CN217306113U

CN217306113U - Storage device with active heat dissipation function

Info

Publication number: CN217306113U
Application number: CN202121456926.3U
Authority: CN
Inventors: 马迅嘉; 庄子贤; 陈冠廷
Original assignee: Team Group Co ltd
Current assignee: Team Group Co ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2022-08-26
Anticipated expiration: 2031-06-29

Abstract

The utility model relates to a storage device with active heat dissipation function contains: a memory unit having a chip; a heat conductive sheet attached to the chip; the heat dissipation unit is provided with heat dissipation fins and a metal bottom cover, an accommodating concave part is arranged between the heat dissipation fins and the metal bottom cover, and the metal bottom cover is contacted with the bottom surfaces of the heat dissipation fins and the upper surface of the heat conducting fin; the refrigeration chip is arranged in the accommodating concave part and faces the upper surface of at least one chip, the cold surface of the refrigeration chip faces the metal bottom cover, and the hot surface of the refrigeration chip faces the heat dissipation fins; and the control unit receives the temperature value of the memory unit, and starts the refrigeration chip when the temperature value of the memory unit is higher than the default temperature value.

Description

Storage device with active heat dissipation function

Technical Field

The utility model relates to a storage device technical field specifically indicates a storage device with active heat dissipation function.

Background

Along with the improvement of the reading, writing and transmission speed of the storage device, the problem of heating is also brought to be not negligible. A large amount of heat generated in a long-time large-amount reading and writing process is concentrated on a chip with a small size, so that overheating can be caused to trigger a protection mechanism, and the performance is reduced, even the service life is shortened.

In order to solve the overheating problem, most of the storage devices in the prior art adopt passive heat dissipation. The passive heat dissipation is generally air cooling, and the heat is dissipated to the air through the heat dissipation fins. However, the heat dissipation efficiency of this heat dissipation method is not good, and a plurality of fans are often needed to be matched in a crowded enclosure to achieve a certain heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

Therefore, the present invention is directed to a storage device with active heat dissipation function, which has better heat dissipation effect than the storage device using only heat dissipation fins.

The utility model discloses a technical means who solves prior art's problem adoption contains for providing a storage device with active heat dissipation function: the memory unit is provided with a circuit board and a plurality of chips on the circuit board; a heat conducting sheet attached to the plurality of chips; the heat dissipation unit is provided with heat dissipation fins and a metal bottom cover, the bottom surfaces of the heat dissipation fins are provided with heat dissipation contact surfaces, an accommodating concave part is arranged between the heat dissipation fins and the metal bottom cover, the upper surface of the metal bottom cover is contacted with the heat dissipation contact surfaces, and the lower surface of the metal bottom cover is contacted with the upper surface of the heat conducting fins; the refrigeration chip is arranged in the accommodating concave part and is arranged to be separated by the heat dissipation unit and the heat conduction sheet to face the upper surface of at least one of the plurality of chips, the cold surface of the refrigeration chip faces the metal bottom cover, and the hot surface of the refrigeration chip faces the heat dissipation fins; and the control unit is connected with the refrigeration chip to control the refrigeration chip, receives the temperature value of the memory unit, and starts the refrigeration chip when the temperature value of the memory unit is higher than the default temperature value.

In an embodiment of the present invention, to provide a storage device with active heat dissipation function, the memory unit is a solid state disk, at least one of the plurality of chips is a main control chip, and the refrigeration chip faces to an upper surface of the main control chip.

In one embodiment of the present invention, to provide a storage device with active heat dissipation function, the memory unit is a main memory.

In an embodiment of the present invention, to provide a storage device with an active heat dissipation function, the control unit is disposed on the circuit board.

In an embodiment of the present invention, to provide a storage device with active heat dissipation function, the control unit is connected to a computer end, and the control unit receives the memory unit temperature value from the computer end.

In an embodiment of the present invention, to provide a storage device with active heat dissipation function, the memory unit has a temperature sensor, and the control unit is connected to the temperature sensor to receive the memory unit temperature value.

Through the utility model discloses a technical means that storage device with active heat dissipation function adopted when the memory cell temperature value is higher than acquiescent temperature value, utilizes the control unit to control and makes the refrigeration chip begin to start, and is changed into active heat dissipation from passive form heat dissipation. When the temperature value of the memory unit is reduced to be lower than the default temperature value, the control unit controls the refrigeration chip to be closed. Therefore, the utility model discloses a storage device with active heat dissipation function can have the radiating efficiency of preferred when the heat dissipation demand is high, and when the heat dissipation demand is low, has lower energy resource consumption.

Drawings

Fig. 1 is a first exploded view of a storage device with an active heat dissipation function according to a first embodiment of the present invention.

Fig. 2 is a second exploded view of the storage device with active heat dissipation function according to the first embodiment of the present invention.

Fig. 3 is an exploded view of a storage device with active heat dissipation function in another angle according to a first embodiment of the present invention.

Fig. 4 is a side sectional view of a storage device with an active heat dissipation function according to a first embodiment of the present invention.

Fig. 5 is a side sectional view of a storage device with an active heat dissipation function according to a second embodiment of the present invention.

Fig. 6 is a side sectional view of a storage device with an active heat dissipation function according to a third embodiment of the present invention.

Drawings

100 storage device with active heat dissipation function

100a storage device with active heat dissipation function

100b storage device with active heat dissipation function

1 memory cell

11 circuit board

12 chips

13 flash memory

14 Master control chip

2 Heat-conducting fin

3 Heat dissipation unit

31 heat sink fin

311 heat dissipating contact surface

32 metal bottom cover

33 accommodation recess

4 refrigeration chip

41 Cold noodle

42 hot noodle

43 Cold-side heat-conducting glue

44 hot-face heat-conducting glue

5 control unit

6 Clamp

Detailed Description

The following describes an embodiment of the present invention with reference to fig. 1 to 6. The description is not intended to limit the embodiments of the present invention, but is one example of the embodiments of the present invention.

As shown in fig. 1 to 3, a storage device 100 with active heat dissipation function according to a first embodiment of the present invention includes: memory unit 1, conducting strip 2, radiating element 3, refrigeration chip 4 and control unit 5.

The memory unit 1 has a circuit board 11 and a plurality of chips 12. The chip 12 is disposed on one side or both sides of the circuit board 11. In this embodiment, the memory unit 1 is a solid state disk. The chip 12 of the solid state disk comprises a flash memory 13 and a main control chip 14. In other embodiments, the memory unit 1 may be a main memory.

The heat-conducting sheet 2 is attached to the plurality of chips 12. In detail, the heat conducting sheet 2 is attached to all the chips 12 on one side of the circuit board 11, so that all the chips 12 can conduct heat and dissipate heat more uniformly. In this embodiment, the heat conducting sheet 2 is a sheet made of silica gel, and the heat generated by the chip 12 attached to the heat conducting sheet 2 is rapidly transferred out by using the high thermal conductivity of the silica gel. Moreover, the heat conducting sheet 2 is made of a soft material, and when the height of the plurality of chips 12 is different, the heat conducting sheet 2 can still be attached to the plurality of chips 12. In addition, the heat-conducting sheet 2 is made of an insulating material to prevent the electric current from passing through the heat-conducting sheet 2 and interfering with the electronic components. In other embodiments, the heat-conducting sheet 2 may also be a hard material having a high thermal conductivity.

The heat dissipating unit 3 has heat dissipating fins 31 and a metal bottom cover 32. The bottom surface of the radiator fin 31 has a heat radiation contact surface 311. The heat sink 31 and the metal bottom cover 32 have a receiving recess 33 therebetween. The upper surface of the metal bottom cover 32 contacts the heat dissipation contact surface 311 and the lower surface of the metal bottom cover 32 contacts the upper surface of the heat conductive sheet 2.

As shown in fig. 3 and 4, the refrigeration chip 4 is disposed in the accommodation recess 33. In the present embodiment, the accommodating recess 33 is a concave hole located on the bottom surface of the heat sink 31, so that the upper surface and the complete side surface of the refrigeration chip 4 are covered by the accommodating recess 33, and the refrigeration chip 4 is embedded in the heat sink 31. Of course, the present invention is not limited to this, and the accommodating recess 33 may be a notch, so that part of the side surface of the refrigeration chip 4 is covered by the accommodating recess 33.

As shown in fig. 2 to 4, the cooling chip 4 is disposed to face the upper surface of at least one chip 12 by being spaced apart by the heat conductive sheet 2 and the metal bottom cover 32 of the heat dissipating unit 3. The cold side 41 of the refrigeration chip 4 faces the metal bottom cover 32, and the hot side 42 of the refrigeration chip 4 faces the heat sink fins 31. Therefore, the metal bottom cover 32 is made to transfer heat to the heat radiation fins 31 through the refrigeration chip 4, and the metal bottom cover 32 is made to be cooled by the refrigeration chip 4.

The cold side 41 and the hot side 42 of the refrigeration chip 4 are respectively provided with a cold side heat-conducting glue 43 and a hot side heat-conducting glue 44, so as to improve the heat-conducting efficiency between the metal bottom cover 32 and the refrigeration chip 4 and the heat-conducting efficiency between the refrigeration chip 4 and the heat-dissipating fins 31.

In this embodiment, the memory unit 1 is a solid state disk, and when the solid state disk is in operation, the temperature of the main control chip 14 is higher than that of the flash memory 13. The cooling chip 4 faces the upper surface of the main control chip 14 and overlaps the main control chip 14 to dissipate heat from the hottest component of the memory unit 1. The cooling chip 4 is overlapped with the main control chip 14 only and is not overlapped with the flash memory 13, and the optimal unit area efficiency of the cooling chip 4 is achieved. Of course, in other embodiments, the cooling chip 4 may be overlapped with the main control chip 14, or may be overlapped with at least one flash memory 13 at the same time, so as to achieve better heat dissipation effect.

As shown in fig. 3, the control unit 5 is connected to the cooling chip 4 to control the cooling chip 4. The control unit 5 receives the memory cell temperature value of the memory cell 1. When the temperature value of the memory unit is higher than the default temperature value, the control unit 5 controls the refrigeration chip 4 to start, so that the utility model changes the passive heat dissipation into the active heat dissipation. When the temperature value of the memory unit falls back below the default temperature value, the control unit 5 controls the refrigeration chip 4 to be turned off. Therefore, the storage device 100 with active heat dissipation function of the present invention can have better heat dissipation efficiency when the heat dissipation requirement is high, and has lower energy consumption when the heat dissipation requirement is low.

As shown in fig. 3, in the present embodiment, the control unit 5 is disposed separately from the circuit board 11 of the memory unit 1. In other embodiments, the control unit 5 may be disposed on the circuit board 11 and integrated with the memory unit 1.

The control unit 5 is connected to the computer terminal to receive the memory unit temperature value from the computer terminal. The control unit 5 also receives power from the computer to control the power delivered to the refrigeration chip 4. In other embodiments, the control unit 5 may also be a temperature sensor connected to the memory unit 1 to receive the memory unit temperature value without being transmitted through a computer.

In the present embodiment, the storage device 100 with active heat dissipation function fixes the memory unit 1 and the heat dissipation unit 3 by the clamp 6.

As shown in fig. 5, the storage device 100a with active heat dissipation function according to the second embodiment of the present invention has substantially the same structure as the storage device 100 with active heat dissipation function of the first embodiment, with the difference: the receiving recess 33 is located on the top surface of the metal bottom cover 32, so that the lower surface and the complete side surface of the refrigeration chip 4 are covered by the metal bottom cover 32, and the refrigeration chip 4 is embedded in the metal bottom cover 32.

As shown in fig. 6, the storage device 100b with active heat dissipation function according to the third embodiment of the present invention has substantially the same structure as the storage device 100 with active heat dissipation function of the first embodiment, with the following differences: the receiving recess 33 is located on the bottom surface of the heat sink 31 and the top surface of the metal bottom cap 32, so that the refrigeration chip 4 is partially embedded in the heat sink 31 and partially embedded in the metal bottom cap 32.

The above description and illustrations are only for the purpose of describing the preferred embodiments of the present invention, and other modifications can be made by those skilled in the art based on the above definitions and illustrations, and it is to be understood that such modifications are within the scope of the present invention.

In this specification, the invention has been described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.

Claims

1. A storage device with active heat dissipation function, the storage device comprising:

the memory unit is provided with a circuit board and a plurality of chips on the circuit board;

the heat conducting fins are attached to the plurality of chips;

the heat dissipation unit is provided with heat dissipation fins and a metal bottom cover, the bottom surfaces of the heat dissipation fins are provided with heat dissipation contact surfaces, an accommodating concave part is arranged between the heat dissipation fins and the metal bottom cover, the upper surface of the metal bottom cover is contacted with the heat dissipation contact surfaces, and the lower surface of the metal bottom cover is contacted with the upper surface of the heat conducting fin;

the refrigeration chip is arranged in the accommodating concave part and is arranged to be separated by the heat dissipation unit and the heat conduction sheet to face the upper surface of at least one of the plurality of chips, the cold surface of the refrigeration chip faces the metal bottom cover, and the hot surface of the refrigeration chip faces the heat dissipation fins; and

the control unit is connected with the refrigeration chip to control the refrigeration chip, receives the temperature value of the memory unit, and starts the refrigeration chip when the temperature value of the memory unit is higher than the default temperature value.

2. The storage device with active heat dissipation function of claim 1, wherein the memory unit is a solid state disk, at least one of the plurality of chips is a main control chip, and the cooling chip faces an upper surface of the main control chip.

3. The storage device with active heat dissipation function as claimed in claim 1, wherein the memory unit is a main memory.

4. The storage device with active heat dissipation function as claimed in claim 1, wherein the control unit is disposed on the circuit board.

5. The storage device with active heat dissipation function of claim 1, wherein said control unit is connected to a computer, said control unit receiving said memory unit temperature value from said computer.

6. The storage device with active heat dissipation function of claim 1, wherein said memory unit has a temperature sensor, and said control unit is connected to said temperature sensor for receiving said memory unit temperature value.