JPS57196612A - Airtight package for quartz oscillator - Google Patents
Airtight package for quartz oscillatorInfo
- Publication number
- JPS57196612A JPS57196612A JP8094281A JP8094281A JPS57196612A JP S57196612 A JPS57196612 A JP S57196612A JP 8094281 A JP8094281 A JP 8094281A JP 8094281 A JP8094281 A JP 8094281A JP S57196612 A JPS57196612 A JP S57196612A
- Authority
- JP
- Japan
- Prior art keywords
- projections
- base
- case
- quartz oscillator
- airtight package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
PURPOSE:To increase the airtightness and to reduce the cost of products, by realizing a cold weld with a case by taking the material of the base as ''Kovar ''. CONSTITUTION:Holes 13 and 13 to which lead wires 17 and 17 are inserted are made on an upper part 12 of a base 11 formed with ''Kovar '' and projections 14 for cold weld are provided to an opening side ridges. Sintering glass 16 is filled in an inside space 15 of the base 11 to fix the leads 17 and 17. A case 20 made of nickel or aluminum is formed with projections 22 for cold weld at the open ridge of a package 21. The lower surface of the projections 14 of the base 11 is overlapped on the upper surface of the projections 22 of the case 20 and the overlapped part is welded with cold welding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8094281A JPS57196612A (en) | 1981-05-29 | 1981-05-29 | Airtight package for quartz oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8094281A JPS57196612A (en) | 1981-05-29 | 1981-05-29 | Airtight package for quartz oscillator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57196612A true JPS57196612A (en) | 1982-12-02 |
Family
ID=13732535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8094281A Pending JPS57196612A (en) | 1981-05-29 | 1981-05-29 | Airtight package for quartz oscillator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57196612A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59183023U (en) * | 1983-05-23 | 1984-12-06 | 株式会社 フジ電科 | airtight terminal |
JPS63140718U (en) * | 1986-10-29 | 1988-09-16 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5340774B2 (en) * | 1973-08-31 | 1978-10-28 |
-
1981
- 1981-05-29 JP JP8094281A patent/JPS57196612A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5340774B2 (en) * | 1973-08-31 | 1978-10-28 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59183023U (en) * | 1983-05-23 | 1984-12-06 | 株式会社 フジ電科 | airtight terminal |
JPS63140718U (en) * | 1986-10-29 | 1988-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4105861A (en) | Hermetically sealed container for semiconductor and other electronic devices | |
ES2002136A6 (en) | Side sealed thermoplastic bag. | |
DE3275371D1 (en) | Box with a sealable closure forming a container for different products | |
JPS57196612A (en) | Airtight package for quartz oscillator | |
JPS56103452A (en) | Semiconductor device | |
JPS54146985A (en) | Package for semiconductor device | |
IT8620025A0 (en) | METALLIC CONTAINER WITH HERMETIC CLOSING CAP. | |
USD283313S (en) | Liquid sample container cap with a filler tube | |
JPS54146986A (en) | Package for semiconductor device | |
JPS5623755A (en) | Assembly of semiconductor device | |
JPS57166718A (en) | Oscillator unit | |
JPH0238208B2 (en) | ||
JPS56158518A (en) | Quartz oscillator | |
DE3863362D1 (en) | CUTTING WITH FOLDING LINES FOR A CONTAINER. | |
JPS5620323A (en) | Container for miniature quartz oscillator | |
JPS6315621U (en) | ||
JPS54155768A (en) | Manufacture of semiconductor device | |
JPS5643812A (en) | Piezoelectric holder | |
JPS6334275Y2 (en) | ||
JPS5492086A (en) | Thin-gauge crystal oscillator | |
JPH01187839A (en) | Laminated ceramic vessel for semiconductor element | |
JPS646562A (en) | Airtight sealing | |
JPS57136899A (en) | Airtight package for piezoelectric oscillator and its manufacture | |
ATE77335T1 (en) | PACKAGING FOR TWO COMPONENT PRODUCTS. | |
JPS5777465A (en) | Thermally sealed package which is easily unsealed |