CH353085A - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
CH353085A
CH353085A CH353085DA CH353085A CH 353085 A CH353085 A CH 353085A CH 353085D A CH353085D A CH 353085DA CH 353085 A CH353085 A CH 353085A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
Other languages
English (en)
Inventor
Dolder Robert
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH353085A publication Critical patent/CH353085A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Ink Jet (AREA)
CH353085D 1956-07-27 1957-07-25 Halbleitervorrichtung CH353085A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL209354 1956-07-27

Publications (1)

Publication Number Publication Date
CH353085A true CH353085A (de) 1961-03-31

Family

ID=19750776

Family Applications (1)

Application Number Title Priority Date Filing Date
CH353085D CH353085A (de) 1956-07-27 1957-07-25 Halbleitervorrichtung

Country Status (6)

Country Link
US (1) US2922935A (de)
BE (1) BE559579A (de)
CH (1) CH353085A (de)
DE (1) DE1776920U (de)
FR (1) FR1180097A (de)
NL (2) NL209354A (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018539A (en) * 1956-11-06 1962-01-30 Motorola Inc Diffused base transistor and method of making same
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
US3018424A (en) * 1959-05-28 1962-01-23 Westinghouse Electric Corp Rectifier apparatus
US3117179A (en) * 1959-07-24 1964-01-07 Clevite Corp Transistor capsule and header therefor
US3020454A (en) * 1959-11-09 1962-02-06 Solid State Products Inc Sealing of electrical semiconductor devices
US3024519A (en) * 1960-07-19 1962-03-13 Bendix Corp Cold weld semiconductor housing
US3261904A (en) * 1963-09-16 1966-07-19 United Aircraft Corp Transistor mounting and heat transfer apparatus with adjustable pressure detachable mounting means
US4143395A (en) * 1976-10-15 1979-03-06 Tokyo Shibaura Electric Co., Ltd. Stud-type semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2820929A (en) * 1958-01-21 Transistor holders
US2609426A (en) * 1948-11-01 1952-09-02 Hartford Nat Bank & Trust Co Electrolytic condenser
US2790940A (en) * 1955-04-22 1957-04-30 Bell Telephone Labor Inc Silicon rectifier and method of manufacture

Also Published As

Publication number Publication date
FR1180097A (fr) 1959-06-01
DE1776920U (de) 1958-11-06
NL106417C (de)
BE559579A (de)
NL209354A (de)
US2922935A (en) 1960-01-26

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