CN214708519U - Inverter with high heat dissipation performance - Google Patents
Inverter with high heat dissipation performance Download PDFInfo
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- CN214708519U CN214708519U CN202121284463.7U CN202121284463U CN214708519U CN 214708519 U CN214708519 U CN 214708519U CN 202121284463 U CN202121284463 U CN 202121284463U CN 214708519 U CN214708519 U CN 214708519U
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- heat dissipation
- inverter
- heat
- base plate
- fins
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Abstract
The utility model relates to a high heat dissipating's dc-to-ac converter, this high heat dissipating's dc-to-ac converter includes: inverter main part and radiator unit, the inverter main part includes: casing and the electron device who sets up in the casing, electron device are used for changing outside direct current into the alternating current, and radiator unit includes: the bottom plate, two are accepted board and a plurality of heat radiation fins, be connected with radiator unit through the inverter main part, each heat radiation fins interval sets up on the bottom plate, and distribute and accept between the board at two, form the radiating groove between every two adjacent heat radiation fins, when the inverter operation, the heat that the inverter main part produced conducts fast through the bottom plate and dispels on heat radiation fins, and realize the convection current heat dissipation through each radiating groove, make the heat discharge from the casing well, can not cause the harm to electron device when the inverter is using, can play the effect of protection.
Description
Technical Field
The utility model relates to an inverter technical field, in particular to high heat dissipating's dc-to-ac converter.
Background
The inverter is composed of an inverter bridge, control logic and a filter circuit, and is widely applicable to air conditioners, electric tools, computers, televisions and washing machines, but in the using process, the inverter usually damages electronic components of the inverter due to poor heat dissipation performance.
SUMMERY OF THE UTILITY MODEL
In view of this, it is necessary to provide an inverter having high heat dissipation performance.
The utility model provides an above-mentioned technical problem's technical scheme as follows:
a high heat dissipating inverter comprising: an inverter main body and a heat dissipation assembly;
the inverter main body includes: the electronic device is arranged in the shell and used for converting external direct current into alternating current;
the heat dissipation assembly includes: the heat dissipation device comprises a base plate, two bearing plates and a plurality of heat dissipation fins, wherein the base plate is arranged on the shell, the two bearing plates are oppositely arranged on two sides of the base plate, the heat dissipation fins are arranged on the base plate at intervals and distributed between the two bearing plates, and a heat dissipation groove is formed between every two adjacent heat dissipation fins.
In one embodiment, the width of the heat dissipation fins gradually decreases from the side connected with the bottom plate to the side far away from the bottom plate.
In one embodiment, each of the heat dissipation fins is vertically arranged on the bottom plate.
In one embodiment, the width of the receiving plate is greater than the width of the heat dissipating fins.
In one embodiment, each of the heat dissipation fins is provided with a plurality of heat dissipation holes, and every two adjacent heat dissipation grooves are communicated through the heat dissipation holes.
In one embodiment, the base plate, the receiving plate and the heat dissipating fins are integrally provided.
In one embodiment, the heat dissipation fins are made of metal.
In one embodiment, the base plate and the housing are connected by bolts.
The utility model has the advantages that: the utility model provides a pair of high heat dissipating's dc-to-ac converter, be connected with radiator unit through the dc-to-ac converter main part, each heat radiation fins interval sets up on the bottom plate, and distribute and accept between the board at two, form the radiating groove between every two adjacent heat radiation fins, when the dc-to-ac converter moves, the heat that the dc-to-ac converter main part produced conducts fast to heat radiation fins through the bottom plate and goes out, and realize the convection current heat dissipation through each radiating groove, make the heat discharge in the casing well, can not cause the harm to electron device when the dc-to-ac converter is used, can play the effect of protection.
Drawings
FIG. 1 is a schematic diagram of an embodiment of an inverter with high heat dissipation capability;
fig. 2 is a schematic view of a structure of one direction of the high heat dissipation inverter according to the embodiment.
In the drawing, 10, an inverter with high heat dissipation performance; 100. an inverter main body; 110. a housing; 200. a heat dissipating component; 210. a base plate; 220. a bearing plate; 230. and heat dissipation fins.
Detailed Description
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The following will combine the drawings of the embodiments of the present invention to further describe the technical solution of the present invention, and the present invention is not limited to the following specific embodiments.
It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar parts. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom", etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the drawings, the description is merely for convenience of description and simplicity of description, but does not indicate or imply that the equipment or components referred to must have specific orientations, be constructed in specific orientations, and be operated, and therefore, the terms describing the positional relationships in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art will understand the specific meanings of the terms according to specific situations.
In one embodiment, as shown in fig. 1, an inverter 10 with high heat dissipation performance includes: an inverter main body 100 and a heat dissipation assembly 200;
the inverter main body 100 includes: the electronic device comprises a shell 110 and an electronic device arranged in the shell 110, wherein the electronic device is used for converting external direct current into alternating current;
the heat dissipation assembly 200 includes: the heat sink comprises a base plate 210, two receiving plates 220 and a plurality of heat dissipation fins 230, wherein the base plate 210 is arranged on the housing 110, the two receiving plates 220 are oppositely arranged on two sides of the base plate 210, the heat dissipation fins 230 are arranged on the base plate 210 at intervals and distributed between the two receiving plates 220, and a heat dissipation groove is formed between every two adjacent heat dissipation fins 230.
In the present embodiment, the electronic device is mounted in the housing 110, and the electronic device converts the external direct current into the alternating current in a manner known to those skilled in the art, and can be realized, which is not described redundantly in this example, for example, the electronic device includes an inverter bridge and a filter circuit, and the external direct current can be converted into the alternating current when the inverter 10 with high heat dissipation performance is used.
In this embodiment, the two receiving plates 220 are oppositely disposed on two sides of the base plate 210, the heat dissipation fins 230 are uniformly spaced on the outer surface of the base plate 210 and are distributed between the two receiving plates 220, a heat dissipation groove is formed between every two adjacent heat dissipation fins 230, when the inverter main body 100 is in use, heat generated during operation of the inverter main body can be conducted from the base plate 210 to the heat dissipation fins 230 through the heat dissipation assembly 200, and the heat dissipation fins 230 conduct the heat to the outside through a convection heat dissipation manner, so that the inverter 10 with high heat dissipation performance can dissipate heat in time when in use, and internal electronic components cannot be damaged due to over-high temperature.
In order to increase the contact area of the heat sink with the external air flow, in one embodiment, as shown in fig. 1, the width of the heat sink fins 230 is gradually decreased from the side connected to the bottom plate 210 to the side away from the bottom plate 210. Specifically, the heat dissipation fins 230 are made of metal, have good heat conductivity and better heat dissipation effect, the heat dissipation fins 230 are equidistantly arranged on the base plate 210, the width of the heat dissipation fins 230 is gradually reduced to gradually increase the width of the heat dissipation grooves, and when the high heat dissipation inverter 10 is in use, heat is transferred to the heat dissipation fins 230 through the base plate 210, because the width of the heat dissipation grooves is gradually increased, the contact area between the heat dissipation fins 230 and the air for convection heat dissipation is also gradually increased.
In order to better dissipate heat by convection, in one embodiment, as shown in fig. 2, the heat dissipation fins 230 are vertically arranged on the bottom plate 210. Specifically, every two adjacent heat dissipation fins 230 are vertically arranged on the bottom plate 210 to form the heat dissipation slots which are vertically distributed, and because the density of the hot airflow is low, the heat dissipated by the heat dissipation fins 230 can flow upwards along the heat dissipation slots in the vertical direction, and is convected with the external air from the vertical direction, so that heat transfer is completed, the heat in the heat dissipation fins 230 and the external cold air circulation flow can be accelerated better, the temperature tends to be uniform, and the heat dissipation speed is higher.
In order to improve the heat dissipation effect of the heat dissipation fins 230, in an embodiment, as shown in fig. 1, each of the heat dissipation fins 230 is provided with a plurality of heat dissipation holes, and each two adjacent heat dissipation slots are communicated with each other through the heat dissipation holes. Specifically, a plurality of heat dissipation holes are formed in the heat dissipation fins 230, the heat dissipation holes are arranged on the heat dissipation fins 230 in a quincunx distribution manner, and the heat dissipation holes are formed in the heat dissipation fins 230, so that the heat dissipation grooves are communicated with each other, heat can flow in the vertical direction and can flow in the transverse direction through the heat dissipation holes, when the heat in one heat dissipation groove is high, the heat can flow to the other heat dissipation groove through the heat dissipation holes, the heat in the heat dissipation groove can be rapidly diffused, the local temperature can be rapidly reduced, and therefore the heat dissipated by the heat dissipation fins 230 and the external cooler gas can flow in a circulating manner through a plurality of directions, the temperature of the heat dissipation fins 230 is reduced, and the heat dissipation effect is better.
In order to prevent the heat dissipation fins 230 from being damaged, in one embodiment, as shown in fig. 1, the width of the receiving plate 220 is greater than the width of the heat dissipation fins 230. Specifically, the two receiving plates 220 are disposed on two sides of the base plate 210 in parallel, the heat dissipation fins 230 are disposed on the base plate 210 at equal intervals and are distributed between the two receiving plates 220, and the width of the receiving plates 220 is greater than the width of the heat dissipation fins 230, that is, the receiving plates 220 are disposed outside the heat dissipation fins 230, so that the heat dissipation fins 230 can be prevented from being damaged by direct impact, and a protection effect can be achieved. Further, in order to provide the heat dissipation assembly with better stability, the bottom plate 210, the receiving plate 220 and the heat dissipation fins 230 are integrally disposed, so that the structure of the heat dissipation assembly is more stable.
In one embodiment, as shown in fig. 1, the base plate 210 and the housing 110 are coupled by bolts in order to define the positions of the base plate 210 and the housing 110. Specifically, the bottom plate 210 is disposed on the housing 110, both the housing 110 and the bottom plate 210 are provided with screw holes, and the position between the housing 110 and the bottom plate 210 is relatively fixed by friction between the bolts and the housing 110 and the bottom plate 210. In another embodiment, the bottom plate 210 may be further connected to one side of the housing 110 by a thermal conductive adhesive.
In one embodiment, in order to visually display the temperature of the high heat dissipation inverter 10, the heat dissipation assembly 200 further includes a thermometer disposed at one side of the housing 110, and by reading the thermometer, the temperature at the distribution area of the housing 110 can be visually known, so that the temperature inside the high heat dissipation inverter can be known. In one embodiment, the thermometer is a mercury thermometer, and in another embodiment, the thermometer is a digital thermometer.
In one embodiment, in order to facilitate the suspension of the high heat dissipation inverter 10, the inverter body 100 further includes a suspension structure, the suspension structure includes a suspension plate and a plurality of clips, two sides of the base plate 210 are respectively provided with a plurality of slots, one end of each clip is clipped with one slot, one end of each clip is connected with the suspension plate, specifically, two clips are clipped with the two slots, and when the suspension plate needs to be suspended, one surface of the suspension plate away from the base plate 210 can be bonded with a wall through glue, so as to achieve the suspension of the high heat dissipation inverter 10.
In one embodiment, the bottom plate 210 is provided with a heat equalizing layer, one side of the heat equalizing layer is connected to the housing 110, and the other side of the heat equalizing layer is connected to the bottom plate 210, the heat equalizing layer is a graphite sheet made of flexible graphite sheet material and has good horizontal heat conducting performance, when a local heat source is generated on the housing 110, the heat equalizing layer can rapidly diffuse heat generated by the local heat source to the whole body, so as to eliminate local "hot spots", that is, by dispersing the local heat to the whole area, the temperature of the housing 110 can be effectively reduced.
In one embodiment, the housing 110 is formed with a plurality of ventilation holes for better heat dissipation. Specifically, the housing 110 is opened with a plurality of ventilation holes communicating with the inside of the high heat dissipation inverter 10, the ventilation holes are uniformly distributed on the housing 110, and when the high heat dissipation inverter 10 is in use, heat generated by the high heat dissipation inverter 10 is dissipated not only through the heat dissipation fins 230, but also through the ventilation holes on the housing 110, so that heat can be dissipated better.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (8)
1. An inverter with high heat dissipation performance, comprising: an inverter main body and a heat dissipation assembly;
the inverter main body includes: the electronic device is arranged in the shell and used for converting external direct current into alternating current;
the heat dissipation assembly includes: the heat dissipation device comprises a base plate, two bearing plates and a plurality of heat dissipation fins, wherein the base plate is arranged on the shell, the two bearing plates are oppositely arranged on two sides of the base plate, the heat dissipation fins are arranged on the base plate at intervals and distributed between the two bearing plates, and a heat dissipation groove is formed between every two adjacent heat dissipation fins.
2. The high heat dissipating inverter of claim 1, wherein the width of the heat dissipating fins decreases from a side connected to the base plate to a side away from the base plate.
3. The high heat dissipating inverter of claim 1, wherein each of the heat dissipating fins is vertically arranged on the base plate.
4. The high heat dissipation inverter of claim 1, wherein the width of the receiving plate is greater than the width of the heat dissipating fins.
5. The high heat dissipating inverter of claim 1, wherein each of the heat dissipating fins has a plurality of heat dissipating holes, and each adjacent two of the heat dissipating slots are connected to each other through the heat dissipating holes.
6. The high heat dissipating inverter of claim 1, wherein the base plate, the receiving plate, and the heat dissipating fins are integrally provided.
7. The high heat dissipation inverter of claim 1, wherein the heat dissipation fins are made of metal.
8. The high heat dissipation inverter of claim 1, wherein the base plate and the case are coupled by bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121284463.7U CN214708519U (en) | 2021-06-09 | 2021-06-09 | Inverter with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121284463.7U CN214708519U (en) | 2021-06-09 | 2021-06-09 | Inverter with high heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214708519U true CN214708519U (en) | 2021-11-12 |
Family
ID=78555417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121284463.7U Active CN214708519U (en) | 2021-06-09 | 2021-06-09 | Inverter with high heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214708519U (en) |
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2021
- 2021-06-09 CN CN202121284463.7U patent/CN214708519U/en active Active
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