CH342658A - Kühlvorrichtung für Halbleiteranordnungen, insbesondere für p-n-Leistungsgleichrichter - Google Patents

Kühlvorrichtung für Halbleiteranordnungen, insbesondere für p-n-Leistungsgleichrichter

Info

Publication number
CH342658A
CH342658A CH342658DA CH342658A CH 342658 A CH342658 A CH 342658A CH 342658D A CH342658D A CH 342658DA CH 342658 A CH342658 A CH 342658A
Authority
CH
Switzerland
Prior art keywords
cooling device
semiconductor arrangements
power rectifiers
rectifiers
arrangements
Prior art date
Application number
Other languages
English (en)
Inventor
R Camp Henry
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH342658A publication Critical patent/CH342658A/de

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/34Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely
    • F28F1/36Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely the means being helically wound fins or wire spirals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH342658D 1954-10-04 1955-10-03 Kühlvorrichtung für Halbleiteranordnungen, insbesondere für p-n-Leistungsgleichrichter CH342658A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US460163A US2883591A (en) 1954-10-04 1954-10-04 Semiconductor rectifier device

Publications (1)

Publication Number Publication Date
CH342658A true CH342658A (de) 1959-11-30

Family

ID=23827610

Family Applications (1)

Application Number Title Priority Date Filing Date
CH342658D CH342658A (de) 1954-10-04 1955-10-03 Kühlvorrichtung für Halbleiteranordnungen, insbesondere für p-n-Leistungsgleichrichter

Country Status (3)

Country Link
US (1) US2883591A (de)
CH (1) CH342658A (de)
DE (1) DE1093022B (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2958021A (en) * 1958-04-23 1960-10-25 Texas Instruments Inc Cooling arrangement for transistor
CH379645A (de) * 1960-09-08 1964-07-15 Oerlikon Maschf Halbleitergleichrichteranlage
US3259804A (en) * 1962-04-26 1966-07-05 Burroughs Corp Electrical module with means for dissipating heat
US3328642A (en) * 1964-06-08 1967-06-27 Sylvania Electric Prod Temperature control means utilizing a heat reservoir containing meltable material
US3303432A (en) * 1966-04-18 1967-02-07 Gen Electric High power semiconductor laser devices
US3382313A (en) * 1966-07-06 1968-05-07 Army Usa Cooling means for electrical power conversion system
US3595304A (en) * 1967-09-15 1971-07-27 Monsanto Co Organic fluids for heat pipes
US3633665A (en) * 1970-05-11 1972-01-11 Atomic Energy Commission Heat exchanger using thermal convection tubes
FR2320501A1 (fr) * 1975-08-05 1977-03-04 Commissariat Energie Atomique Dispositif pour le chauffage de batiments
US4171088A (en) * 1975-08-05 1979-10-16 Commissariat A L'energie Atomique System for heating buildings
FR2366697A1 (fr) * 1975-10-30 1978-04-28 Alsthom Atlantique Semi-conducteur de puissance non encapsule
US4695924A (en) * 1986-07-17 1987-09-22 Zenith Electronics Corporation Two piece heat sink with serrated coupling
FR2604827B1 (fr) * 1986-10-06 1989-12-29 Alsthom Dispositif de refroidissement par vaporisation pour semi-conducteurs de puissance
US4944344A (en) * 1988-10-31 1990-07-31 Sundstrand Corporation Hermetically sealed modular electronic cold plate utilizing reflux cooling
US4941530A (en) * 1989-01-13 1990-07-17 Sundstrand Corporation Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
US6986383B2 (en) * 2004-03-30 2006-01-17 Hul-Chun Hsu End surface structure of a heat pipe for contact with a heat source
US6973964B2 (en) * 2004-03-30 2005-12-13 Hsu Hul-Chun End surface structure of heat pipe for contact with a heat source
CN2705893Y (zh) * 2004-05-26 2005-06-22 鸿富锦精密工业(深圳)有限公司 相变化散热器
US7677052B2 (en) * 2005-03-28 2010-03-16 Intel Corporation Systems for improved passive liquid cooling
US20060278370A1 (en) * 2005-06-08 2006-12-14 Uwe Rockenfeller Heat spreader for cooling electronic components
US20080245510A1 (en) * 2005-11-04 2008-10-09 Delta Electronics, Inc. Heat dissipation apparatus, two-phase heat exchange device and manufacturing method thereof
US7766076B2 (en) * 2007-03-23 2010-08-03 Rocky Research Spot cooler for heat generating electronic components
MX2012011537A (es) 2010-04-05 2013-01-29 Cooper Technologies Co Montajes de iluminación que tienen transferencia de calor direccional controlada.
JP6267639B2 (ja) * 2011-09-28 2018-01-24 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. 無冷媒mriマグネットに対する非常に効率的な熱交換器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2189617A (en) * 1940-02-06 Method and device for cooling me
DE758005C (de) * 1938-02-16 1952-06-26 Siemens Schuckertwerke A G Bemessung einer Kuehleinrichtung fuer verschieden stark belastete Trockengleichrichterelemente mit negativem Temperaturkoeffizienten des Widerstandes und Anord-nung an der Kuehleinrichtung
DE891425C (de) * 1938-09-28 1953-09-28 Aeg Einrichtung zum Betrieb von Trockengleichrichtern
CH217615A (de) * 1939-06-02 1941-10-31 Philips Nv Vorrichtung mit künstlich gekühlten Sperrschichtelektrodensystemen.
US2288341A (en) * 1939-06-02 1942-06-30 Hartford Nat Bank & Trust Co Blocking layer electrode system
NL60514C (de) * 1941-01-27
US2345499A (en) * 1941-06-06 1944-03-28 Union Switch & Signal Co Alternating current rectifier apparatus for the dry surface contact type
DE823765C (de) * 1949-07-28 1951-12-06 Siemens Schuckertwerke A G Kuehleinrichtung fuer elektrische Geraete, insbesondere fuer Trockengleichrichter
FR1050940A (fr) * 1952-02-19 1954-01-12 Westinghouse Freins & Signaux élément redresseur protégé contre les agents extérieurs

Also Published As

Publication number Publication date
DE1093022B (de) 1960-11-17
US2883591A (en) 1959-04-21

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