CH342661A - Cooler for cooling a semiconductor element - Google Patents

Cooler for cooling a semiconductor element

Info

Publication number
CH342661A
CH342661A CH342661DA CH342661A CH 342661 A CH342661 A CH 342661A CH 342661D A CH342661D A CH 342661DA CH 342661 A CH342661 A CH 342661A
Authority
CH
Switzerland
Prior art keywords
cooler
cooling
semiconductor element
semiconductor
Prior art date
Application number
Other languages
German (de)
Inventor
Schaerli Otto
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH342661A publication Critical patent/CH342661A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH342661D 1956-08-11 1956-08-11 Cooler for cooling a semiconductor element CH342661A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH804297X 1956-08-11

Publications (1)

Publication Number Publication Date
CH342661A true CH342661A (en) 1959-11-30

Family

ID=4537923

Family Applications (1)

Application Number Title Priority Date Filing Date
CH342661D CH342661A (en) 1956-08-11 1956-08-11 Cooler for cooling a semiconductor element

Country Status (3)

Country Link
CH (1) CH342661A (en)
FR (1) FR1180845A (en)
GB (1) GB804297A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0268081A1 (en) * 1986-10-29 1988-05-25 BBC Brown Boveri AG Cooling device for semiconductor components

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270250A (en) * 1963-02-06 1966-08-30 Ariel R Davis Liquid vapor cooling of electrical components
US3215194A (en) * 1963-08-13 1965-11-02 Astro Dynamics Inc Heat sink and method of operating the same
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US4381818A (en) * 1977-12-19 1983-05-03 International Business Machines Corporation Porous film heat transfer
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
GB2380057A (en) * 2001-09-19 2003-03-26 Thermosonic Technology Inc Heat dissipation structure with cavity for improved heat transfer
US7677052B2 (en) * 2005-03-28 2010-03-16 Intel Corporation Systems for improved passive liquid cooling
TWI462693B (en) * 2013-11-27 2014-11-21 Subtron Technology Co Ltd Heat dissipation substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0268081A1 (en) * 1986-10-29 1988-05-25 BBC Brown Boveri AG Cooling device for semiconductor components

Also Published As

Publication number Publication date
FR1180845A (en) 1959-06-09
GB804297A (en) 1958-11-12

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