CN211669610U

CN211669610U - Intelligent device heat abstractor

Info

Publication number: CN211669610U
Application number: CN202020631628.2U
Authority: CN
Inventors: 黄发源; 李紫彪
Original assignee: Shenzhen Mygt Co ltd
Current assignee: Shenzhen Mygt Co ltd
Priority date: 2020-04-23
Filing date: 2020-04-23
Publication date: 2020-10-13
Anticipated expiration: 2030-04-23

Abstract

The utility model provides an intelligent equipment heat dissipation device, which comprises a semiconductor thermoelectric refrigeration sheet, a radiator, a fan and a main control board; the semiconductor thermoelectric refrigeration piece is installed the bottom surface of radiator and with the bottom surface laminating of radiator, set up a plurality of heat dissipation strips that upwards extend around the radiator top surface, the top of heat dissipation strip sets up the slot, the fan sets up a plurality of in the space that the heat dissipation strip encloses, the main control board with the semiconductor thermoelectric refrigeration piece with the fan electricity is connected. This smart machine heat abstractor radiating efficiency is high.

Description

Intelligent device heat abstractor

Technical Field

The utility model relates to an intelligent equipment heat abstractor belongs to thermal equipment technical field.

Background

Along with the development of smart devices, such as smart phones, tablet computers and the like, games, videos and the like are applied to the smart devices more and more frequently, the applications enable smart chips in the smart devices to generate a large amount of heat, the smart devices are enabled to generate heat for a long time, the performance of the smart devices is reduced, and meanwhile safety problems can be caused. At present, the problem of heating of the intelligent equipment is mainly solved by means of the fan heat dissipation device, but the cooling effect of the fan heat dissipation device is poor, the continuous cooling time is short, and the problem of heating of the intelligent equipment cannot be well solved.

SUMMERY OF THE UTILITY MODEL

The utility model provides an intelligent equipment heat abstractor can effectively solve above-mentioned problem.

The utility model discloses a realize like this:

the utility model provides an intelligent equipment heat dissipation device, which comprises a semiconductor thermoelectric refrigeration sheet, a radiator, a fan and a main control board;

the semiconductor thermoelectric refrigeration piece is installed the bottom surface of radiator and with the bottom surface laminating of radiator, set up a plurality of heat dissipation strips that upwards extend around the radiator top surface, the top of heat dissipation strip sets up the slot, the fan sets up a plurality of in the space that the heat dissipation strip encloses, the main control board with the semiconductor thermoelectric refrigeration piece with the fan electricity is connected.

As a further improvement, the device also comprises a bottom shell and a top shell;

the top shell is installed on the upper surface of the bottom shell to form an installation cavity; the front side and the rear side of the mounting cavity are protruded outwards to form bulges, and the bulges are provided with ventilation openings; the radiator and the semiconductor thermoelectric refrigerating sheet are accommodated in the mounting cavity, and radiating strips on the front side and the rear side of the top surface of the radiator extend out of the ventilation opening; the semiconductor thermoelectric refrigerating sheet is arranged in the groove, and the bottom surface of the bottom shell is flat.

As a further improvement, the bottom shell further comprises a heat conducting sheet arranged on the bottom surface of the bottom shell.

As a further improvement, a heat-conducting silica gel pad is further arranged on the bottom surface of the heat-conducting fin.

As a further improvement, the main control board is also accommodated in the mounting cavity and disposed on one end of the heat sink.

As a further improvement, both side surfaces of the top shell are provided with movable clamping jaws, and the movable clamping jaws are connected to the side surfaces of the top shell through springs.

As a further improvement, a plurality of transverse convex teeth are arranged on the inner surface of the clamping end of the movable clamping jaw.

As a further improvement, the top surface of the top shell is provided with heat dissipation holes at positions opposite to the fan.

As a further improvement, the heat conducting sheet is a copper foil heat conducting sheet.

As a further improvement, the semiconductor thermoelectric cooling plate is in a cuboid shape.

The utility model has the advantages that:

the utility model discloses an intelligent equipment heat abstractor adopts semiconductor thermoelectric refrigeration piece, can produce a low temperature face and a high temperature face, and its bottom surface is the low temperature face, and its top surface is the high temperature face, and the low temperature face of semiconductor thermoelectric refrigeration piece hugs closely intelligent equipment, because they have a great difference in temperature, very easily conducts the heat of intelligent equipment to semiconductor thermoelectric refrigeration piece; on the other hand, the radiator is hugged closely to the high temperature face of semiconductor thermoelectric refrigeration piece, because the radiator is equipped with the heat dissipation strip, has enough big heat radiating area, the fan sets up in the space that the heat dissipation strip encloses, the fan can the fast convection current air, can high-efficient, conduct away smart machine's heat fast, realizes dispelling the heat extremely high-efficiently, has overcome traditional fan heat abstractor's cooling effect poor and the short problem of continuous cooling time.

The utility model discloses a smart machine heat abstractor's activity jack catch passes through the spring coupling and is in on the side of epitheca, the spring can stretch, can adapt to the smart machine of equidimension not, and the commonality is strong.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is one of the overall structural schematic diagrams of the heat dissipation device for smart devices provided by the embodiments of the present invention.

Fig. 2 is a second schematic view of the overall structure of the heat dissipation device for smart devices according to the embodiment of the present invention.

Fig. 3 is an exploded view of the overall structure of the heat dissipation device for smart devices provided by the embodiments of the present invention.

Reference numerals:

the bottom shell 1, the groove 11,

a top case 2, a protrusion 21, a vent 22, a heat radiation hole 23,

the semiconductor thermoelectric cooling plate 3 is provided with a plurality of cooling holes,

the heat sink 4, the heat dissipation bars 41, the grooves 42,

the fan (5) is provided with a fan,

the main control board 6 is provided with a plurality of main control boards,

the heat-conducting fins 7 are formed on the outer surface of the heat-conducting plate,

a heat-conducting silicone rubber pad 8 is arranged on the upper surface of the base,

movable jaw 9, spring 91 and transverse convex tooth 92.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to 3, the utility model provides a heat dissipation device for intelligent equipment, which comprises a semiconductor thermoelectric refrigerating sheet 3, a radiator 4, a fan 5 and a main control board 6.

Semiconductor thermoelectric refrigeration piece 3 is installed the bottom surface of radiator 4 and with the bottom surface laminating of radiator 4, set up a plurality of radiating strips 41 that upwards extend around the top surface of radiator 4, the top of radiating strip 41 sets up slot 42, slot 42 has increaseed radiating area of radiating strip 41 has improved the radiating efficiency.

The fan 5 is disposed in a space surrounded by the plurality of heat dissipation strips 41, and can quickly blow out heat dissipated by the heat sink 4.

The main control board 6 is electrically connected with the semiconductor thermoelectric refrigerating sheet 3 and the fan 5.

The utility model discloses smart machine heat abstractor hugs closely smart machine when using on the semiconductor thermoelectric refrigeration piece 3. The semiconductor thermoelectric refrigerating piece 3 can generate a low-temperature surface and a high-temperature surface, the low-temperature surface and the high-temperature surface form a 30-degree temperature difference, the low-temperature surface of the semiconductor thermoelectric refrigerating piece 3 is tightly attached to the intelligent equipment, and the low-temperature surface and the high-temperature surface have a larger temperature difference, so that the heat of the intelligent equipment is easily conducted to the semiconductor thermoelectric refrigerating piece 3; on the other hand, radiator 4 is hugged closely to the high temperature face of semiconductor thermoelectric refrigeration piece 3, because radiator 4 is equipped with heat dissipation strip 41, has enough big heat radiating area, fan 5 sets up in the space that heat dissipation strip 41 encloses, fan 5 can the quick convection current air, can go out the heat high efficiency of smart machine, conduct fast, realizes dispelling the heat extremely high-efficiently.

As a further improvement, the utility model discloses smart machine heat abstractor still includes a drain pan 1, a top shell 2.

The top shell 2 is mounted on the upper surface of the bottom shell 1 to form a mounting cavity; the front side and the rear side of the mounting cavity protrude outwards to form a bulge 21, and the bulge 21 is provided with a vent 22. The radiator 4 and the semiconductor thermoelectric refrigerating sheet 3 are both arranged in the installation cavity. And a groove 11 is formed in the center of the top surface of the bottom shell 1 and used for accommodating the semiconductor thermoelectric refrigerating sheet 3. The bottom surface of the bottom shell 1 is flat, and is suitable for various intelligent devices, such as smart phones, tablet computers and the like.

The radiator 4 is arranged on the top surface of the bottom shell 1 and accommodated in the installation cavity, the bottom surface of the radiator is attached to the upper surface of the semiconductor thermoelectric refrigerating sheet 3, a plurality of radiating strips 41 perpendicular to the top surface of the radiator are arranged on the periphery of the top surface of the radiator, and the radiating strips 41 on the front side and the rear side of the top surface of the radiator extend out of the ventilation opening 22. The protrusion 21 and the vent 22 are radiated to the air by heat. The fan 5 is disposed in a space surrounded by the heat dissipation bars 41.

The main control board 6 is arranged in the installation cavity, electrically connected with the semiconductor thermoelectric refrigerating sheet 3 and the fan 5, and connected with a plug and a power switch of an external power supply, and used for controlling the semiconductor thermoelectric refrigerating sheet 3 and the fan 5 to be switched on and off.

As a further improvement, the heat dissipation device for the smart device further includes a heat conduction sheet 7 disposed on the bottom surface of the bottom case 1. And a heat-conducting silica gel pad 8 is also arranged on the bottom surface of the heat-conducting fin 7. The heat conduction silica gel pad 8 can be attached to the intelligent equipment to conduct heat, and the heat conduction effect is good. The heat of the intelligent equipment can be conducted to the semiconductor thermoelectric refrigerating sheet 3 in the bottom case 1 through the heat conducting sheet 7 and the heat conducting silica gel pad 8.

As a further modification, the main control board 6 is provided on one end of the heat sink 4. Main control board 6 self also can be with the help of radiator 4 dispels the heat fast, prolongs the utility model discloses smart machine heat abstractor's life.

As a further improvement, both side surfaces of the top shell 2 are provided with movable claws 9, and the movable claws 9 are connected to the side surfaces of the top shell 2 through springs 91. The movable clamping jaws 9 can clamp the intelligent equipment, meanwhile, the intelligent equipment can adapt to the intelligent equipment with different sizes through stretching of the springs 91, and the universality is high.

As a further improvement, the inner surfaces of the clamping ends of the movable clamping jaws 9 are provided with a plurality of transverse convex teeth 92, so that the clamped intelligent equipment is prevented from sliding off, and the clamping firmness is enhanced.

As a further improvement, a heat dissipation hole 23 is formed at a position of the top surface of the top case 2 opposite to the fan 5, so as to further improve the heat dissipation efficiency.

As a further improvement, the semiconductor thermoelectric refrigerating sheet 3 is in a cuboid shape, and is conveniently and adaptively mounted in the groove 11 of the bottom case 1, so that the occupied space is small.

As a further improvement, the heat conducting sheet 7 is a copper foil heat conducting sheet, and can rapidly conduct the heat of the heat conducting silica gel pad 8 to the semiconductor thermoelectric refrigerating sheet 3, so as to play a role in collecting a heat carrier.

The utility model discloses smart machine heat abstractor can pass through smart machines such as smart mobile phone, panel computer are held to activity jack catch 9, and the switch-on opens the switch, can carry out high-efficient heat dissipation to smart machine. The utility model discloses smart machine heat abstractor can make the smart mobile phone drop to 15 degrees rapidly at 1 minute under 25 degrees ambient temperature, and 10 minutes are stabilized at 5 degrees, can reduce the heat that the cell-phone produced extremely fast.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation device for intelligent equipment is characterized by comprising a semiconductor thermoelectric refrigeration sheet, a radiator, a fan and a main control board;

2. The heat dissipation device of claim 1, further comprising a bottom housing and a top housing;

3. The smart device heat sink as claimed in claim 2, further comprising a heat conducting sheet disposed on a bottom surface of the bottom case.

4. The intelligent device heat sink as recited in claim 3, wherein a heat conductive silicone pad is further disposed on the bottom surface of the heat conductive sheet.

5. The smart device heat sink as recited in claim 2 wherein the main control board is also received in the mounting cavity and disposed on an end of the heat sink.

6. The intelligent device heat sink as recited in claim 2, wherein the two side surfaces of the top case are both provided with movable claws, and the movable claws are connected to the side surfaces of the top case through springs.

7. The heat sink for smart devices as recited in claim 6, wherein the movable claws have a plurality of transverse teeth on the inner surface of the holding end.

8. The heat dissipating device for smart devices as claimed in claim 2, wherein heat dissipating holes are formed on the top surface of the top case at positions opposite to the fans.

9. The smart device heat sink as recited in claim 3 wherein the thermally conductive sheet is a copper foil thermally conductive sheet.

10. The smart device heat sink as recited in claim 1 wherein the semiconductor thermoelectric cooling fins are of a cuboid shape.