CN108769838B

CN108769838B - Computer network LAN switch

Info

Publication number: CN108769838B
Application number: CN201810715820.7A
Authority: CN
Inventors: 潘万胜
Original assignee: Dongying Zhongda Petroleum Equipment Co ltd
Current assignee: DONGYING ZHONGDA PETROLEUM EQUIPMENT Co.,Ltd.
Priority date: 2018-07-03
Filing date: 2018-07-03
Publication date: 2022-01-28
Anticipated expiration: 2038-07-03
Also published as: CN108769838A

Abstract

The invention discloses a computer network local area network switch, which comprises a switch body, an air cooling and heat dissipating mechanism, jacks, a heat conducting mechanism and a water cooling mechanism, one side of the front surface of the exchanger body is provided with a jack, the two sides of the exchanger body are provided with radiating holes, the middle of the upper surface of the exchanger body is provided with an air-cooled heat dissipation mechanism which comprises heat dissipation holes and a mounting plate, the mounting plate penetrates through the diameter of the upper surface of the heat dissipation hole from left to right, the heat dissipation fan is fixed in the middle of the lower surface of the mounting plate, the heat dissipation device is provided with an air cooling heat dissipation mechanism, a heat conduction mechanism and a water cooling heat dissipation mechanism, the heat dissipation fan blows air towards the interior of the exchanger body, so that a part of the heat on the element is radiated from the heat radiation hole, and the other part is blown into the inner part of the heat collection cavity, therefore, the heat on the elements can be dissipated, and the phenomenon that the elements inside the switch body are overheated to shorten the service life of the switch is avoided.

Description

Computer network LAN switch

Technical Field

The invention relates to the technical field of switches, in particular to a heat dissipation method of a computer network local area network switch.

Background

The local area network switch refers to a device used in a switched local area network for data exchange, in a traditional ethernet network, only one station in the network can send data at any time, other stations can only receive information, and if the local area network switch wants to send data, the local area network switch can only back off and wait. Therefore, the fixed bandwidth of the shared ethernet is shared by all the stations on the network and randomly occupied, the more stations in the network, the narrower the bandwidth that can be averagely used by each station, and the slower the response speed of the network, and the internal components of the conventional local area network switch generate more heat when in use, and the failure of the heat dissipation can shorten the service life of the switch.

Disclosure of Invention

The invention aims to provide a heat dissipation method of a computer network local area network switch, which aims to solve the problem of poor heat dissipation effect of the local area network switch in the prior art.

In order to achieve the purpose, the invention provides the following technical scheme: a heat dissipation method of a computer network local area network switch comprises a switch body, an air cooling heat dissipation mechanism, jacks, a heat conduction mechanism and a water cooling mechanism, wherein the jacks are arranged on one side of the front surface of the switch body, first heat dissipation holes are formed in two sides of the switch body, the air cooling heat dissipation mechanism is arranged in the middle of the upper surface of the switch body and comprises second heat dissipation holes and a mounting plate, the mounting plate penetrates through the upper surface diameter of the second heat dissipation holes from left to right, a heat dissipation fan is fixed in the middle of the lower surface of the mounting plate, the heat conduction mechanism is fixed below the switch body, the water cooling mechanism is fixed below the heat conduction mechanism and comprises a water cooling box and a heat conduction column, cooling water is arranged inside the water cooling box, the heat conduction column penetrates through the water cooling box and comprises an exposed end and a water cooling part, the submerged part is positioned in the water cooling tank, and the exposed end is positioned outside the water cooling tank.

Preferably, the heat conduction mechanism comprises a bottom plate of the exchanger, heat collection cavities and heat conduction cylinders, the lower surface of the bottom plate of the exchanger is uniformly fixed with a plurality of heat conduction cylinders, the number of the heat conduction cylinders is not less than nine, and the heat collection cavities are arranged in the heat conduction cylinders.

Preferably, a sealing structure is arranged between the base plate of the exchanger and the water cooling tank, and the base plate of the exchanger and the water cooling tank are both made of heat-conducting metal.

Preferably, the exposed end and the submerged part are integrally formed, and both the exposed end and the submerged part are made of heat-conducting metal.

Compared with the prior art, the invention has the beneficial effects that: the heat dissipation device is provided with the air-cooling heat dissipation mechanism, the heat conduction mechanism and the water-cooling heat dissipation mechanism, and the heat dissipation fan blows air towards the interior of the switch body, so that part of heat on the element is dissipated from the first heat dissipation hole, and the other part of heat is blown into the interior of the heat collection cavity, so that the heat on the element can be dissipated, and the phenomenon that the service life of the switch is shortened due to overheating of the element in the switch body is avoided; the heat in the heat collection cavity is transferred to the cooling water through the heat conducting cylinder, so that the internal temperature of the heat collection cavity is reduced, the heat exchange efficiency in the heat collection cavity is high, and the heat conduction effect is good.

Drawings

FIG. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic view of the connection between the heat conducting mechanism and the water cooling mechanism according to the present invention.

Fig. 3 is a schematic structural diagram of the heat conducting mechanism according to the present invention.

Fig. 4 is a schematic structural diagram of the water cooling mechanism of the present invention.

In the figure: 1. a switch body; 2. an air-cooled heat dissipation mechanism; 21. a second heat dissipation hole; 22. a heat radiation fan; 23. mounting a plate; 3. a jack; 4. a heat conducting mechanism; 41. a chassis of the switch; 42. a heat collection cavity; 43. a heat conducting tube; 5. a water cooling mechanism; 51. a water cooling tank; 52. a heat-conducting column; 521. an exposed end; 522. a submerged portion; 53. cooling water; 6. a first heat dissipation hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 4, in an embodiment of the present invention, a heat dissipation method for a computer network local area network switch includes a switch body 1, an air-cooled heat dissipation mechanism 2, a jack 3, a heat conduction mechanism 4, and a water cooling mechanism 5, where the jack 3 is disposed on one side of a front surface of the switch body 1, first heat dissipation holes 6 are disposed on both sides of the switch body 1, the first heat dissipation holes 6 are used for dissipating heat, the air-cooled heat dissipation mechanism 2 is disposed in the middle of an upper surface of the switch body 1, the air-cooled heat dissipation mechanism 2 is used for dissipating heat of internal components of the switch body 1, the air-cooled heat dissipation mechanism 2 includes a second heat dissipation hole 21 and a mounting plate 23, the mounting plate 23 is used for mounting a heat dissipation fan 22, the mounting plate 23 penetrates the diameter of the upper surface of the second heat dissipation hole 21 from left to right, the heat dissipation fan 22 is fixed in the middle of a lower surface of the mounting plate 23, and the heat dissipation fan 22 is used for dissipating heat of the internal components of the switch body 1, a heat conducting mechanism 4 is fixed under the switch body 1, the heat conducting mechanism 4 comprises a switch bottom plate 41, a heat collecting cavity 42 and heat conducting cylinders 43, and a plurality of heat conducting cylinders 43 are uniformly fixed on the lower surface of the switch bottom plate 41, the switch bottom plate 41 is used for mounting components on one hand and transferring heat on the components to a water cooling mechanism 5 on the other hand, no less than nine heat conducting cylinders 43 are arranged, the heat collecting cavity 42 is arranged in the heat conducting cylinder 43, the heat collecting cavity 42 is used for collecting heat on the components blown away by the heat radiating fan 22 and transferring the heat to the water cooling mechanism 5 through the heat conducting cylinder 43, a water cooling mechanism 5 is fixed under the heat conducting mechanism 4, the water cooling mechanism 5 is used for dissipating heat on the components and the heat conducting mechanism 4, the water cooling mechanism 5 comprises a water cooling tank 51 and a heat conducting column 52, the water cooling tank 51 is used for storing water, the heat conducting column 52 is used for conducting heat to the atmosphere, and a sealing structure is arranged between the switch bottom plate 41 and the water cooling tank 51, the sealed switch bottom plate 41 and the water cooling tank 51 can avoid the leakage of cooling water 53, the switch bottom plate 41 and the water cooling tank 51 are both made of heat-conducting metal, the cooling water 53 is arranged in the water cooling tank 51, the cooling water 53 plays a role in cooling, the heat-conducting column 52 penetrates through the water cooling tank 51, the heat-conducting column 52 comprises an exposed end 521 and a submerged part 522, the submerged part 522 is located in the water cooling tank 51, and the exposed end 521 is located outside the water cooling tank 51.

The working principle of the invention is as follows: in the operation process of the local area network switch, the components inside the switch body 1 generate heat, the heat dissipation fan 22 blows air towards the inside of the switch body 1, so that a part of the heat on the components is dissipated from the first heat dissipation hole 6, another part of the heat is blown into the inside of the heat collection cavity 42, the heat inside the heat collection cavity 42 is transferred to the cooling water 53 through the heat conduction cylinder 43, so the internal temperature of the heat collection cavity 42 is reduced, the temperature on the components of the switch body 1 is reduced, and the heat inside the cooling water 53 is transferred to the exposed end 521 through the submerged part 522, so the heat of the cooling water 53 can also be dissipated to the atmosphere.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a computer network LAN switch, includes switch body (1), air-cooled heat dissipation mechanism (2), jack (3), heat conduction mechanism (4) and water-cooling mechanism (5), its characterized in that: the heat exchanger is characterized in that a jack (3) is arranged on one side of the front surface of the exchanger body (1), first heat dissipation holes (6) are formed in two sides of the exchanger body (1), an air-cooled heat dissipation mechanism (2) is arranged in the middle of the upper surface of the exchanger body (1), the air-cooled heat dissipation mechanism (2) comprises second heat dissipation holes (21) and a mounting plate (23), the mounting plate (23) penetrates through the diameter of the upper surface of the second heat dissipation holes (21) from left to right, a heat dissipation fan (22) is fixed in the middle of the lower surface of the mounting plate (23), a heat conduction mechanism (4) is fixed below the exchanger body (1), a water cooling mechanism (5) is fixed below the heat conduction mechanism (4), the water cooling mechanism (5) comprises a water cooling box (51) and a heat conduction column (52), cooling water (53) is arranged inside the water cooling box (51), and the heat conduction column (52) penetrates through the water cooling box (51), the heat conduction column (52) comprises an exposed end (521) and a submerged part (522), the submerged part (522) is positioned inside the water cooling tank (51), and the exposed end (521) is positioned outside the water cooling tank (51); the first heat dissipation hole (6) is positioned above the heat conduction column (52);

the heat conduction mechanism (4) comprises a base plate (41) of the exchanger, heat collection cavities (42) and heat conduction cylinders (43), a plurality of heat conduction cylinders (43) are uniformly fixed on the lower surface of the base plate (41) of the exchanger, no less than nine heat conduction cylinders (43) are arranged, and the heat collection cavities (42) are arranged in the heat conduction cylinders (43);

a sealing structure is arranged between the bottom plate (41) of the exchanger and the water cooling tank (51), and the bottom plate (41) of the exchanger and the water cooling tank (51) are both made of heat-conducting metal;

the exposed end (521) and the submerged part (522) are integrally formed, and the exposed end (521) and the submerged part (522) are both made of heat-conducting metal;

in the working process of the local area network switch, heat is generated by elements inside the switch body (1), the heat radiation fan (22) blows air towards the inside of the switch body (1), so that one part of the heat on the elements is radiated from the first heat radiation holes (6), the other part of the heat on the elements is blown into the inside of the heat collection cavity (42), the heat inside the heat collection cavity (42) is transferred to cooling water (53) through the heat conduction cylinder (43), so that the internal temperature of the heat collection cavity (42) is reduced, the temperature on the elements of the switch body (1) is reduced, the heat inside the cooling water (53) is transferred to the exposed end (521) through the submerged part (522), and the heat of the cooling water (53) can also be radiated to the atmosphere.