FR1180845A - Refrigerant for cooling a semiconductor element - Google Patents

Refrigerant for cooling a semiconductor element

Info

Publication number
FR1180845A
FR1180845A FR1180845DA FR1180845A FR 1180845 A FR1180845 A FR 1180845A FR 1180845D A FR1180845D A FR 1180845DA FR 1180845 A FR1180845 A FR 1180845A
Authority
FR
France
Prior art keywords
refrigerant
cooling
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri France SA filed Critical BBC Brown Boveri AG Switzerland
Application granted granted Critical
Publication of FR1180845A publication Critical patent/FR1180845A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR1180845D 1956-08-11 1957-08-06 Refrigerant for cooling a semiconductor element Expired FR1180845A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH804297X 1956-08-11

Publications (1)

Publication Number Publication Date
FR1180845A true FR1180845A (en) 1959-06-09

Family

ID=4537923

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1180845D Expired FR1180845A (en) 1956-08-11 1957-08-06 Refrigerant for cooling a semiconductor element

Country Status (3)

Country Link
CH (1) CH342661A (en)
FR (1) FR1180845A (en)
GB (1) GB804297A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270250A (en) * 1963-02-06 1966-08-30 Ariel R Davis Liquid vapor cooling of electrical components
US3215194A (en) * 1963-08-13 1965-11-02 Astro Dynamics Inc Heat sink and method of operating the same
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US4381818A (en) * 1977-12-19 1983-05-03 International Business Machines Corporation Porous film heat transfer
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
ATE75074T1 (en) * 1986-10-29 1992-05-15 Bbc Brown Boveri & Cie DEVICE FOR COOLING SEMICONDUCTOR COMPONENTS.
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
GB2380057A (en) * 2001-09-19 2003-03-26 Thermosonic Technology Inc Heat dissipation structure with cavity for improved heat transfer
US7677052B2 (en) * 2005-03-28 2010-03-16 Intel Corporation Systems for improved passive liquid cooling
TWI462693B (en) * 2013-11-27 2014-11-21 Subtron Technology Co Ltd Heat dissipation substrate

Also Published As

Publication number Publication date
GB804297A (en) 1958-11-12
CH342661A (en) 1959-11-30

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