JPS57196612A - Airtight package for quartz oscillator - Google Patents

Airtight package for quartz oscillator

Info

Publication number
JPS57196612A
JPS57196612A JP8094281A JP8094281A JPS57196612A JP S57196612 A JPS57196612 A JP S57196612A JP 8094281 A JP8094281 A JP 8094281A JP 8094281 A JP8094281 A JP 8094281A JP S57196612 A JPS57196612 A JP S57196612A
Authority
JP
Japan
Prior art keywords
projections
base
case
quartz oscillator
airtight package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8094281A
Other languages
Japanese (ja)
Inventor
Tadayoshi Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Denka Inc
Original Assignee
Fuji Denka Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Denka Inc filed Critical Fuji Denka Inc
Priority to JP8094281A priority Critical patent/JPS57196612A/en
Publication of JPS57196612A publication Critical patent/JPS57196612A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To increase the airtightness and to reduce the cost of products, by realizing a cold weld with a case by taking the material of the base as ''Kovar ''. CONSTITUTION:Holes 13 and 13 to which lead wires 17 and 17 are inserted are made on an upper part 12 of a base 11 formed with ''Kovar '' and projections 14 for cold weld are provided to an opening side ridges. Sintering glass 16 is filled in an inside space 15 of the base 11 to fix the leads 17 and 17. A case 20 made of nickel or aluminum is formed with projections 22 for cold weld at the open ridge of a package 21. The lower surface of the projections 14 of the base 11 is overlapped on the upper surface of the projections 22 of the case 20 and the overlapped part is welded with cold welding.
JP8094281A 1981-05-29 1981-05-29 Airtight package for quartz oscillator Pending JPS57196612A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8094281A JPS57196612A (en) 1981-05-29 1981-05-29 Airtight package for quartz oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8094281A JPS57196612A (en) 1981-05-29 1981-05-29 Airtight package for quartz oscillator

Publications (1)

Publication Number Publication Date
JPS57196612A true JPS57196612A (en) 1982-12-02

Family

ID=13732535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8094281A Pending JPS57196612A (en) 1981-05-29 1981-05-29 Airtight package for quartz oscillator

Country Status (1)

Country Link
JP (1) JPS57196612A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183023U (en) * 1983-05-23 1984-12-06 株式会社 フジ電科 airtight terminal
JPS63140718U (en) * 1986-10-29 1988-09-16

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340774B2 (en) * 1973-08-31 1978-10-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340774B2 (en) * 1973-08-31 1978-10-28

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183023U (en) * 1983-05-23 1984-12-06 株式会社 フジ電科 airtight terminal
JPS63140718U (en) * 1986-10-29 1988-09-16

Similar Documents

Publication Publication Date Title
US4105861A (en) Hermetically sealed container for semiconductor and other electronic devices
ES2002136A6 (en) Side sealed thermoplastic bag.
DE3275371D1 (en) Box with a sealable closure forming a container for different products
JPS57196612A (en) Airtight package for quartz oscillator
JPS56103452A (en) Semiconductor device
JPS54146985A (en) Package for semiconductor device
IT8620025A0 (en) METALLIC CONTAINER WITH HERMETIC CLOSING CAP.
USD283313S (en) Liquid sample container cap with a filler tube
JPS54146986A (en) Package for semiconductor device
JPS5623755A (en) Assembly of semiconductor device
JPS57166718A (en) Oscillator unit
JPH0238208B2 (en)
JPS56158518A (en) Quartz oscillator
DE3863362D1 (en) CUTTING WITH FOLDING LINES FOR A CONTAINER.
JPS5620323A (en) Container for miniature quartz oscillator
JPS6315621U (en)
JPS54155768A (en) Manufacture of semiconductor device
JPS5643812A (en) Piezoelectric holder
JPS6334275Y2 (en)
JPS5492086A (en) Thin-gauge crystal oscillator
JPH01187839A (en) Laminated ceramic vessel for semiconductor element
JPS646562A (en) Airtight sealing
JPS57136899A (en) Airtight package for piezoelectric oscillator and its manufacture
ATE77335T1 (en) PACKAGING FOR TWO COMPONENT PRODUCTS.
JPS5777465A (en) Thermally sealed package which is easily unsealed