JPS54146986A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPS54146986A
JPS54146986A JP5449978A JP5449978A JPS54146986A JP S54146986 A JPS54146986 A JP S54146986A JP 5449978 A JP5449978 A JP 5449978A JP 5449978 A JP5449978 A JP 5449978A JP S54146986 A JPS54146986 A JP S54146986A
Authority
JP
Japan
Prior art keywords
light transmission
frame
face
assembly
airtightness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5449978A
Other languages
Japanese (ja)
Other versions
JPS62581B2 (en
Inventor
Susumu Okikawa
Wahei Kitamura
Eiji Yamamoto
Hiroshi Tsuneno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5449978A priority Critical patent/JPS54146986A/en
Publication of JPS54146986A publication Critical patent/JPS54146986A/en
Publication of JPS62581B2 publication Critical patent/JPS62581B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To improve the light transfer characteristic of a light transmission part and airtightness by providing a sapphire plate for light transmission in the upper face or the lower face side so that a window part may be sealed and supperposing frame materials to each other and welding and sealing them to perform a low- temperature sealing.
CONSTITUTION: Base assembly 10 is provided with a ceramic base having a semiconductor chip arrangement part in the face side opposite to cap assembly 30 and bar-shaped material 20 which is fixed onto the ceramic base above while surrounding the chip arrangement part and can be welded. Then, assembly 30 is provided with frame material 31 which should be superposed to frame part 20 and can be welded and sapphire plate 34 for light transmission in the upper face or the lower side face so that the window may be enclosed, and frame materials 20 and 31 are superposed to each other and are sealed by welding. As a result, a low-temperature sealing is performed, so that the light transfer characteristic of the light transmission part and airtightness can be improved.
COPYRIGHT: (C)1979,JPO&Japio
JP5449978A 1978-05-10 1978-05-10 Package for semiconductor device Granted JPS54146986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5449978A JPS54146986A (en) 1978-05-10 1978-05-10 Package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5449978A JPS54146986A (en) 1978-05-10 1978-05-10 Package for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54146986A true JPS54146986A (en) 1979-11-16
JPS62581B2 JPS62581B2 (en) 1987-01-08

Family

ID=12972317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5449978A Granted JPS54146986A (en) 1978-05-10 1978-05-10 Package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54146986A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220460A (en) * 1985-03-27 1986-09-30 Matsushita Electric Ind Co Ltd Semiconductor device
US4635093A (en) * 1985-06-03 1987-01-06 General Electric Company Electrical connection
US6420205B1 (en) 1999-03-24 2002-07-16 Kyocera Corporation Method for producing package for housing photosemiconductor element
JP2007094049A (en) * 2005-09-29 2007-04-12 Shinko Electric Ind Co Ltd Cap for optical component and method of manufacturing same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100414185B1 (en) * 2000-10-09 2004-01-07 대한민국 A method for preparing lignan powder, lignan powder prepared thereby and a method for preventing oxidization of meat and meat products by adding the lignan powder thereto

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220460A (en) * 1985-03-27 1986-09-30 Matsushita Electric Ind Co Ltd Semiconductor device
US4635093A (en) * 1985-06-03 1987-01-06 General Electric Company Electrical connection
US6420205B1 (en) 1999-03-24 2002-07-16 Kyocera Corporation Method for producing package for housing photosemiconductor element
JP2007094049A (en) * 2005-09-29 2007-04-12 Shinko Electric Ind Co Ltd Cap for optical component and method of manufacturing same

Also Published As

Publication number Publication date
JPS62581B2 (en) 1987-01-08

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