CN219421445U - Radiating assembly and electronic equipment assembly - Google Patents

Abstract

The utility model relates to a heat radiation assembly and an electronic equipment assembly, wherein the heat radiation assembly is used for radiating heat, the heat radiation assembly comprises a heat radiation fan, a heat radiation piece and a base, the heat radiation fan is arranged on the base, the heat radiation piece is arranged between the base and a shell, the positions of the heat radiation fan and the heat radiation piece correspond to each other, heat energy generated in the base is transferred to the heat radiation piece through the heat radiation fan, and the heat radiation piece transfers heat to the outside through the shell. The heat transferred by the radiator fan can be transferred to the outside through the radiator arranged in a counterpoint mode, so that the heat stored in the gap between the base and the shell is prevented from continuously heating the radiating component, the radiating effect of the radiator fan is improved, and the service life of the radiating component is prolonged.

Description

Radiating assembly and electronic equipment assembly

Technical Field

The present utility model relates to the field of heat dissipation technologies, and in particular, to a heat dissipation assembly and an electronic device assembly.

Background

The electronic equipment or the mechanical equipment can generate heat in the working process, the heat needs to be discharged to the outside, the situation that the temperature of the equipment is too high due to the fact that the heat is accumulated in the electronic equipment or the mechanical equipment is avoided, and the service life of the equipment is shortened; in the conventional technology, a gap between a base and a housing of an electronic device assembly can store heat, and the heat in the gap can continuously heat the electronic device assembly, so that the heat dissipation efficiency of the electronic device assembly is reduced.

Disclosure of Invention

Based on this, it is necessary to provide a heat dissipation assembly and an electronic device assembly.

The application provides a radiator unit for the heat dissipation, radiator unit includes radiator fan, radiator and base, radiator fan installs on the base, radiator fan installs between base and the shell, radiator fan with the position of radiator corresponds, the heat energy that produces in the base passes through radiator fan transmits to radiator, radiator passes through the heat energy the shell transmits to the external world.

So set up, the heat that radiator fan transmitted can be through counterpoint setting's radiating part transfer to the external world, keeps heat to last the heating of radiator unit in avoiding the clearance between base and the shell, improves radiator fan's radiating effect, prolongs radiator unit's life.

In one embodiment, the heat sink comprises foam.

So set up, reduce the noise of the produced transmission of radiator fan, reduce radiator fan during operation's vibrations range, improve radiator unit's stability, provide comfortable use for the user and experience.

In one embodiment, the foam is provided with a plurality of air channels, and the positions of the air channels are matched with the positions of the heat dissipation holes on the shell.

The plurality of air channels formed in the foam can improve the heat dissipation effect of the foam; the heat accumulation at the position deviation between the air duct and the heat dissipation hole is avoided, and the heat dissipation efficiency of the foam is improved.

In one embodiment, the number of the cooling fans is multiple, each cooling fan corresponds to a group of air channels, and each group of air channels is at least one.

So set up, radiating efficiency of radiator unit is high, looks adaptation between radiator fan and the wind channel, and the heat that the guarantee radiator fan transmitted can pass through the wind channel and transmit to the external world.

In one embodiment, the air channels of the same group are distributed in a radial shape, and the size of one side of the air channels of the same group, which is close to the base, is smaller than that of one side of the air channels, which is close to the shell.

So set up, enlarge the radiating area in wind channel can improve the radiating effect in wind channel, and the size that the wind channel is close to one side of the base is less than the size that is close to one side of the shell can avoid external spot or granule to get into radiator fan or base in through the wind channel, extension radiator fan's life.

In one embodiment, one side of the foam is matched with the shape of the base, the other side of the foam is matched with the shape of the shell, and the foam is respectively attached to the base and the shell.

So set up, the bubble cotton can install in the clearance of base and shell with the adaptation, avoids the clearance between base and shell not taking place by the condition that bubble cotton fully fills, leads to the heat to stay in this clearance to base and shell continuous heating, improves radiating component's radiating effect.

In one embodiment, the heat sink is glued to the base.

So set up, avoid at the operation in-process of radiator unit, the radiator unit takes place to shift because of vibrations, improves the stability of installing the radiator unit on the base, avoids taking place the displacement because of the radiator unit relative to the base, leads to radiator unit's radiating efficiency to descend.

In one embodiment, the base comprises a sheet metal part, and the cooling fan is mounted on the sheet metal part.

So set up, the sheet metal component can provide stable support for radiator fan, improves radiator fan's stability at the during operation, reduces the noise that radiator fan sent at the during operation, improves user's use impression.

The application still provides electronic equipment subassembly, electronic equipment subassembly includes radiator unit and electronic equipment, radiator unit is foretell radiator unit, electronic equipment includes the shell, radiator unit installs electronic equipment is last and be located in the shell, radiator unit can be for electronic equipment heat dissipation.

So set up, the radiator unit can avoid electronic equipment to break down because of the high temperature, improves electronic equipment's life.

In one embodiment, the shell is provided with a plurality of heat dissipation holes, the heat dissipation piece is provided with a plurality of air channels, and the heat dissipation holes are matched with the air channels in position.

So set up, the louvre can avoid radiating piece and shell handing-over department to store up heat, avoids the shell to appear high temperature, avoids the user to touch the shell and causes the damage in the use, improves the radiating efficiency of electronic equipment subassembly, improves the security and the stability of electronic equipment subassembly.

Drawings

FIG. 1 is a schematic diagram of a heat dissipating assembly according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a heat dissipating assembly according to another embodiment of the present utility model;

FIG. 3 is a schematic view of a portion of the foam of FIG. 2;

fig. 4 is a schematic view of a part of the structure of the housing in fig. 1 and 2.

Reference numerals:

100. a heat dissipation assembly; 10. a heat radiation fan; 20. a heat sink; 30. a base; 50. a housing; 51. a heat radiation hole; 60. soaking cotton; 61. an air duct; 1. a gap.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

The electronic equipment or the mechanical equipment can generate heat in the working process, the heat needs to be discharged to the outside, the situation that the temperature of the equipment is too high due to the fact that the heat is accumulated in the electronic equipment or the mechanical equipment is avoided, and the service life of the equipment is shortened; in the conventional technology, a gap between a base and a housing of an electronic device assembly can store heat, and the heat in the gap can continuously heat the electronic device assembly, so that the heat dissipation efficiency of the electronic device assembly is reduced.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat dissipating assembly 100 according to an embodiment of the utility model.

Referring to fig. 1 to 4, the present application provides a heat dissipating assembly 100 for dissipating heat, wherein the heat dissipating assembly 100 includes a heat dissipating fan 10, a heat dissipating member 20 and a base 30, the heat dissipating fan 10 is mounted on the base 30, the heat dissipating member 20 is mounted between the base 30 and a housing 50, the heat dissipating member 20 corresponds to a position of a heat conducting member, heat generated in the base 30 is transferred to the heat dissipating member 20 through the heat dissipating fan 10, and the heat dissipating member 20 transfers the heat to the outside through the housing 50.

So set up, the heat that radiator fan 10 transmitted can be through counterpoint setting's heat dissipation piece 20 transfer to the external world, avoids keeping up the heat and continuously heating radiator assembly 100 in the clearance 1 between base 30 and the shell 50, improves radiator fan 10's radiating effect, prolongs radiator assembly 100's life.

Referring to fig. 2 to 4, in one embodiment, the heat sink 20 includes foam 60.

So set up, reduce the noise of the produced transmission of radiator fan 10, reduce radiator fan 10 during operation's vibrations range, improve radiator assembly 100's stability, provide comfortable use and experience for the user.

Alternatively, in the present embodiment, the heat sink 20 is implemented as foam 60, and in other embodiments of the present application, the heat sink 20 may be implemented as plastic or rubber, so long as it can be installed in the gap 1 between the base and the housing, and heat in the gap 1 can be prevented from continuously heating the heat sink assembly.

Referring to fig. 2 to 4, in one embodiment, the foam 60 is provided with a plurality of air channels 61, and the positions of the air channels 61 are adapted to the positions of the heat dissipation holes 51 on the housing 50.

So arranged, the plurality of air channels 61 arranged on the foam can improve the heat dissipation effect of the foam; avoiding heat accumulation at the position deviation between the air duct 61 and the heat dissipation holes 51, and improving the heat dissipation efficiency of the foam.

Alternatively, in the present embodiment, the air duct 61 formed on the foam 60 is implemented as a circular truncated cone, and in other embodiments of the present application, the air duct 61 formed on the foam 60 may be implemented as a cylinder or a cuboid, as long as the air duct 61 can improve the heat dissipation effect of the foam 60.

Optionally, in this embodiment, the inner wall of the air duct 61 is coated with a graphene heat-dissipating coating, and in other embodiments of the present application, the inner wall of the air duct 61 may be coated with a silicone grease heat-dissipating paste or a graphene heat-dissipating coating, so long as the air duct 61 is capable of transferring heat.

Referring to fig. 2 to 4, in one embodiment, the number of the heat dissipation fans 10 is plural, each heat dissipation fan 10 corresponds to a set of air channels 61, and each set of air channels 61 is at least one.

So set up, the radiating efficiency of radiator unit 100 is high, and the looks adaptation between radiator fan 10 and the wind channel 61 ensures that the heat that radiator fan 10 transmitted can pass through wind channel 61 and transmit to the external world.

Alternatively, in the present embodiment, the number of the heat dissipation fans 10 is implemented as a plurality, and in other embodiments of the present application, the number of the heat dissipation fans 10 may be implemented as one or more than one, as long as the heat dissipation efficiency of the heat dissipation assembly 100 can match the requirement of the heat dissipation assembly 100.

Alternatively, in the present embodiment, the heat dissipation fan 10 is mounted on the base 30 in the area facing away from the ground, and in other embodiments of the present application, the heat dissipation fan 10 may also be mounted on the base 30 in the area near the ground, as long as the heat dissipation effect of the heat dissipation fan 10 can meet the requirements of the electronic device assembly.

Alternatively, in the present embodiment, each cooling fan 10 is implemented to correspond to one set of air ducts 61, and in other embodiments of the present application, each cooling fan 10 may be implemented to correspond to two or more sets of air ducts 61, as long as the heat transferred from the cooling fan 10 to each set of air ducts 61 can be transferred to the outside.

Alternatively, in the present embodiment, each set of air channels 61 is implemented as one air channel 61, and in other embodiments of the present application, each set of air channels 61 may be implemented as two or more air channels 61, as long as the number of air channels 61 can satisfy the heat dissipation efficiency of the heat dissipation fan 10.

Referring to fig. 2 to 4, in one embodiment, the plurality of air channels 61 of the same group are radially distributed, and the size of the side of the plurality of air channels 61 of the same group near the base 30 is smaller than the size of the side near the housing 50.

By the arrangement, the heat dissipation area of the air duct 61 is enlarged, the heat dissipation effect of the air duct 61 can be improved, the dimension of one side of the plurality of air ducts 61 close to the base 30 is smaller than that of one side close to the shell, external stains or particles can be prevented from entering the heat dissipation fan 10 or the base 30 through the air duct 61, and the service life of the heat dissipation fan 10 is prolonged.

Alternatively, in the present embodiment, the plurality of air channels 61 of the same group are radially distributed, and in other embodiments of the present application, the plurality of air channels 61 of the same group may be horizontally distributed, so long as the air channels 61 can transfer the heat transferred by the heat dissipating fan 10 to the outside.

Alternatively, in the present embodiment, the size of the side of the plurality of air channels 61 close to the base 30 is smaller than the size of the side of the housing 50, and in other embodiments of the present application, the size of the side of the plurality of air channels 61 close to the base 30 may be equal to or larger than the size of the side of the housing 50, as long as the efficiency of heat transfer of the air channels 61 can meet the heat dissipation requirement of the heat dissipation assembly 100 by the heat dissipation electronic device assembly.

Referring to fig. 2 to 4, in one embodiment, one side of the foam 60 is adapted to the shape of the base 30, the other side of the foam 60 is adapted to the shape of the housing 50, and the foam 60 is respectively attached to the base 30 and the housing 50.

In this way, the foam 60 can be adaptively installed in the gap 1 between the base 30 and the housing 50, so that the situation that the gap 1 between the base 30 and the housing 50 is not completely filled with the foam 60 is avoided, heat is remained in the gap 1 to continuously heat the base 30 and the housing 50, and the heat dissipation effect of the heat dissipation assembly 100 is improved.

Alternatively, in the present embodiment, the side of the foam 60 facing the base 30 is implemented to be adapted to the shape of the base 30, and in other embodiments of the present application, the side of the foam 60 facing the base 30 may be implemented to be different from the shape of the base 30, so long as the reduction of the heat dissipation efficiency of the heat dissipation assembly 100 is avoided.

Alternatively, in the present embodiment, the side of the foam 60 facing the housing 50 is implemented as the shape of the housing 50 is adapted, and in other embodiments of the present application, the side of the foam 60 facing the housing 50 may be implemented as a difference from the shape of the housing 50, so long as the reduction of the heat dissipation efficiency of the heat dissipation assembly 100 is avoided.

Alternatively, in the present embodiment, the foam 60 is respectively attached to the base 30 and the housing 50, and in other embodiments of the present application, the foam 60 may also be implemented to have a gap 1 between the base 30 and the housing 50, so long as the heat retained in the gap 1 between the foam 60 and the base 30 and the housing 50 can be avoided from continuously heating the heat dissipation assembly 100.

Referring to fig. 1 to 4, in one embodiment, the heat sink 20 is glued to the base 30.

So set up, avoid in the operation in-process of radiator unit 100, radiator unit 20 takes place to shift because of vibrations, improve the stability of radiator unit 20 of installing on base 30, avoid because of radiator unit 20 takes place the displacement relative to base 30, lead to radiator unit 100's radiating efficiency to descend.

Alternatively, in the present embodiment, the heat dissipation element 20 is glued to the base 30, and in other embodiments of the present application, the heat dissipation element 20 may be clamped to the base 30 or magnetically attracted to the base 30, so long as displacement of the heat dissipation element 20 relative to the base 30 is avoided.

Alternatively, in the present embodiment, the bonding material of the heat dissipating member 20 for bonding the base 30 is implemented as a back adhesive, and in other embodiments of the present application, the bonding material of the heat dissipating member 20 for bonding the base 30 may be implemented as a heat conductive silicone grease or a heat conductive silicone gel, so long as the heat dissipating member 20 can be stably bonded to the base 30.

Referring to fig. 1 to 2, in one embodiment, the base 30 includes a sheet metal part, and the heat dissipation fan 10 is mounted on the sheet metal part.

So set up, the sheet metal component can provide stable support for radiator fan 10, improves radiator fan 10 at the stability of during operation, reduces the noise that radiator fan 10 sent at the during operation, improves user's use impression.

Alternatively, the base 30 is implemented as a sheet metal member in the present embodiment, and in other embodiments of the present application, the base 30 may be implemented as a casting or die casting, as long as the base 30 can provide stable support for the radiator fan 10.

Alternatively, in the present embodiment, the cooling fan 10 is implemented to be mounted on the side of the sheet metal part facing away from the heat sink 20, and in other embodiments of the present application, the cooling fan 10 may also be implemented to be mounted on the side of the sheet metal part facing toward the heat sink 20, as long as the heat dissipation efficiency of the cooling fan 10 can meet the requirement of the heat dissipation assembly 100.

Referring to fig. 1 to 4, the present application further provides an electronic device assembly (not shown), the electronic device assembly includes a heat dissipation assembly 100 and an electronic device, the heat dissipation assembly 100 is the heat dissipation assembly 100, the electronic device includes a housing 50, the heat dissipation assembly 100 is mounted on the electronic device and is located in the housing 50, and the heat dissipation assembly 100 is capable of dissipating heat of the electronic device.

So set up, the cooling module 100 can avoid electronic equipment to break down because of the high temperature, improves electronic equipment's life.

Referring to fig. 1 and 4, in one embodiment, a plurality of heat dissipation holes 51 are formed in the housing 50, and a plurality of air channels 61 (not shown) are formed in the heat dissipation member 20, wherein the positions of the heat dissipation holes 51 and the air channels 61 are adapted.

So set up, the louvre 51 can avoid heat accumulation in heat dissipation piece 20 and shell 50 handing-over department, avoids shell 50 to appear high temperature, avoids the user to touch shell 50 in the use and causes the damage, improves the radiating efficiency of electronic equipment subassembly, improves the security and the stability of electronic equipment subassembly.

Alternatively, in the present embodiment, the heat dissipation element 20 is implemented as black, and in other embodiments of the present application, the heat dissipation element 20 may be implemented as white, orange, or any color, as long as the heat dissipation effect of the heat dissipation element 20 can meet the requirement of the heat dissipation assembly 100 on the heat dissipation element 20.

Optionally, in the present embodiment, the positions of the heat dissipation holes 51 and the air duct 61 are implemented to be adapted, and in other embodiments of the present application, the positions of the heat dissipation holes 51 and the air duct 61 are implemented to have a deviation, so long as the local high temperature of the electronic device housing 50 can be avoided.

Alternatively, in the present embodiment, the number of the heat dissipation holes 51 is implemented as the same as the number of the air channels 61, and in other embodiments of the present application, the number of the heat dissipation holes 51 may be implemented as a difference from the number of the air channels 61, as long as the heat in the air channels 61 can be transferred to the outside through the heat dissipation holes 51.

Referring to fig. 1 to 4, in the embodiment, the heat dissipation element 20 is provided with a back adhesive, the heat dissipation element 20 is implemented as a black heat dissipation element 20 to avoid the heat dissipation of the installation gap between the housing 50 and the base 30, and fig. 2 and 3 are the heat dissipation element 20 implemented as foam 60, so that the working noise of the heat dissipation element 100 is reduced when the heat dissipation element 100 works, and the foam 60 can prevent the displacement between the housing 50 and the base 30 to provide support for the heat dissipation element 100; of course, in specific applications of the heat dissipation assembly 100, including but not limited to electronic devices and mechanical devices, the heat dissipation assembly 100 can be applied to a plurality of application scenarios, as long as the heat dissipation assembly 100 can meet the heat dissipation requirement of the scenario.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The heat dissipation assembly is used for dissipating heat and is characterized by comprising a heat dissipation fan, a heat dissipation piece and a base, wherein the heat dissipation fan is arranged on the base, the heat dissipation piece is arranged between the base and the shell, the heat dissipation fan corresponds to the heat dissipation piece in position, heat energy generated in the base is transferred to the heat dissipation piece through the heat dissipation fan, and the heat dissipation piece transfers heat to the outside through the shell.

2. The heat dissipating assembly of claim 1, wherein said heat dissipating member comprises foam.

3. The heat dissipating assembly of claim 2 wherein said foam is provided with a plurality of air channels, said air channels being positioned to match the position of said heat dissipating apertures in said housing.

4. A heat dissipating assembly according to claim 3, wherein said plurality of heat dissipating fans is provided, each of said plurality of heat dissipating fans corresponds to a set of said air channels, and each set of said air channels is at least one.

5. The heat dissipating assembly of claim 4, wherein a plurality of said air channels in a same group are radially disposed and a dimension of a side of said air channels in a same group adjacent to said base is smaller than a dimension of a side adjacent to said housing.

6. The heat dissipating assembly of claim 2, wherein one side of the foam is adapted to the shape of the base, the other side of the foam is adapted to the shape of the housing, and the foam is respectively attached to the base and the housing.

7. The heat sink assembly of claim 1 wherein the heat sink is glued to the base.

8. The heat dissipating assembly of claim 1, wherein said base comprises a sheet metal part, said heat dissipating fan being mounted to said sheet metal part.

9. An electronic device assembly, characterized in that the electronic device assembly comprises a heat dissipation assembly and an electronic device, the heat dissipation assembly is the heat dissipation assembly according to any one of claims 1 to 8, the electronic device comprises the housing, the heat dissipation assembly is mounted on the electronic device and is located in the housing, and the heat dissipation assembly can dissipate heat of the electronic device.

10. The electronic device assembly of claim 9, wherein the housing is provided with a plurality of heat dissipation holes, the heat dissipation member is provided with a plurality of air channels, and the heat dissipation holes are adapted to the positions of the air channels.