CH342661A - Kühler für die Kühlung eines Halbleiterelementes - Google Patents
Kühler für die Kühlung eines HalbleiterelementesInfo
- Publication number
- CH342661A CH342661A CH342661DA CH342661A CH 342661 A CH342661 A CH 342661A CH 342661D A CH342661D A CH 342661DA CH 342661 A CH342661 A CH 342661A
- Authority
- CH
- Switzerland
- Prior art keywords
- cooler
- cooling
- semiconductor element
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH804297X | 1956-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH342661A true CH342661A (de) | 1959-11-30 |
Family
ID=4537923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH342661D CH342661A (de) | 1956-08-11 | 1956-08-11 | Kühler für die Kühlung eines Halbleiterelementes |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH342661A (de) |
FR (1) | FR1180845A (de) |
GB (1) | GB804297A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0268081A1 (de) * | 1986-10-29 | 1988-05-25 | BBC Brown Boveri AG | Vorrichtung zur Kühlung von Halbleiterbauelementen |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3270250A (en) * | 1963-02-06 | 1966-08-30 | Ariel R Davis | Liquid vapor cooling of electrical components |
US3215194A (en) * | 1963-08-13 | 1965-11-02 | Astro Dynamics Inc | Heat sink and method of operating the same |
US4012770A (en) * | 1972-09-28 | 1977-03-15 | Dynatherm Corporation | Cooling a heat-producing electrical or electronic component |
US4381818A (en) * | 1977-12-19 | 1983-05-03 | International Business Machines Corporation | Porous film heat transfer |
GB2151769B (en) * | 1983-12-21 | 1987-11-04 | Marconi Electronic Devices | Heat sink arrangement |
US4730666A (en) * | 1986-04-30 | 1988-03-15 | International Business Machines Corporation | Flexible finned heat exchanger |
US5629840A (en) * | 1992-05-15 | 1997-05-13 | Digital Equipment Corporation | High powered die with bus bars |
US5485671A (en) * | 1993-09-10 | 1996-01-23 | Aavid Laboratories, Inc. | Method of making a two-phase thermal bag component cooler |
US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
GB2380057A (en) * | 2001-09-19 | 2003-03-26 | Thermosonic Technology Inc | Heat dissipation structure with cavity for improved heat transfer |
US7677052B2 (en) | 2005-03-28 | 2010-03-16 | Intel Corporation | Systems for improved passive liquid cooling |
TWI462693B (zh) * | 2013-11-27 | 2014-11-21 | Subtron Technology Co Ltd | 散熱基板 |
-
1956
- 1956-08-11 CH CH342661D patent/CH342661A/de unknown
-
1957
- 1957-07-30 GB GB24126/57A patent/GB804297A/en not_active Expired
- 1957-08-06 FR FR1180845D patent/FR1180845A/fr not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0268081A1 (de) * | 1986-10-29 | 1988-05-25 | BBC Brown Boveri AG | Vorrichtung zur Kühlung von Halbleiterbauelementen |
Also Published As
Publication number | Publication date |
---|---|
FR1180845A (fr) | 1959-06-09 |
GB804297A (en) | 1958-11-12 |
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