CN217767383U - Computer equipment with air cooling structure - Google Patents
Computer equipment with air cooling structure Download PDFInfo
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- CN217767383U CN217767383U CN202222028561.5U CN202222028561U CN217767383U CN 217767383 U CN217767383 U CN 217767383U CN 202222028561 U CN202222028561 U CN 202222028561U CN 217767383 U CN217767383 U CN 217767383U
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- heat dissipation
- dissipation assembly
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- heat
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a computer device with an air cooling structure, which comprises a case and a main board, wherein the case comprises a bottom board and a side board, the main board is fixedly arranged on the bottom board, and the side board surrounds the main board and is fixedly arranged on the bottom board; the side plate is positioned above the main plate and is provided with a first heat dissipation assembly, so that the main plate is arranged in a first closed cavity structure formed by the bottom plate, the side plate and the first heat dissipation assembly; the heat exchange area is formed in the area where the first heat dissipation assembly is attached to the chip of the mainboard; a cover plate is arranged on the upper end surface covering the first heat dissipation assembly, and a second closed cavity structure is formed; an air inlet groove is formed in the position, opposite to the heat exchange area, of the cover plate, a second heat dissipation assembly is arranged at the position, located in the air inlet groove, of the first heat dissipation assembly, and circulating heat dissipation air paths are formed in the two sides of the first heat dissipation assembly through the second heat dissipation assembly. The utility model discloses satisfy and improve the heat dissipation demand that accompanies the increase of consumption heat to the calculation performance, reduce the requirement of equipment to weight and overall dimension.
Description
Technical Field
The utility model relates to a computer equipment technical field, concretely relates to take computer equipment of forced air cooling structure.
Background
At present, the board card of the domestic military computer is mainly a standard board card, has small volume and is convenient to be inserted into a case; the defects are as follows: the computer board card has large power consumption and large heat productivity, and needs the chassis to have a heat dissipation function, so that the chassis has a complex structure and large overall dimension, and the computer board card does not have an electromagnetic shielding function and also needs to be installed in the chassis to meet the requirements.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main objective aims at solving the technical problem that the above-mentioned exists to a certain extent, provides a take air-cooled structure's computer equipment.
The utility model discloses the above-mentioned problem that will solve is through following technical scheme in order to realize:
the computer equipment with the air cooling structure comprises a case and a main board, wherein the case comprises a bottom board and a side board, the main board is fixedly arranged on the bottom board, and the side board surrounds the main board and is fixedly arranged on the bottom board; the side plate is positioned above the main plate and is provided with a first heat dissipation assembly, so that the main plate is arranged in a first closed cavity structure formed by the bottom plate, the side plate and the first heat dissipation assembly; the first heat dissipation assembly and a chip-attached area of the mainboard form a heat exchange area; a cover plate is arranged on the upper end surface covering the first heat dissipation assembly, and a second closed cavity structure is formed; an air inlet groove is formed in the position, opposite to the heat exchange area, of the cover plate, a second heat dissipation assembly is arranged at the position, located in the air inlet groove, of the first heat dissipation assembly, and circulating heat dissipation air paths are formed in the two sides of the first heat dissipation assembly through the second heat dissipation assembly.
Preferably, the first heat dissipation assembly comprises a substrate, the substrate is assembled and connected with the side plates, a plurality of bosses extend downwards from one side end face of the substrate, and the bosses are attached to chips of the main board; the other end face of the substrate extends upwards to form a plurality of radiating fins, and a space avoiding area is formed at the position of the second radiating component; the top of the radiating fin is abutted to the cover plate.
Preferably, a heat conducting pad is arranged between the boss and the chip.
Preferably, the base plate, the boss and the heat sink are integrally formed.
Preferably, the second heat dissipation assembly is embedded in the heat sink.
Preferably, the second heat dissipation assembly adopts a heat dissipation fan.
Compared with the prior art, the technical scheme provided by the application has the following advantages:
the heat generated by the mainboard chip of the equipment is transferred to the first heat dissipation assembly to form heat exchange, so that the heat of the chip is prevented from being overhigh, meanwhile, the first heat dissipation assembly and the cover plate form a second closed cavity structure, the second heat dissipation assembly sucks external air into the second closed cavity structure from the air inlet groove and forms circulating heat dissipation air paths on two sides of the first heat dissipation assembly, and therefore forced convection heat dissipation is formed on the first heat dissipation assembly, the heat dissipation efficiency of the first heat dissipation assembly is improved, the heat dissipation requirement of the equipment for improving the calculation performance and increasing the power consumption heat is met, and the requirements of the equipment on weight and the overall dimension are reduced; the position of the mainboard is further reinforced through a first closed cavity structure formed by the bottom plate, the side plates and the first heat dissipation assembly, and the mainboard is positioned in a closed space to meet the requirement of electromagnetic shielding.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a structural diagram of a computer device with an air cooling structure according to the present invention;
fig. 2 is a structural diagram of a computer device with an air cooling structure according to the present invention.
The reference numbers indicate:
1-a main board; 2-a bottom plate; 3-side plate; 4-a first heat dissipation assembly; 5-a substrate; 6-boss; 7-a chip; 8-cover plate; 9-a heat sink; 10-a second heat dissipation assembly; 11-cooling air path; 12-heat conducting pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if the present invention relates to a directional indication (such as up, down, left, right, front, back, 8230 \8230;, 8230;), the directional indication is only used to explain the relative position relationship between the components in a specific posture, the motion situation, etc., and if the specific posture is changed, the directional indication is changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1-2, the present invention provides a computer device with an air cooling structure, which includes a case and a main board 1, wherein the case includes a bottom board 2 and a side board 3, the main board 1 is fixed on the bottom board 2, and the side board 3 surrounds the main board 1 and is fixed on the bottom board 2; a first heat dissipation assembly 4 is arranged on the side plate 3 above the main plate 1, the first heat dissipation assembly 4 comprises a substrate 5, and the substrate 5 is assembled and connected with the side plate 3, so that the main plate 1 is arranged in a first closed cavity structure formed by the bottom plate 2, the side plate 3 and the substrate 5; a plurality of bosses 6 extend downwards from one end face of the substrate 5, and the bosses 6 are attached to chips 7 of the main board 1; the area where the boss 6 is attached to the chip 7 of the main board 1 forms a heat exchange area.
Further, a cover plate 8 is arranged on the upper end face covering the substrate 5, and a second closed cavity structure is formed; an air inlet groove is formed in the position, opposite to the heat exchange area, of the cover plate 8, a plurality of radiating fins 9 extend upwards from the other end of the base plate 5, an air channel is formed between every two adjacent radiating fins 9, and the tops of the radiating fins 9 are abutted to the cover plate 8.
A second heat dissipation component 10 is arranged at the position, located in the air inlet groove, of the heat dissipation plate 9, the second heat dissipation component 10 is embedded in the heat dissipation plate 9, and the second heat dissipation component 10 adopts a heat dissipation fan; and forming a keep-out zone at a position of the second heat dissipation assembly 10; after the second heat dissipation assembly 10 sucks external air from the air inlet duct to the second sealed cavity structure, the air flows in the air channel formed by the heat dissipation fins 9, forced convection is performed on the air to both sides, so that circulating heat dissipation air paths 11 are formed on both sides of the substrate 5, heat of the chip 7 is transferred to the bosses 6 through the structure, and finally transferred to the heat dissipation fins 9 through the bosses 6, and air flow in the heat dissipation air paths 11 performs air cooling heat dissipation on the heat dissipation fins 9.
In this embodiment, the cover plate 8 is equivalent to an equipment housing, and the heat sink 9 is disposed on the substrate 5, so that the heat dissipation air path 11 and the motherboard 1 are completely isolated and independent, and therefore, impurities and dust during heat dissipation and cooling do not enter the first sealed cavity structure, thereby prolonging the service life of the motherboard 1.
The heat generated by a chip 7 of the equipment mainboard 1 is transferred to the boss 6, and is transferred to the radiating fins 9 from the boss 6 to form heat exchange, so that the phenomenon that the heat of the chip 7 is too high is avoided, meanwhile, the substrate 5 and the cover plate 8 form a second closed cavity structure, the second radiating assembly 10 sucks external air into the second closed cavity structure from the air inlet groove, and circulating radiating air paths 11 are formed on two sides of the substrate 5, so that forced convection radiating is formed on the radiating fins 9, the radiating efficiency of the substrate 5 is improved, the radiating requirement of the equipment on weight and the appearance size, which is increased along with power consumption heat, is met; the position of the main board 1 is further reinforced by a first closed cavity structure formed by the bottom board 2, the side boards 3 and the base board 5, and the main board 1 is positioned in a closed space to meet the requirement of electromagnetic shielding.
In order to improve the heat conduction effect, in this embodiment, a heat conduction pad 12 may be disposed between the boss 6 and the chip 7, and the substrate 5, the boss 6 and the heat sink 9 are integrally formed to reduce the interface thermal resistance between the materials.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (6)
1. A computer device with an air cooling structure is characterized by comprising a case and a main board, wherein the case comprises a bottom board and a side board, the main board is fixedly arranged on the bottom board, and the side board surrounds the main board and is fixedly arranged on the bottom board;
the side plate is positioned above the main plate and is provided with a first heat dissipation assembly, so that the main plate is arranged in a first closed cavity structure formed by the bottom plate, the side plate and the first heat dissipation assembly; the first heat dissipation assembly is attached to the chip of the mainboard to form a heat exchange area for transferring heat of the chip;
a cover plate is arranged on the upper end surface covering the first heat dissipation assembly, and a second closed cavity structure is formed; an air inlet groove is formed in the position, opposite to the heat exchange area, of the cover plate, a second heat dissipation assembly is arranged at the position, located on the air inlet groove, of the first heat dissipation assembly, and circulating heat dissipation air paths are formed in the two sides of the first heat dissipation assembly through the second heat dissipation assembly.
2. The computer equipment with the air cooling structure according to claim 1, wherein the first heat dissipation assembly comprises a base plate, the base plate is assembled and connected with the side plate, a plurality of bosses extend downwards from one side end face of the base plate, and the bosses are attached to chips of the main plate; the other end of the substrate extends upwards to form a plurality of radiating fins, and a space avoiding area is formed at the position of the second radiating component; the top of the radiating fin is abutted to the cover plate.
3. The computer equipment with the air cooling structure according to claim 2, wherein a heat conducting pad is disposed between the boss and the chip.
4. The computer equipment with the air cooling structure according to claim 2, wherein the base plate, the boss and the heat sink are integrally formed.
5. The computer device with an air-cooled structure of claim 2, wherein the second heat dissipation assembly is embedded in the heat sink.
6. The computer equipment with the air cooling structure as recited in claim 2, wherein the second heat dissipation assembly is a heat dissipation fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222028561.5U CN217767383U (en) | 2022-08-03 | 2022-08-03 | Computer equipment with air cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222028561.5U CN217767383U (en) | 2022-08-03 | 2022-08-03 | Computer equipment with air cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217767383U true CN217767383U (en) | 2022-11-08 |
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ID=83879463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222028561.5U Active CN217767383U (en) | 2022-08-03 | 2022-08-03 | Computer equipment with air cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217767383U (en) |
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2022
- 2022-08-03 CN CN202222028561.5U patent/CN217767383U/en active Active
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