JPS54155768A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS54155768A
JPS54155768A JP6467178A JP6467178A JPS54155768A JP S54155768 A JPS54155768 A JP S54155768A JP 6467178 A JP6467178 A JP 6467178A JP 6467178 A JP6467178 A JP 6467178A JP S54155768 A JPS54155768 A JP S54155768A
Authority
JP
Japan
Prior art keywords
cap
seam
electrode
welding process
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6467178A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6467178A priority Critical patent/JPS54155768A/en
Publication of JPS54155768A publication Critical patent/JPS54155768A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

PURPOSE: To attain complete sealing with no shift in position between a container part containing a semiconductor element and a cap part, by using both a spot- welding process and a seam-welding process at the time of the welding between the both.
CONSTITUTION: Inside of the concave part provided to alumina ceramic stem 2, semiconductor element 4 is fixed, external lead 1 is led out, and on stem surrounding element 4, alumina weld ring 5 is bonded. On it, sealing cap 7 of Kovar, 42 alloy, or nickel-plated iron is mounted via metallized layer 7; a spot electrode is pushed against the end part of cap 7 first and a current if flowed between the electrode and metallized layer 6 to form weld spots 12 at the four corners of cap 7 and ring 5. Then, the electrode is substituted by a seam weld electrode and the circumferences are seam-welded entirely in a normal method. Consequently, cap 7 never shifts in position during a seam welding process, so that the sealing will be complete.
COPYRIGHT: (C)1979,JPO&Japio
JP6467178A 1978-05-29 1978-05-29 Manufacture of semiconductor device Pending JPS54155768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6467178A JPS54155768A (en) 1978-05-29 1978-05-29 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6467178A JPS54155768A (en) 1978-05-29 1978-05-29 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS54155768A true JPS54155768A (en) 1979-12-08

Family

ID=13264869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6467178A Pending JPS54155768A (en) 1978-05-29 1978-05-29 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54155768A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551745A (en) * 1981-09-30 1985-11-05 Fujitsu Limited Package for semiconductor device
JPH0282556A (en) * 1988-09-19 1990-03-23 Toshiba Corp Sealing of hybrid ic
CN103056500A (en) * 2012-11-30 2013-04-24 北京时代民芯科技有限公司 Welding method for semiconductor ceramic shell sealing cap

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551745A (en) * 1981-09-30 1985-11-05 Fujitsu Limited Package for semiconductor device
JPH0282556A (en) * 1988-09-19 1990-03-23 Toshiba Corp Sealing of hybrid ic
CN103056500A (en) * 2012-11-30 2013-04-24 北京时代民芯科技有限公司 Welding method for semiconductor ceramic shell sealing cap

Similar Documents

Publication Publication Date Title
JPS54155768A (en) Manufacture of semiconductor device
JPS57162450A (en) Semiconductor device
NO157288C (en) USE OF SOLDER ALLOYS FOR THE WELDING OF CONTACT MATERIALS.
JPS54155767A (en) Semiconductor device
JPS5464050A (en) Soldering tool and its using method
JPS5753125A (en) Quartz resonator unit
JPS54152473A (en) Package for semiconductor device
JP2515923B2 (en) Method for sealing semiconductor device
JPS5326573A (en) Semiconductor uni t
JPS5368160A (en) Electron tube cathode and its manufacture
JPS5429568A (en) Welded electrode for sealing of semiconductor device
JPS6035240Y2 (en) Package for electronic circuits
JPS55102147A (en) Bulb
JPS56110842A (en) Manufacture of solar heat collector
JPS54161272A (en) Flat semiconductor device
JPS5610953A (en) Composite semiconductor device
JPS5768289A (en) Arc welding method
JPS5483361A (en) Sealing method of periphery device of electron tube
JPS559450A (en) Container for semiconductor device
JPS556843A (en) Semiconductor control rectifying device
JPS53120657A (en) Structure of focusing electrodes for brazing
JPS5752152A (en) Semiconductor device
JPS646562A (en) Airtight sealing
JPS56101761A (en) Airtight package for integrated circuit
JPS53103953A (en) Inert-gas shielded arc welding method