JPS54146986A - Package for semiconductor device - Google Patents
Package for semiconductor deviceInfo
- Publication number
- JPS54146986A JPS54146986A JP5449978A JP5449978A JPS54146986A JP S54146986 A JPS54146986 A JP S54146986A JP 5449978 A JP5449978 A JP 5449978A JP 5449978 A JP5449978 A JP 5449978A JP S54146986 A JPS54146986 A JP S54146986A
- Authority
- JP
- Japan
- Prior art keywords
- light transmission
- frame
- face
- assembly
- airtightness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To improve the light transfer characteristic of a light transmission part and airtightness by providing a sapphire plate for light transmission in the upper face or the lower face side so that a window part may be sealed and supperposing frame materials to each other and welding and sealing them to perform a low- temperature sealing.
CONSTITUTION: Base assembly 10 is provided with a ceramic base having a semiconductor chip arrangement part in the face side opposite to cap assembly 30 and bar-shaped material 20 which is fixed onto the ceramic base above while surrounding the chip arrangement part and can be welded. Then, assembly 30 is provided with frame material 31 which should be superposed to frame part 20 and can be welded and sapphire plate 34 for light transmission in the upper face or the lower side face so that the window may be enclosed, and frame materials 20 and 31 are superposed to each other and are sealed by welding. As a result, a low-temperature sealing is performed, so that the light transfer characteristic of the light transmission part and airtightness can be improved.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5449978A JPS54146986A (en) | 1978-05-10 | 1978-05-10 | Package for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5449978A JPS54146986A (en) | 1978-05-10 | 1978-05-10 | Package for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54146986A true JPS54146986A (en) | 1979-11-16 |
JPS62581B2 JPS62581B2 (en) | 1987-01-08 |
Family
ID=12972317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5449978A Granted JPS54146986A (en) | 1978-05-10 | 1978-05-10 | Package for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54146986A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61220460A (en) * | 1985-03-27 | 1986-09-30 | Matsushita Electric Ind Co Ltd | Semiconductor device |
US4635093A (en) * | 1985-06-03 | 1987-01-06 | General Electric Company | Electrical connection |
US6420205B1 (en) | 1999-03-24 | 2002-07-16 | Kyocera Corporation | Method for producing package for housing photosemiconductor element |
JP2007094049A (en) * | 2005-09-29 | 2007-04-12 | Shinko Electric Ind Co Ltd | Cap for optical component and method of manufacturing same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100414185B1 (en) * | 2000-10-09 | 2004-01-07 | 대한민국 | A method for preparing lignan powder, lignan powder prepared thereby and a method for preventing oxidization of meat and meat products by adding the lignan powder thereto |
-
1978
- 1978-05-10 JP JP5449978A patent/JPS54146986A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61220460A (en) * | 1985-03-27 | 1986-09-30 | Matsushita Electric Ind Co Ltd | Semiconductor device |
US4635093A (en) * | 1985-06-03 | 1987-01-06 | General Electric Company | Electrical connection |
US6420205B1 (en) | 1999-03-24 | 2002-07-16 | Kyocera Corporation | Method for producing package for housing photosemiconductor element |
JP2007094049A (en) * | 2005-09-29 | 2007-04-12 | Shinko Electric Ind Co Ltd | Cap for optical component and method of manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
JPS62581B2 (en) | 1987-01-08 |
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