GB804297A - Improvements in or relating to cooling means for semi-conductor elements - Google Patents

Improvements in or relating to cooling means for semi-conductor elements

Info

Publication number
GB804297A
GB804297A GB24126/57A GB2412657A GB804297A GB 804297 A GB804297 A GB 804297A GB 24126/57 A GB24126/57 A GB 24126/57A GB 2412657 A GB2412657 A GB 2412657A GB 804297 A GB804297 A GB 804297A
Authority
GB
United Kingdom
Prior art keywords
relating
semi
cooling means
bearing
conductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24126/57A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Germany
BBC Brown Boveri France SA
Original Assignee
Brown Boveri und Cie AG Germany
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brown Boveri und Cie AG Germany, BBC Brown Boveri France SA filed Critical Brown Boveri und Cie AG Germany
Publication of GB804297A publication Critical patent/GB804297A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

804,297. Perkins tubes. BROWN BOVERI & CIE. A.G. July 30, 1957 [Aug. 11, 1956], No. 24126/57. Class 64(2) A Perkins tube device for cooling semiconductor elements 2 has a copper plate 1 bearing on the elements and bearing internal protuberances or fins and a copper wall 4 bearing external cooling fins 6. The liquid 5 in the tube may be water under reduced pressure so that it boils at about 70‹C.
GB24126/57A 1956-08-11 1957-07-30 Improvements in or relating to cooling means for semi-conductor elements Expired GB804297A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH804297X 1956-08-11

Publications (1)

Publication Number Publication Date
GB804297A true GB804297A (en) 1958-11-12

Family

ID=4537923

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24126/57A Expired GB804297A (en) 1956-08-11 1957-07-30 Improvements in or relating to cooling means for semi-conductor elements

Country Status (3)

Country Link
CH (1) CH342661A (en)
FR (1) FR1180845A (en)
GB (1) GB804297A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3215194A (en) * 1963-08-13 1965-11-02 Astro Dynamics Inc Heat sink and method of operating the same
US3270250A (en) * 1963-02-06 1966-08-30 Ariel R Davis Liquid vapor cooling of electrical components
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US4381818A (en) * 1977-12-19 1983-05-03 International Business Machines Corporation Porous film heat transfer
GB2151769A (en) * 1983-12-21 1985-07-24 Marconi Electronic Devices Heat sink arrangement
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US5582242A (en) * 1992-05-15 1996-12-10 Digital Equipment Corporation Thermosiphon for cooling a high power die
US5720338A (en) * 1993-09-10 1998-02-24 Aavid Laboratories, Inc. Two-phase thermal bag component cooler
GB2380057A (en) * 2001-09-19 2003-03-26 Thermosonic Technology Inc Heat dissipation structure with cavity for improved heat transfer
WO2006105220A1 (en) * 2005-03-28 2006-10-05 Intel Corporation Systems for improved passive liquid cooling
JP2015103798A (en) * 2013-11-27 2015-06-04 旭徳科技股▲ふん▼有限公司 Heat dissipation substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE75074T1 (en) * 1986-10-29 1992-05-15 Bbc Brown Boveri & Cie DEVICE FOR COOLING SEMICONDUCTOR COMPONENTS.

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270250A (en) * 1963-02-06 1966-08-30 Ariel R Davis Liquid vapor cooling of electrical components
US3215194A (en) * 1963-08-13 1965-11-02 Astro Dynamics Inc Heat sink and method of operating the same
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US4381818A (en) * 1977-12-19 1983-05-03 International Business Machines Corporation Porous film heat transfer
GB2151769A (en) * 1983-12-21 1985-07-24 Marconi Electronic Devices Heat sink arrangement
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
US5582242A (en) * 1992-05-15 1996-12-10 Digital Equipment Corporation Thermosiphon for cooling a high power die
US5720338A (en) * 1993-09-10 1998-02-24 Aavid Laboratories, Inc. Two-phase thermal bag component cooler
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
GB2380057A (en) * 2001-09-19 2003-03-26 Thermosonic Technology Inc Heat dissipation structure with cavity for improved heat transfer
WO2006105220A1 (en) * 2005-03-28 2006-10-05 Intel Corporation Systems for improved passive liquid cooling
US7677052B2 (en) 2005-03-28 2010-03-16 Intel Corporation Systems for improved passive liquid cooling
JP2015103798A (en) * 2013-11-27 2015-06-04 旭徳科技股▲ふん▼有限公司 Heat dissipation substrate

Also Published As

Publication number Publication date
FR1180845A (en) 1959-06-09
CH342661A (en) 1959-11-30

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