JPS57128046A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57128046A
JPS57128046A JP1295981A JP1295981A JPS57128046A JP S57128046 A JPS57128046 A JP S57128046A JP 1295981 A JP1295981 A JP 1295981A JP 1295981 A JP1295981 A JP 1295981A JP S57128046 A JPS57128046 A JP S57128046A
Authority
JP
Japan
Prior art keywords
heat sink
cap
disc
base
property
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1295981A
Other languages
Japanese (ja)
Inventor
Hiroshi Ozaki
Takayuki Okinaga
Yoshiaki Emoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP1295981A priority Critical patent/JPS57128046A/en
Publication of JPS57128046A publication Critical patent/JPS57128046A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain preferable heat sink property of a semiconductor device by forming the cap of a package of oxidized Be. CONSTITUTION:A heat sink mechanism is provided with a Cu stud 12, an MO disc 14 and a metallic ring 16 at the lower center of the base 10 of a package. A pellet 18 is mounted on the disc 14. A lead frame 20 is provided at the upper side of the base 10, and a cap 24 is hermetially sealed wit glass material 22 above the frame. This cap 24 is composed of BeO having very good heat sink property. Accordingly, the heat generated from the pellet 18 can be radiated not only from the base side heat sink mechanism such as the disc 14, the stud or the like, but from the cap 24 side, thereby obtaining extremely preferable heat sink property.
JP1295981A 1981-02-02 1981-02-02 Semiconductor device Pending JPS57128046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1295981A JPS57128046A (en) 1981-02-02 1981-02-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1295981A JPS57128046A (en) 1981-02-02 1981-02-02 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57128046A true JPS57128046A (en) 1982-08-09

Family

ID=11819793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1295981A Pending JPS57128046A (en) 1981-02-02 1981-02-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57128046A (en)

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