JPS5623755A - Assembly of semiconductor device - Google Patents

Assembly of semiconductor device

Info

Publication number
JPS5623755A
JPS5623755A JP9729779A JP9729779A JPS5623755A JP S5623755 A JPS5623755 A JP S5623755A JP 9729779 A JP9729779 A JP 9729779A JP 9729779 A JP9729779 A JP 9729779A JP S5623755 A JPS5623755 A JP S5623755A
Authority
JP
Japan
Prior art keywords
glass
sealing
sealed
solder
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9729779A
Other languages
Japanese (ja)
Inventor
Yoshio Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9729779A priority Critical patent/JPS5623755A/en
Publication of JPS5623755A publication Critical patent/JPS5623755A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enhance the sealing strength of a semiconductor device by preventing a glass or a solder of a sealing unit from being extruded out of a container owing to decomposed gas produced from the resin on the surface of a pellet by employing the glass or the solder of lower softening point than the decomposed gas generating temperature when sealing the semiconductor pellet in the container. CONSTITUTION:A semiconductor pellet 1 is secured onto the base 2 of a ceramic package, is connected through a wire 4, and is coated with resin 5. Then, a lid 7 having vent hole 6 is sealed with high melting point glass 8. The hole 6 is sealed with suitable lid 9 and low melting point glass or solder 10. This configuration can seal the base 2 and the lid 7 with high softening point glass, and the sealing glass can effectively prevent the decomposed gas of the resin from being externally extruded. Since no externally led wire exists in the hole 6, it can be sufficiently sealed with low softening point glass. Accordingly, said procedure can obtain a highly reliable airtight sealed body.
JP9729779A 1979-08-01 1979-08-01 Assembly of semiconductor device Pending JPS5623755A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9729779A JPS5623755A (en) 1979-08-01 1979-08-01 Assembly of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9729779A JPS5623755A (en) 1979-08-01 1979-08-01 Assembly of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5623755A true JPS5623755A (en) 1981-03-06

Family

ID=14188554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9729779A Pending JPS5623755A (en) 1979-08-01 1979-08-01 Assembly of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5623755A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188850A (en) * 1981-05-15 1982-11-19 Matsushita Electric Ind Co Ltd Sealing method for semiconductor element
JPS58106956U (en) * 1982-01-18 1983-07-21 沖電気工業株式会社 storage container
JPS6199483U (en) * 1984-12-04 1986-06-25
WO2005109528A1 (en) * 2004-05-12 2005-11-17 Hamamatsu Photonics K.K. Electronic part and method of producing the same
JP2015029145A (en) * 2014-10-14 2015-02-12 オリンパス株式会社 Mounting structure and manufacturing method of imaging unit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188850A (en) * 1981-05-15 1982-11-19 Matsushita Electric Ind Co Ltd Sealing method for semiconductor element
JPS58106956U (en) * 1982-01-18 1983-07-21 沖電気工業株式会社 storage container
JPS6199483U (en) * 1984-12-04 1986-06-25
JPH056064Y2 (en) * 1984-12-04 1993-02-17
WO2005109528A1 (en) * 2004-05-12 2005-11-17 Hamamatsu Photonics K.K. Electronic part and method of producing the same
JP2005327818A (en) * 2004-05-12 2005-11-24 Hamamatsu Photonics Kk Electronic part and its manufacturing method
JP4598432B2 (en) * 2004-05-12 2010-12-15 浜松ホトニクス株式会社 Electronic component and manufacturing method thereof
JP2015029145A (en) * 2014-10-14 2015-02-12 オリンパス株式会社 Mounting structure and manufacturing method of imaging unit

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