GB804297A - Improvements in or relating to cooling means for semi-conductor elements - Google Patents
Improvements in or relating to cooling means for semi-conductor elementsInfo
- Publication number
- GB804297A GB804297A GB24126/57A GB2412657A GB804297A GB 804297 A GB804297 A GB 804297A GB 24126/57 A GB24126/57 A GB 24126/57A GB 2412657 A GB2412657 A GB 2412657A GB 804297 A GB804297 A GB 804297A
- Authority
- GB
- United Kingdom
- Prior art keywords
- relating
- semi
- cooling means
- bearing
- conductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
804,297. Perkins tubes. BROWN BOVERI & CIE. A.G. July 30, 1957 [Aug. 11, 1956], No. 24126/57. Class 64(2) A Perkins tube device for cooling semiconductor elements 2 has a copper plate 1 bearing on the elements and bearing internal protuberances or fins and a copper wall 4 bearing external cooling fins 6. The liquid 5 in the tube may be water under reduced pressure so that it boils at about 70‹C.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH804297X | 1956-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB804297A true GB804297A (en) | 1958-11-12 |
Family
ID=4537923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB24126/57A Expired GB804297A (en) | 1956-08-11 | 1957-07-30 | Improvements in or relating to cooling means for semi-conductor elements |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH342661A (en) |
FR (1) | FR1180845A (en) |
GB (1) | GB804297A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3215194A (en) * | 1963-08-13 | 1965-11-02 | Astro Dynamics Inc | Heat sink and method of operating the same |
US3270250A (en) * | 1963-02-06 | 1966-08-30 | Ariel R Davis | Liquid vapor cooling of electrical components |
US4012770A (en) * | 1972-09-28 | 1977-03-15 | Dynatherm Corporation | Cooling a heat-producing electrical or electronic component |
US4381818A (en) * | 1977-12-19 | 1983-05-03 | International Business Machines Corporation | Porous film heat transfer |
GB2151769A (en) * | 1983-12-21 | 1985-07-24 | Marconi Electronic Devices | Heat sink arrangement |
US4730666A (en) * | 1986-04-30 | 1988-03-15 | International Business Machines Corporation | Flexible finned heat exchanger |
US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
US5582242A (en) * | 1992-05-15 | 1996-12-10 | Digital Equipment Corporation | Thermosiphon for cooling a high power die |
US5720338A (en) * | 1993-09-10 | 1998-02-24 | Aavid Laboratories, Inc. | Two-phase thermal bag component cooler |
GB2380057A (en) * | 2001-09-19 | 2003-03-26 | Thermosonic Technology Inc | Heat dissipation structure with cavity for improved heat transfer |
WO2006105220A1 (en) * | 2005-03-28 | 2006-10-05 | Intel Corporation | Systems for improved passive liquid cooling |
JP2015103798A (en) * | 2013-11-27 | 2015-06-04 | 旭徳科技股▲ふん▼有限公司 | Heat dissipation substrate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE75074T1 (en) * | 1986-10-29 | 1992-05-15 | Bbc Brown Boveri & Cie | DEVICE FOR COOLING SEMICONDUCTOR COMPONENTS. |
-
1956
- 1956-08-11 CH CH342661D patent/CH342661A/en unknown
-
1957
- 1957-07-30 GB GB24126/57A patent/GB804297A/en not_active Expired
- 1957-08-06 FR FR1180845D patent/FR1180845A/en not_active Expired
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3270250A (en) * | 1963-02-06 | 1966-08-30 | Ariel R Davis | Liquid vapor cooling of electrical components |
US3215194A (en) * | 1963-08-13 | 1965-11-02 | Astro Dynamics Inc | Heat sink and method of operating the same |
US4012770A (en) * | 1972-09-28 | 1977-03-15 | Dynatherm Corporation | Cooling a heat-producing electrical or electronic component |
US4381818A (en) * | 1977-12-19 | 1983-05-03 | International Business Machines Corporation | Porous film heat transfer |
GB2151769A (en) * | 1983-12-21 | 1985-07-24 | Marconi Electronic Devices | Heat sink arrangement |
US4730666A (en) * | 1986-04-30 | 1988-03-15 | International Business Machines Corporation | Flexible finned heat exchanger |
US5582242A (en) * | 1992-05-15 | 1996-12-10 | Digital Equipment Corporation | Thermosiphon for cooling a high power die |
US5720338A (en) * | 1993-09-10 | 1998-02-24 | Aavid Laboratories, Inc. | Two-phase thermal bag component cooler |
US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
GB2380057A (en) * | 2001-09-19 | 2003-03-26 | Thermosonic Technology Inc | Heat dissipation structure with cavity for improved heat transfer |
WO2006105220A1 (en) * | 2005-03-28 | 2006-10-05 | Intel Corporation | Systems for improved passive liquid cooling |
US7677052B2 (en) | 2005-03-28 | 2010-03-16 | Intel Corporation | Systems for improved passive liquid cooling |
JP2015103798A (en) * | 2013-11-27 | 2015-06-04 | 旭徳科技股▲ふん▼有限公司 | Heat dissipation substrate |
Also Published As
Publication number | Publication date |
---|---|
FR1180845A (en) | 1959-06-09 |
CH342661A (en) | 1959-11-30 |
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