. Wherein, the circuit assembly 200 is accommodated in the housing 100; the heat dissipation assembly 300 is connected to the circuit assembly 200, the housing 100 has a heat dissipation hole 101, and at least a portion of the heat dissipation assembly 300 extends into the heat dissipation hole 101. The circuit assembly 200 generates a large amount of heat in an operating state, and since the heat sink assembly 300 is directly connected to the circuit assembly 200, the heat is directly transferred from the circuit assembly 200 to the heat sink assembly 300. Meanwhile, the housing 100 is provided with the heat dissipation hole 101, and one side of the heat dissipation assembly 300 away from the circuit assembly 200 is exposed to the external atmosphere environment of the housing 100 to be exposed, so that heat is conducted to the external air, and the effect of dissipating heat of the electronic device 1 is achieved indirectly by air cooling. Next, taking the electronic device as a radio frequency device as an example, a specific structure of the electronic device 1 will be described, in which the circuit components include a circuit board and a radio frequency element, for example, the electronic device may be a wireless network card or a wireless bluetooth device; however, it should be understood that in other embodiments of the present application, the electronic device may be a shaver, a cleaning robot, or other electronic devices.

Referring to fig. 1 and 2, the housing 100 has a cavity therein for accommodating the circuit assembly 200 and the heat sink assembly 300. The housing 100 is further provided with a heat dissipation hole 101, and the heat dissipation hole 101 is communicated with the accommodating cavity; optionally, the heat dissipation hole 101 is located at the top of the circuit assembly 200, so that the distance between the heat dissipation hole 101 and the circuit assembly 200 is shorter, and further the length of the heat dissipation assembly 300 inside the housing 100 is reduced, thereby reducing the heat remaining inside the housing 100. Meanwhile, as for the heat remaining in the case 100 or the heat of the electronic device 1 to be dissipated into the air in the case, it is preferable to provide a large number of vent holes in the case 100 to enhance the air communication. Furthermore, the casing 100 may be made of a material with high thermal conductivity, such as metal, so as to enhance the heat exchange between the casing and the outside air.

Referring to fig. 2, the circuit assembly 200 includes a circuit board 210 and an rf component 220. The circuit board 210 is disposed facing the heat dissipation hole 101, and is connected to the rf component 220, and is used for performing command control on the rf component 220 so that the rf component 220 operates in a timely manner. The rf element 220 has a function of transmitting and receiving electromagnetic waves, is disposed on a side of the circuit board 210 facing away from the heat sink 310, and is connected to the circuit board 210. The rf component 220 is the primary source of heat during operation of the circuit assembly 200. The circuit board 210 is provided with a heat dissipating through hole 211 corresponding to the rf component 220, and the heat dissipating assembly 300 is connected to a side of the rf component 220 facing the heat dissipating through hole 211, so that heat generated by the rf component 220 can be transferred to the heat dissipating assembly 300 through the heat dissipating through hole 211.

Referring to the heat dissipation assembly 300, specifically to fig. 2 and 3, the heat dissipation assembly 300 includes a heat sink 310 and a heat conducting medium 320. The heat-conducting medium 320 has a good heat-conducting efficiency and uniformly absorbs heat of the circuit assembly 200. Preferably, the heat transfer medium 320 is heat transfer cement. The heat conducting medium 320 is filled in the heat dissipating through hole 211 and is connected to the rf device 220 and the heat sink 310, respectively. In order to make the heat conducting medium completely contact with the heat sink 310 and further improve the heat conducting effect, one side of the heat conducting medium 320 facing the heat sink 310 extends out of the circuit board 210; accordingly, the heat sink 310 is mounted to the circuit board 210 and may conveniently directly contact the heat transfer medium 320. It is understood that in other embodiments of the present application, the heat conducting medium may also be heat conducting silicone grease, phase change medium, or other high heat conductivity medium. In addition, in some cases, the heat-conducting medium may be omitted; accordingly, the heat sink 310 may be directly connected to the radio frequency components.

Specifically, the heat sink 310 includes a base 311 and a fin module 312. Wherein, the base 311 is connected and fixed with the circuit assembly 200; the heat sink module 312 includes at least one heat sink, one end of which is mounted on the base 311, and the other end of which extends out of the housing 101 through the heat dissipation hole 101. More specifically, the base 311 is mounted on a side of the circuit board 210 facing the heat dissipation hole 101, and is in contact with the heat conductive medium 320; preferably, the end surface of the base 311 facing the circuit assembly 200 completely covers the area filled with the heat transfer medium 320, thereby making the heat transfer more efficient.

In this embodiment, the heat sink module 312 includes a plurality of heat sinks, which are disposed at intervals along the first predetermined direction X; of course, in other embodiments of the present application, the heat sink module 312 may include only one heat sink. Optionally, the heights of the fins in the fin module 312 sequentially increase along the first preset direction X. Therefore, when external air flow flows to the highest radiating fin along the radiating fin with the lowest height, the air flow can take away heat of all the radiating fins, and therefore the radiating effect of the radiating assembly under the application scene is improved. On the contrary, if the heights of the fins in the fin module 312 are the same, the airflow can only take away most of the heat of the front fin, the heat of the rear fins can only take away a small portion of the heat, the heat of the middle fins is gathered inside, the air inside is difficult to flow, and a better heat dissipation effect cannot be achieved. Further optionally, the heat sink 310 includes a plurality of heat sink modules 312, and the plurality of heat sink modules 312 are disposed at intervals along the second predetermined direction Y. The second predetermined direction Y is a direction intersecting the first predetermined direction X, and in this embodiment, is perpendicular to the first predetermined direction X; of course, in other embodiments, the second predetermined direction Y and the first predetermined direction X may have other included angles. By increasing the number of the heat sink modules 312, the overall heat dissipation effect of the heat sink 310 can be effectively improved. The molding manner between the base 311 and the heat sink module 312 is various, and the two may be integrally molded, or fixed by welding, inserting, etc., and the present application does not limit the two.

It should be noted that the heat sink in this embodiment is a column structure with a square cross section, and has a pair of wide side walls and a pair of narrow side walls. Wherein, along the direction perpendicular to the wide side wall, a first interval is arranged between two adjacent radiating fins; a second distance is reserved between two adjacent radiating fins along the direction vertical to the narrow side wall; the first pitch is greater than the second pitch. The purpose of this design is that the heat dissipated from the air by the wide sidewalls is greater than the heat dissipated from the air by the narrow sidewalls, and thus, the corresponding wide sidewall spacing should be greater than the corresponding narrow sidewall spacing. Of course, the heat sink may also be in the shape of a cylindrical diamond or a cylinder, and the heat dissipation effect can be achieved as well.

The top of the radiating fin is provided with an inclined plane which is in fillet transition with the side wall of the radiating fin. The design of the inclined plane enlarges the contact area of the radiating fins and air, and further optimizes the radiating effect.

Furthermore, even if the arrangement of the heat dissipation fins in the present embodiment is arranged along the linear array as described above, the present application is not limited thereto; in other embodiments, the heat sink module 312 may also have a plurality of heat sinks arranged in a circumferential array around the center of the base 311. The heat sink 310 with the heat dissipation fins arranged thereon can also act on the electronic device 1, and can achieve good heat dissipation effect.

An electronic device 1 provided by the embodiment of the application comprises a shell, a circuit component and a heat dissipation component. Wherein the circuit assembly is accommodated in the shell. The heat dissipation assembly is connected with the circuit assembly, the shell is provided with heat dissipation holes, and at least part of the heat dissipation assembly extends into the heat dissipation holes.

The shell is provided with heat dissipation holes, one end of the heat dissipation assembly is connected with the heating component, and the other end of the heat dissipation assembly extends out of the heat dissipation holes to directly conduct heat generated by the heating component to outside air. That is, the embodiment of the present application improves the technical problem that the heat dissipation performance of the electronic device 1 is insufficient.

It should be noted that the description of the present invention and the accompanying drawings illustrate preferred embodiments of the present invention, but the present invention may be embodied in many different forms and is not limited to the embodiments described in the present specification, which are provided as additional limitations to the present invention and to provide a more thorough understanding of the present disclosure. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the utility model as defined by the appended claims.

Claims

1. An electronic device, comprising:

a housing;

a circuit assembly housed in the housing; and

the heat dissipation assembly is connected with the circuit assembly, the shell is provided with heat dissipation holes, and at least part of the heat dissipation assembly extends into the heat dissipation holes;

the heat dissipation assembly comprises a heat sink comprising a base and a heat sink module;

the base is connected with the circuit assembly;

the radiating fin module comprises at least one radiating fin, one end of the radiating fin is arranged on the base part, and the other end of the radiating fin extends out of the shell through the radiating hole;

the radiating fin module comprises a plurality of radiating fins which are arranged at intervals along a first preset direction, and the heights of the radiating fins are sequentially increased along the first preset direction.

2. The electronic device of claim 1, wherein the heat sink comprises a plurality of heat sink modules spaced apart along a second predetermined direction;

the second preset direction is intersected with the first preset direction.

3. The electronic device of claim 2, wherein the circuit assembly includes a circuit board and a radio frequency component mounted to the circuit board;

the heat dissipation assembly is connected with the radio frequency element.

4. The electronic device of claim 3, wherein the radio frequency component is mounted on a side of the circuit board away from the heat sink, and the circuit board is provided with a heat dissipation through hole corresponding to the radio frequency component;

the radiating assembly is connected with one side, facing the radiating through hole, of the radio frequency element.

5. The electronic device of claim 4, wherein the heat dissipation assembly further comprises a thermally conductive medium;

the heat conducting medium is filled in the heat dissipation through hole and is respectively connected with the radio frequency element and the radiator.

6. The electronic device of claim 5, wherein a side of the heat conducting medium facing the heat sink protrudes out of the circuit board.

7. The electronic device of claim 6, wherein the heat-conducting medium is a heat-conducting cement.

8. The electronic device of claim 1, wherein the electronic device is a radio frequency device.